Texas Instruments TLV1117-18CDCYRG3

Overview

TLV1117-18CDCYRG3 from Texas Instruments is a fixed-output, 1.8 V, 800 mA low-dropout linear voltage regulator in a 4-pin SOT-223 (DCY) package. It operates from 3.2 V to 15 V input, delivers ±1.0% output accuracy at 25°C, features 0.8 V dropout at 800 mA (new chip), and integrates foldback current limit, thermal shutdown, UVLO, and internal soft-start for stable power delivery in space-constrained industrial control modules.

For engineers reviewing the TLV1117-18CDCYRG3 datasheet, TLV1117-18CDCYRG3 pinout, TLV1117-18CDCYRG3 application, or TLV1117-18CDCYRG3 equivalent, key selection considerations include its 0.8 V dropout at full load, 65 µA quiescent current in shutdown, 70 dB ripple rejection at 120 Hz, and compatibility with low-ESR ceramic output capacitors - all critical for low-noise, high-reliability 1.8 V rail generation in motor drive logic and smart metering systems.

Technical Context

The TLV1117-18CDCYRG3 implements a CMOS-based LDO architecture with an internal 1.25 V bandgap reference and error amplifier driving a PMOS pass transistor. Its fixed 1.8 V output is achieved via precision laser-trimmed resistors, eliminating external feedback components and reducing layout sensitivity.

It incorporates four integrated protection mechanisms: undervoltage lockout (UVLO) with 2.2 V rising threshold and 130 mV hysteresis, foldback current limiting (ICL = 1.1–1.6 A, ISC = 150–350 mA), thermal shutdown at 180°C with 20°C hysteresis, and internal output pulldown (0.7–1.1 mA) to discharge VOUT during disable.

Key Specifications

Pinout & Package

TLV1117-18CDCYRG3 uses the 4-pin SOT-223 (DCY) package with exposed thermal pad (pin 4). The package measures 6.5 mm × 7 mm and provides moderate thermal performance suitable for surface-mount industrial designs without heatsinks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS850F2ELVSA1 and AP2204K-18W5, TLV1117-18CDCYRG3 uniquely balances 800 mA capability, integrated protection (UVLO, foldback, thermal shutdown), and industrial temperature range (–40°C to 125°C) in a standard SOT-223 footprint - making it optimal for robust, medium-power embedded systems without automotive overhead.

Availability

TLV1117-18CDCYRG3 is available at Aetrix Electronics and suitable for motor drive logic power, smart meter microcontroller supply, HVAC sensor interface, and home theater audio DSP core applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV1117-18CDCYRG3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management IC design and manufacturing.

The TLV1117 product line delivers cost-effective, thermally robust LDO regulators optimized for industrial, metering, and consumer electronics applications demanding high reliability, low noise, and integrated fault protection.

FAQ

What is the minimum input voltage required for TLV1117-18CDCYRG3 to maintain regulation?

The TLV1117-18CDCYRG3 requires a minimum input voltage of 2.6 V to maintain 1.8 V output regulation at full 800 mA load, based on its 0.8 V dropout specification. At lighter loads, the required VIN decreases proportionally - e.g., 2.3 V suffices at 100 mA. Input below 2.2 V triggers UVLO, disabling output until VIN rises above 2.4 V.

Does TLV1117-18CDCYRG3 require an external capacitor on the ADJ pin?

No, TLV1117-18CDCYRG3 does not require an external capacitor on the ADJ pin because it is a fixed-output variant - pin 1 is internally connected to GND and functions solely as the ground terminal. External capacitors are only needed on INPUT (≥1 µF ceramic) and OUTPUT (≥10 µF low-ESR ceramic) pins per the datasheet recommendations.

How does the foldback current limit behave during a short-circuit event on TLV1117-18CDCYRG3?

During a short-circuit, TLV1117-18CDCYRG3 initially limits output current to 1.1–1.6 A (brick-wall phase), then transitions to foldback mode when VOUT drops below 0.9×1.8 V = 1.62 V. At hard short (VOUT ≈ 0 V), it delivers 150–350 mA (ISC), reducing power dissipation and preventing thermal runaway while maintaining device integrity until fault clearance.

Can TLV1117-18CDCYRG3 be used with ceramic output capacitors?

Yes, TLV1117-18CDCYRG3 is fully compatible with ceramic output capacitors. The new-chip design specifies a maximum ESR of 500 mΩ and recommends ≥10 µF low-ESR X7R/X5R MLCCs placed within 5 mm of the OUTPUT pin. This eliminates need for tantalum or aluminum electrolytic capacitors, reducing size and improving reliability.

What is the thermal shutdown behavior of TLV1117-18CDCYRG3 under sustained overload?

TLV1117-18CDCYRG3 activates thermal shutdown at 180°C junction temperature and resets at 160°C (20°C hysteresis). Under sustained overload, it cycles between active regulation and shutdown - dissipating heat during on-phase and cooling during off-phase. To avoid cycling, ensure PCB copper area meets RθJA = 95.4°C/W spec or add thermal relief vias under the exposed pad.