Texas Instruments TLV2314IDGKR

Overview

TLV2314IDGKR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, precision signal conditioning in battery-powered and industrial sensing systems. It delivers 3 MHz gain-bandwidth, 1.5 V/µs slew rate, ±0.75 mV typical offset voltage, 1 pA typical input bias current, and operates from 1.8 V to 5.5 V supply - enabling high-accuracy sensor front-ends in portable blood glucose meters and remote sensing nodes.

For engineers reviewing the TLV2314IDGKR datasheet, TLV2314IDGKR pinout, TLV2314IDGKR application, or TLV2314IDGKR equivalent, this page provides verified electrical specifications, VSSOP-8 package details, dual-channel functional context, EMI-hardened design validation, and real-world implementation guidance for low-voltage, low-noise analog signal chains.

Technical Context

The TLV2314IDGKR implements a complementary differential input stage enabling rail-to-rail common-mode operation (–0.2 V to V_S + 0.2 V), with internal RF/EMI filtering tuned to 80 MHz (–3 dB) to suppress conducted interference from wireless modules and switching regulators. Its class AB output stage drives ≥10 kΩ loads while maintaining ≤5 mV rail-to-rail swing at 25°C.

Designed for unity-gain stability, it supports capacitive loads up to 300 pF without external compensation and exhibits no phase reversal under overdrive. The device is specified across –40°C to +125°C and achieves 72–96 dB CMRR and 100 dB channel separation at DC - critical for dual-channel differential measurements in industrial automation interfaces.

Key Specifications

Pinout & Package

VSSOP-8 (DGK) package: 3.00 mm × 3.00 mm body, 0.65 mm lead pitch, exposed thermal pad optional. Designed for high-density PCB layouts with minimal thermal resistance (R_θJA = 191.2°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel, low-power, rail-to-rail op-amp applications.

Compared with MCP6022-I/SN and OPA2333AIDGKR, TLV2314IDGKR offers the best balance of EMI resilience, rail-to-rail performance at 1.8 V, and ultra-low input bias - making it uniquely suited for unshielded, battery-operated medical and industrial sensors where RF immunity and high-impedance interfacing are concurrent requirements.

Availability

TLV2314IDGKR is available at Aetrix Electronics and suitable for portable medical diagnostics, remote environmental monitoring, and industrial I/O modules requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for TLV2314IDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 50 years of innovation in precision amplifiers and low-power signal chain solutions.

The TLV2314IDGKR belongs to TI's TLVx314 family - engineered specifically for battery-constrained, EMI-prone applications such as point-of-care diagnostics and wireless sensor nodes where rail-to-rail operation, nanoamp input bias, and integrated RF filtering are essential.

FAQ

What is the maximum capacitive load the TLV2314IDGKR can drive stably in unity-gain configuration?

The TLV2314IDGKR remains unity-gain stable with pure capacitive loads up to 300 pF, as confirmed in the datasheet's Typical Characteristics (Figure 8). For loads exceeding this - such as ADC input capacitance plus PCB trace capacitance - a 10-Ω to 20-Ω series resistor at the output is recommended to suppress overshoot. This technique is validated in the device's Application and Implementation section and preserves stability without requiring complex compensation networks. TLV2314IDGKR's internal architecture avoids phase reversal even under overload, ensuring predictable behavior during transient events.

Does the TLV2314IDGKR support true single-supply operation down to 1.8 V?

Yes, TLV2314IDGKR is fully specified and production-tested from 1.8 V to 5.5 V single supply (or ±0.9 V to ±2.75 V dual supply). Its rail-to-rail input extends 0.2 V beyond both rails, and output swings within 5 mV of each rail under 10-kΩ load at 1.8 V - enabling direct interface with low-voltage ADCs and microcontrollers without level-shifting. All key parameters including offset voltage, CMRR, and GBW are guaranteed across this range, with no degradation in performance at minimum supply.

How does the internal EMI filter in TLV2314IDGKR improve system-level immunity?

The TLV2314IDGKR integrates a dedicated low-pass filter on both input pins with ~80 MHz –3-dB cutoff and 20 dB/decade roll-off, specifically designed to attenuate RF energy from 10 MHz to 6 GHz - including GSM, Wi-Fi, and Bluetooth bands. Measured EMIRR IN+ exceeds 60 dB at 900 MHz, preventing rectified DC offset shifts that would corrupt sensor readings. This eliminates the need for external RC filters or ferrite beads in space-constrained designs like handheld medical devices, where TLV2314IDGKR is commonly deployed.

What is the channel-to-channel isolation performance of TLV2314IDGKR at DC and high frequency?

TLV2314IDGKR provides 100 dB channel separation at DC, measured per the datasheet's Electrical Characteristics table. At 1 MHz, isolation remains >80 dB (Figure 12), confirming minimal crosstalk between amplifier A and B - critical for dual-path applications like I/Q demodulation or differential bridge sensing. This performance is enabled by TI's proprietary dual-die VSSOP layout and substrate isolation, not shared bias networks, ensuring independent operation even under mismatched loading conditions.

Can TLV2314IDGKR operate reliably in automotive cabin ambient temperature ranges?

Yes, TLV2314IDGKR is characterized and guaranteed over –40°C to +125°C, meeting extended industrial temperature requirements applicable to automotive cabin environments (e.g., HVAC sensors, infotainment microphones, seat occupancy detection). Thermal metrics confirm R_θJA = 191.2°C/W for the VSSOP-8 package, and all specifications - including 1-pA input bias and 3-MHz GBW - are validated across this range. No derating is required for operation at full specification within this envelope.