Toshiba Semiconductor and Storage TLP5751H(D4LF4,E

Overview

TLP5751H(D4LF4,E) from Toshiba Electronic Devices & Storage Corporation is a 6-pin SO6L surface-mount photocoupler integrating an infrared LED and high-speed photo IC output stage with totem-pole (buffer logic) configuration. It delivers ±1.0 A peak output current, 150 ns max propagation delay, ±35 kV/µs common-mode transient immunity, and 5000 Vrms isolation voltage for IGBT/MOSFET gate driving in industrial inverters and home appliance motor control systems.

For engineers reviewing the TLP5751H(D4LF4,E) datasheet, TLP5751H(D4LF4,E) pinout, TLP5751H(D4LF4,E) application, or TLP5751H(D4LF4,E) equivalent, this device supports rail-to-rail output operation, reinforced insulation per EN IEC 60747-5-5 (D4 option), and operates across –40 °C to +125 °C with 15–30 V supply voltage and ≤4 mA threshold input current.

Technical Context

The TLP5751H(D4LF4,E) implements a monolithic photodetector IC with internal Faraday shield and integrated high-gain amplifier, enabling guaranteed CMRI of ±35 kV/µs at 25 °C. Its totem-pole output stage provides rail-to-rail VO swing between VCC and GND, eliminating external pull-up resistors and supporting direct connection to power device gates.

It requires a 1 µF ceramic bypass capacitor between pins 6 (VCC) and 4 (GND), placed within 1 cm of the pins, to stabilize high-gain linear amplification and ensure reliable switching. The device is rated for reinforced insulation and meets UL 1577, CSA Component Acceptance, and VDE EN IEC 60747-5-5 (with D4 option) safety standards.

Key Specifications

Pinout & Package

Package: 6-pin SO6L (Toshiba package code 11-4N101A), surface-mount, lead-forming option LF4, creepage/clearance ≥8.0 mm, isolation thickness ≥0.4 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed, high-current photocoupler gate driver applications.

Compared with TLP5751H(D4LF4,E), the D4TP4 variant offers identical performance in tape format for SMT scalability, while ACPL-332J-500E trades drive strength and safety certification for lower cost in less demanding applications.

Availability

TLP5751H(D4LF4,E) is available at Aetrix Electronics and suitable for industrial inverters, MOSFET/IGBT gate driving, and air conditioner inverter systems requiring stable component supply, safety-certified isolation, and high-temperature operational continuity.

Supply support for TLP5751H(D4LF4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor components, with global R&D centers and ISO/TS 16949-certified manufacturing facilities.

The TLP5751H series belongs to Toshiba's high-speed photocoupler product line, engineered specifically for robust, safety-compliant gate driving in industrial motor control and home appliance inverters.

FAQ

What is the required bypass capacitor for TLP5751H(D4LF4,E) and where must it be placed?

A 1 µF ceramic capacitor must be connected between pin 6 (VCC) and pin 4 (GND) for stable operation of the internal high-gain amplifier. Per the datasheet, this capacitor must be placed within 1 cm of those pins on the PCB to minimize inductance and prevent oscillation or improper switching behavior in the TLP5751H(D4LF4,E). Failure to observe this requirement may result in unreliable gate drive output.

Does TLP5751H(D4LF4,E) support direct connection to IGBT gates without external components?

Yes, the TLP5751H(D4LF4,E) supports direct IGBT gate connection due to its ±1.0 A peak output current, rail-to-rail VO swing, and integrated totem-pole output stage. It eliminates the need for external gate resistors or buffer transistors in most 600–1200 V, ≤50 A IGBT applications. However, a gate resistor (typically 10–33 Ω) is still recommended for EMI control and dV/dt limiting in the TLP5751H(D4LF4,E) application circuit.

What safety certifications apply to TLP5751H(D4LF4,E)?

The TLP5751H(D4LF4,E) carries the D4 option, certifying it to EN IEC 60747-5-5 for reinforced insulation. It is also UL-recognized (UL 1577, File No. E67349), cUL-recognized (CSA 5A File No. E67349), and CQC-approved (GB4943.1). These certifications validate its suitability for safety-critical isolation in mains-connected equipment without supplemental insulation barriers.

What is the meaning of "LF4" in TLP5751H(D4LF4,E)?

"LF4" denotes the lead-forming option specified in the Toshiba ordering nomenclature for TLP5751H(D4LF4,E). It indicates wide-forming leads optimized for manual or semi-automatic insertion and magazine-style packaging (125 pcs per tube). LF4 does not affect electrical performance but defines mechanical handling and packaging format - distinct from TP4 (tape-and-reel) variants.

Can TLP5751H(D4LF4,E) operate reliably at 125 °C ambient temperature?

Yes, the TLP5751H(D4LF4,E) is fully specified and guaranteed over –40 °C to +125 °C ambient temperature, including all key parameters: propagation delay (≤150 ns), output current (±1.0 A), and CMRI (≥±35 kV/µs). This rating is validated per Toshiba's qualification testing and makes the TLP5751H(D4LF4,E) suitable for sealed, high-temperature environments such as compressor compartments and enclosed inverter housings.