Texas Instruments TLV172IDR

Overview

TLV172IDR from Texas Instruments is a single-channel, 36-V, rail-to-rail output operational amplifier with EMI hardening, 10 MHz gain bandwidth, 10 V/μs slew rate, and ±1 μV/°C offset drift - designed for precision signal conditioning in high-voltage, low-noise industrial sensor interfaces and ADC driver stages.

For engineers reviewing the TLV172IDR datasheet, TLV172IDR pinout, TLV172IDR application, or TLV172IDR equivalent, key selection criteria include its 4.5–36 V supply range, 9 nV/√Hz input voltage noise at 1 kHz, 116 dB typical CMRR, ability to operate with inputs 100 mV below V− and within 2 V of V+, and stability with up to 300 pF capacitive loads.

Technical Context

The TLV172IDR uses a P-channel input stage enabling rail-to-rail common-mode input down to V− − 0.1 V and robust phase-reversal immunity - input overdrive beyond the linear range clamps output to the appropriate rail instead of inverting. Its fully differential second-stage architecture supports high PSRR (120 dB typical) and low THD+N (0.0002% at 1 kHz).

Designed for single- or dual-supply operation across –40°C to +125°C, the device maintains 1.6 mA quiescent current per amplifier and delivers 70 mV output swing from rail (at 10 kΩ, 25°C) while driving capacitive loads up to 300 pF without external compensation.

Key Specifications

Pinout & Package

TLV172IDR is packaged in an 8-pin SOIC (D package), 4.90 mm × 3.91 mm body size, with exposed pad not present and standard JEDEC-compliant lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar operational amplifier applications.

Compared with OPA192IDR and LM7321MAX/NOPB, TLV172IDR uniquely balances EMI resilience, 36-V operation, low noise, and low drift - making it optimal for automotive battery monitors and medical ultrasound where both precision and robustness are non-negotiable.

Availability

TLV172IDR is available at Aetrix Electronics and suitable for TFT-LCD driver circuits, industrial ADC front-ends, and HEV/EV battery monitoring systems requiring stable component supply across extended temperature and long production lifecycles.

Supply support for TLV172IDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of op amp innovation and automotive-grade qualification expertise.

The TLVx172 product line was engineered for cost-sensitive, high-reliability systems demanding wide supply range, EMI resilience, and precision performance - targeting industrial automation, medical imaging, and electric vehicle subsystems.

FAQ

What is the maximum capacitive load the TLV172IDR can drive without oscillation?

The TLV172IDR is specified stable with capacitive loads up to 300 pF when configured as a unity-gain buffer. This capability eliminates the need for external isolation resistors in ADC driver or filter interface applications. Performance remains within datasheet limits for overshoot (<5%) and settling time (≤3.2 μs to 0.01%) under these conditions. For loads exceeding 300 pF, a series resistor (typically 10–50 Ω) between TLV172IDR output and the capacitor is recommended to maintain phase margin.

Does the TLV172IDR support true rail-to-rail input operation?

The TLV172IDR supports input common-mode voltage from V− − 0.1 V up to V+ − 2 V for full-spec performance. It can accept inputs up to V+ (i.e., 100 mV beyond V+) but with degraded parameters including increased offset voltage and reduced CMRR. The device does not provide full rail-to-rail input - the upper 2 V near V+ is a limited-performance region explicitly defined in the datasheet. For designs requiring full V− to V+ input range, a different amplifier family must be selected.

What is the thermal resistance (RθJA) of the TLV172IDR in SOIC-8 package?

The TLV172IDR in SOIC-8 (D package) has a junction-to-ambient thermal resistance (RθJA) of 126.5°C/W under standard JEDEC JESD51-7 2S2P board conditions. This value assumes 1-inch² copper area on top and bottom layers with two internal planes. In compact layouts with minimal copper, actual RθJA may exceed 150°C/W - derating above 1.6 mA quiescent current requires careful thermal analysis. The device operates reliably from –40°C to +125°C ambient when power dissipation stays within safe limits.

How does the TLV172IDR handle input overvoltage beyond the supply rails?

The TLV172IDR incorporates internal phase-reversal protection: when input voltage exceeds the linear common-mode range (e.g., >V+ − 2 V), the output saturates toward the appropriate supply rail instead of inverting polarity. This behavior prevents latch-up or erroneous control signals in fault conditions such as sensor disconnect or wiring shorts. Input pins tolerate transient overvoltage up to (V−) − 0.5 V and (V+) + 0.5 V per absolute maximum ratings, but sustained current must be limited to ≤10 mA via external series resistors.

Is the TLV172IDR suitable for single-supply operation at 5 V?

Yes - the TLV172IDR is fully specified from 4.5 V to 36 V single-supply operation. At 5 V, it delivers rail-to-rail output swing (within 70 mV of 0 V and 5 V), 10 MHz gain bandwidth, and 9 nV/√Hz noise, making it ideal for portable instrumentation and low-voltage data loggers. Quiescent current remains 1.6 mA, and input common-mode range extends from –0.1 V to +3 V, allowing direct interfacing with 0–3.3 V microcontroller DACs or sensors referenced to the same 5 V rail.