Infineon Technologies TLS850B0TEV33ATMA1

Overview

TLS850B0TEV33 from Infineon Technologies is a high-performance automotive-grade low-dropout linear voltage regulator in PG-TO252-5 package, delivering a fixed 3.3 V output with ±2% accuracy, supporting up to 500 mA load current, and operating across 3.0 V–40 V input range-enabling reliable operation during automotive cranking conditions.

For engineers reviewing the TLS850B0TEV33 datasheet, TLS850B0TEV33 pinout, TLS850B0TEV33 application, or TLS850B0TEV33 equivalent, key selection criteria include dropout voltage at 100 mA (120 mV typ), quiescent current (20 µA typ), enable control logic, thermal shutdown behavior, and ceramic capacitor stability with 1 µF output capacitance.

Technical Context

The TLS850B0TEV33 implements a bandgap-referenced error amplifier with integrated current limiting and thermal shutdown circuitry, enabling robust protection against output short-to-GND, overcurrent, and junction temperature exceeding 150 °C. Its loop architecture balances fast transient response and high phase margin for stable regulation under dynamic loads.

It operates in extended input range mode down to 3.0 V, allowing regulated 3.3 V output even when input drops below nominal battery voltage-critical for cold-crank scenarios where battery voltage falls to ~3.5 V. The EN pin features an internal pull-down resistor, requiring only a logic-high signal (≥2.0 V) to activate regulation.

Key Specifications

Pinout & Package

Package: PG-TO252-5 (DPAK-5), thermally enhanced with exposed heat slug connected to GND. Pin 1 (I) accepts input voltage; Pin 2 (EN) controls on/off state; Pin 3 (GND) and Pin 5 (Q) are functional ground and output terminals; Pin 4 is not connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV73333PDBVR and MAX1725EUT33+T, TLS850B0TEV33 uniquely combines AEC-Q100 Grade 1 qualification, 40 V input tolerance, 500 mA capability, and enable control in a thermally robust DPAK package-making it the sole fit for demanding automotive cranking and load-dump environments.

Availability

TLS850B0TEV33 is available at Aetrix Electronics and suitable for automotive body electronics, ADAS sensor hubs, telematics control units, and infotainment power sequencing requiring stable component supply across extended temperature and voltage extremes.

Supply support for TLS850B0TEV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification infrastructure.

This device belongs to the OPTIREG™ linear family, designed specifically for robust, low-noise, high-reliability voltage regulation in automotive power domains-including always-on, cranking-tolerant, and safety-critical subsystems.

FAQ

What is the minimum input voltage required to maintain 3.3 V output regulation?

The TLS850B0TEV33 supports extended operation down to 3.0 V input. Below this threshold, output voltage drops linearly with input. At 100 mA load, regulation is maintained as long as input remains ≥3.42 V (3.3 V + 120 mV dropout). This enables reliable function during cold-crank events where battery voltage dips to ~3.5 V.

Can the device operate without an enable signal connected?

Yes-the EN pin has an internal pull-down resistor, so the device powers up enabled by default when EN is left unconnected or tied to GND. To disable, apply a logic-high signal ≥2.0 V to EN; pulling EN below 0.8 V forces shutdown with <1 µA quiescent current.

Is an input capacitor mandatory, and what value is recommended?

An input capacitor is strongly recommended: a 100 nF ceramic capacitor placed close to Pin 1 (I) and Pin 3 (GND) suppresses high-frequency line noise and improves transient response. Larger bulk capacitance (e.g., 10 µF) may be added upstream if long traces or high-impedance sources exist-but 100 nF is the minimum effective decoupling per datasheet guidance.

How does thermal performance vary with PCB layout?

Thermal resistance to ambient (R_thJA) ranges from 26 K/W (2-layer board with thermal vias) to 85 K/W (single-layer board, no heatsink). With 600 mm² copper heatsink area on 1-layer PCB, R_thJA improves to 36 K/W-allowing 500 mA continuous output at +85 °C ambient. Proper soldering of the exposed heat slug to GND plane is essential for rated performance.