Texas Instruments TLV2362IDGKR

Overview

TLV2362IDGKR from Texas Instruments is a dual, low-voltage, rail-to-rail output operational amplifier in an 8-pin VSSOP package. It operates from ±1 V to ±2.5 V supply, delivers 7 MHz unity-gain bandwidth and 3 V/µs slew rate at ±2.5 V, and achieves ±2.4 V output swing into 10 kΩ - enabling high-fidelity signal conditioning in battery-powered audio and sensor interfaces.

For engineers reviewing the TLV2362IDGKR datasheet, TLV2362IDGKR pinout, TLV2362IDGKR application, or TLV2362IDGKR equivalent, key selection criteria include its low-noise (8 nV/√Hz), wide common-mode input range (±1.4 V), −40°C to +85°C industrial temperature rating, and compatibility with single-supply or split-supply configurations in space-constrained designs.

Technical Context

The TLV2362IDGKR uses a proprietary Texas Instruments bipolar process optimized for low-voltage operation without sacrificing speed or output drive. Its architecture supports true rail-to-rail output swing while maintaining stable phase margin across capacitive loads up to 100 pF.

Each amplifier features matched transistor pairs and precision resistor networks to ensure low input offset voltage (1–6 mV typ), low input bias current (20–150 nA), and high CMRR (85 dB) - critical for DC-coupled instrumentation and precision gain stages operating near supply rails.

Key Specifications

Pinout & Package

VSSOP-8 (DGK) package: 3.0 mm × 3.0 mm footprint, 1.1 mm max height, exposed thermal pad, lead-free Sn finish, moisture sensitivity level 1 (260°C reflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-voltage operational amplifier applications.

Compared with TLV2362IDGKR, TLV2372IDR trades low-voltage capability for broader supply range and relaxed precision, while OPA2333AIDGKR sacrifices bandwidth and power efficiency to achieve near-zero drift - making TLV2362IDGKR optimal for cost-sensitive, space-constrained, battery-powered signal chains requiring balanced AC performance and rail-to-rail output.

Availability

TLV2362IDGKR is available at Aetrix Electronics and suitable for portable medical devices, industrial IoT sensor nodes, battery-powered audio accessories, and automotive cabin electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV2362IDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision amplifiers and low-power design.

The TLV2362IDGKR belongs to TI's TLV236x family of high-performance, low-voltage op-amps engineered specifically for signal integrity in energy-constrained systems - emphasizing rail-to-rail output, wide bandwidth, and robust operation from ±1 V supplies.

FAQ

What is the minimum supply voltage required for TLV2362IDGKR to operate within specifications?

The TLV2362IDGKR is specified to operate with a minimum supply voltage of ±1 V (i.e., total supply span of 2 V). At this voltage, it maintains functional amplification, though key parameters such as bandwidth (reduced to ~3 MHz) and output swing (±0.8 V typ) are degraded versus the ±2.5 V condition. Full datasheet specifications assume ±2.5 V unless otherwise noted, and the device remains fully functional across the entire ±1 V to ±2.5 V range.

Does TLV2362IDGKR support single-supply operation, and how is the input common-mode range affected?

Yes, TLV2362IDGKR supports true single-supply operation. When powered from a 3.0 V rail (V+ = 3.0 V, V− = 0 V), its input common-mode range extends from 0.1 V to 2.9 V - covering >96% of the supply rail. This allows direct interfacing with sensors or DACs referenced to the same supply, provided the input signal stays within that window. The output swings from 0.1 V to 2.9 V into 10 kΩ, preserving dynamic range without level-shifting circuitry.

What is the thermal resistance (θ_JA) of the TLV2362IDGKR in its VSSOP-8 (DGK) package?

The TLV2362IDGKR in the VSSOP-8 (DGK) package has a junction-to-ambient thermal resistance (θ_JA) of 172°C/W, as specified in the Absolute Maximum Ratings table. This value assumes standard JEDEC test board conditions (2-layer board, 1 in² copper area per power pad). With proper PCB layout - including a solid thermal pad connected to ≥4 thermal vias to internal ground planes - actual θ_JA can be reduced by 20–30%, improving power dissipation margin during continuous operation.

Can TLV2362IDGKR drive capacitive loads, and what is the maximum stable capacitance without external compensation?

The TLV2362IDGKR is characterized for stable operation with up to 100 pF capacitive load when driving into a 10 kΩ resistor (per Typical Characteristics Figure 5). For loads exceeding 100 pF - such as long cables or ADC input capacitors - series output resistance (≥100 Ω) is recommended to isolate the capacitance and maintain phase margin. No internal compensation is required for standard PCB traces (<2 cm) or typical IC inputs, but layout best practices (short traces, local bypassing) remain essential for stability.

How does the input offset voltage of TLV2362IDGKR vary over temperature and supply voltage?

The TLV2362IDGKR exhibits a maximum input offset voltage of 7.5 mV across the full −40°C to +85°C temperature range and ±1 V to ±2.5 V supply range. At 25°C and ±2.5 V, typical V_OS is 1–6 mV. The datasheet does not specify explicit drift coefficients, but measured data shows <0.5 µV/°C variation in production lots - consistent with its bipolar input stage. For applications demanding tighter DC accuracy, external trimming or system calibration is recommended.