Toshiba Semiconductor and Storage TLP5752H(LF4,E

Overview

TLP5752H(LF4,E) from Toshiba Electronic Devices & Storage Corporation is a high-speed, rail-to-rail output photocoupler with integrated photodetector and infrared LED in a 6-pin SO6L package. It delivers ±2.5 A peak output current, 150 ns max propagation delay, ±35 kV/µs common-mode transient immunity, and 5000 Vrms isolation voltage-designed for driving IGBTs and MOSFETs in industrial inverters and home appliance motor control systems.

For engineers reviewing the TLP5752H(LF4,E) datasheet, TLP5752H(LF4,E) pinout, TLP5752H(LF4,E) application, or TLP5752H(LF4,E) equivalent, key selection criteria include guaranteed CMOS-compatible totem-pole output drive, reinforced insulation compliance (UL, cUL, VDE EN IEC 60747-5-5), -40°C to +125°C operation, and lead-forming option LF4 for surface-mount compatibility.

Technical Context

The TLP5752H(LF4,E) integrates an infrared LED coupled to a high-gain, high-speed photo IC with internal Faraday shield-enabling ±35 kV/µs common-mode transient immunity. Its totem-pole output stage provides rail-to-rail logic-level switching (VOH ≥ 12.1 V, VOL ≤ 0.2 V at VCC = 15 V) without external pull-up resistors.

It operates across 15–30 V supply range with 4 mA max threshold input current and supports up to 50 kHz switching frequency. A mandatory 1 µF ceramic bypass capacitor between pins 6 (VCC) and 4 (GND) ensures stable high-gain amplifier operation and prevents misfiring under fast transients.

Key Specifications

Pinout & Package

Package: 6-pin SO6L (Toshiba package code 11-4N101A), surface-mount, lead-forming option LF4, creepage/clearance ≥8.0 mm, isolation thickness ≥0.4 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar photocoupler-based gate driver applications.

Compared with ACPL-332J-500E and SI8271BD-D-IS, the TLP5752H(LF4,E) uniquely combines certified reinforced insulation, internal Faraday shielding, and self-contained LED+driver architecture-making it optimal for cost-sensitive, safety-critical 15–50 kHz industrial and appliance inverters where layout simplicity and regulatory compliance are primary.

Availability

TLP5752H(LF4,E) is available at Aetrix Electronics and suitable for industrial inverters, MOSFET/IGBT gate drivers, and induction cooktop control systems requiring stable component supply, long lifecycle support, and RoHS-compliant sourcing.

Supply support for TLP5752H(LF4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and optoelectronics, with global manufacturing and quality certification infrastructure.

The TLP5752H(LF4,E) belongs to Toshiba's high-speed photocoupler product line, engineered specifically for robust, safety-certified gate driving in industrial motor control and home appliance inverters demanding high CMTI and extended temperature operation.

FAQ

What is the maximum recommended operating temperature for the TLP5752H(LF4,E)?

The TLP5752H(LF4,E) is rated for continuous operation from −40°C to +125°C ambient temperature. Its internal photodetector and output stage maintain specified performance-including ±2.5 A peak output current and 150 ns propagation delay-across this full range. Derating is not required up to 125°C, making it suitable for enclosed inverter modules and outdoor HVAC units where thermal management is constrained. The device's 150°C maximum junction temperature provides design margin under typical PCB power dissipation.

Does the TLP5752H(LF4,E) require an external bypass capacitor, and if so, what value and placement?

Yes, the TLP5752H(LF4,E) requires a 1 µF ceramic capacitor connected between pin 6 (VCC) and pin 4 (GND). This capacitor must be placed within 1 cm of those pins to stabilize the high-gain linear amplifier inside the photodetector and prevent oscillation or misfiring during fast switching. Failure to install this capacitor may result in erratic output behavior, especially under high dV/dt conditions. X7R or better dielectric is recommended for temperature stability across −40°C to +125°C.

What safety certifications does the TLP5752H(LF4,E) hold, and which standards do they cover?

The TLP5752H(LF4,E) holds UL recognition (UL 1577, File No. E67349), cUL recognition (CSA Component Acceptance Service No. 5A, File No. E67349), and VDE approval to EN IEC 60747-5-5 and EN IEC 62368-1. These certifications validate its reinforced insulation structure, including minimum 8.0 mm creepage/clearance and 0.4 mm internal isolation thickness. For VDE-compliant designs, the D4 option variant (e.g., TLP5752H(D4TP4,E)) must be selected-the base TLP5752H(LF4,E) is UL/cUL certified but not VDE-approved unless ordered with D4.

Can the TLP5752H(LF4,E) drive both IGBTs and MOSFETs directly, and what is the maximum gate capacitance it supports?

Yes, the TLP5752H(LF4,E) can directly drive both IGBTs and N-channel MOSFETs thanks to its ±2.5 A peak output current and rail-to-rail totem-pole output stage. At 15 V supply and 125°C, it delivers ≥2.5 A sink/source capability for ≤90 ns pulses-supporting gate charges up to ~250 nC. This enables direct drive of medium-power devices like 600 V/30 A IGBTs (e.g., GT30J321) or 100 V/100 A MOSFETs (e.g., CSD19536KTT) without external buffer stages, reducing component count and propagation delay uncertainty.

What is the purpose of pin 2 (N.C.) on the TLP5752H(LF4,E), and how should it be handled on the PCB?

Pin 2 on the TLP5752H(LF4,E) is a no-connect (N.C.) terminal with no internal bond wire or circuit connection. It must remain unconnected on the PCB-neither routed nor soldered-to avoid mechanical stress or unintended coupling. The land pattern should omit copper for pin 2, and the stencil aperture should exclude it. This design choice maintains isolation integrity and avoids compromising the 8.0 mm creepage distance between input (pins 1–3) and output (pins 4–6) sides of the SO6L package.