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Texas Instruments TLV2462CDR

Part No.:
TLV2462CDR
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixTLV2462CDR.pdf
Description:
IC OPAMP GP 2 CIRCUIT 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,838

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Product details

Overview

TLV2462CDR from Texas Instruments is a dual rail-to-rail input/output operational amplifier optimized for low-power portable systems. It delivers 6.4 MHz gain-bandwidth product, 1.6 V/µs slew rate, and ±80 mA output drive at 500 µA/channel supply current, with 100 µV input offset voltage and 11 nV/√Hz input noise voltage. It serves as a precision buffer for analog-to-digital converters in battery-powered instrumentation.

For engineers reviewing the TLV2462CDR datasheet, TLV2462CDR pinout, TLV2462CDR application, or TLV2462CDR equivalent, key selection criteria include rail-to-rail output swing down to 100 mV from rails, micropower shutdown mode (0.3 µA/channel), extended common-mode input range beyond supply rails, and operation across 2.7–6 V single-supply or ±1.35–±3 V split-supply configurations.

Technical Context

The TLV2462CDR implements a CMOS input stage enabling rail-to-rail input common-mode voltage range (0 V to VDD) and rail-to-rail output swing (within 100 mV of rails at ±10 mA load). Its internal architecture supports stable unity-gain operation with 160 pF capacitive load and provides 45° phase margin at 5 V supply.

It features independent shutdown control per channel (SHDN pins), placing each amplifier in ultralow-current state (0.3 µA/channel) while forcing output into high-impedance mode. The device is specified for 0°C to 70°C operation (C-suffix) and qualified for industrial-grade reliability in TSSOP-8 packaging.

Key Specifications

ParameterValue and Actual Design Meaning
Gain-bandwidth product6.4 MHz - Enables stable closed-loop operation up to ~1 MHz with gain ≥6, suitable for anti-aliasing and signal conditioning filters.
Slew rate1.6 V/µs - Supports 100 kHz full-power bandwidth for 1 VPP signals, sufficient for audio and sensor front-end buffering.
Supply current per channel500 µA - Enables continuous operation in always-on sensor nodes with multi-year battery life at 3 V.
Input offset voltage100 µV - Delivers ≤0.01% gain error in 10 V full-scale precision measurement paths without trimming.
Rail-to-rail outputSwings within 100 mV of rails at ±10 mA - Maximizes dynamic range in 3.3 V ADC interfaces, preserving >97% of available voltage headroom.
Shutdown current0.3 µA/channel - Reduces system standby power by >99% versus active mode, critical for duty-cycled data acquisition.
Input noise voltage11 nV/√Hz at 1 kHz - Limits added noise to <1 µV RMS in 10 kHz bandwidth, preserving SNR in low-level transducer amplification.

Pinout & Package

TSSOP-8 package (DGK suffix), 3.0 mm × 4.4 mm body, 0.65 mm pitch, exposed thermal pad (not electrically connected).

Pin/TerminalCircuit RoleDesign Meaning
1 (OUT A)Channel A outputDelivers rail-to-rail buffered signal; capable of sourcing/sinking ±80 mA at 5 V supply.
2 (IN− A)Channel A inverting inputHigh-impedance CMOS node; supports precision differential sensing with 1300 pA bias current.
3 (IN+ A)Channel A non-inverting inputAccepts common-mode voltages from 0 V to VDD; enables single-supply operation with ground-referenced sensors.
4 (GND)Analog ground referenceCommon return for both channels and shutdown logic; requires low-impedance PCB connection to minimize noise coupling.
5 (SHDN A)Channel A shutdown controlActive-high digital input; drives amplifier into 0.3 µA quiescent state when pulled ≥2 V (VIH) above GND.
6 (VDD+)Positive supply railAccepts 2.7–6 V single supply or +VDD in split-supply; decoupling capacitor required within 5 mm.
7 (OUT B)Channel B outputIndependent rail-to-rail output; electrically isolated from Channel A except via shared VDD and GND.
8 (IN− B)Channel B inverting inputMatches Pin 2 electrical characteristics; enables dual-channel synchronous signal processing without crosstalk.

Key Features

FeatureDesign Value
Rail-to-rail I/OEnables full utilization of 3.3 V ADC reference range without level-shifting circuitry or supply overhead.
Micropower shutdownReduces total system idle current to sub-µA levels, extending battery life in wireless sensor endpoints.
Low input offset drift2 µV/°C temperature coefficient ensures <100 µV offset shift over −20°C to +70°C ambient, eliminating recalibration.
High output drive±80 mA capability directly drives 50 Ω coaxial cables or multiple parallel ADC inputs without external buffers.
Extended supply range2.7–6 V operation supports direct connection to Li-ion (3.0–4.2 V), USB (5 V), and legacy 3.3 V/5 V rails.

Applications

Portable ECG Front-EndIndustrial Temperature Sensor Interface

Use Scenario: Amplifying microvolt-level biopotential signals from dry electrodes in handheld medical devices.

IC Role / Device Role / Timing Role: Dual-channel instrumentation buffer with one channel for lead-I differential pair and second for right-leg drive feedback.

Use Value: 11 nV/√Hz input noise preserves ECG signal integrity; rail-to-rail output ensures full 3.3 V ADC range usage without clipping.

Use Scenario: Conditioning PT100/RTD bridge outputs in programmable logic controller (PLC) analog input modules.

IC Role / Device Role / Timing Role: Precision voltage follower and excitation current buffer driving 4-wire RTD configurations.

Use Value: 100 µV input offset contributes <0.25°C error in 100°C span; ±80 mA drive sustains 1 mA excitation current into 100 Ω RTD + trace resistance.

USB-Powered Data LoggerAutomotive Cabin Air Quality Monitor

Use Scenario: Signal conditioning for MEMS pressure and humidity sensors powered from USB 5 V bus.

IC Role / Device Role / Timing Role: Dual-channel low-noise amplifier: one for sensor output, one for reference voltage buffering.

Use Value: 500 µA/channel supply current enables continuous logging for >1 year on 2000 mAh battery; shutdown mode cuts power during sleep intervals.

Use Scenario: Analog front-end for NDIR CO₂ and VOC sensors in automotive HVAC control units.

IC Role / Device Role / Timing Role: Rail-to-rail buffer isolating sensitive photodiode transimpedance amplifier output from noisy MCU ADC.

Use Value: 6.4 MHz bandwidth supports fast sensor response time; 0°C to 70°C rating matches passenger compartment thermal envelope.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TLV2462IDRWider operating temperature range (−40°C to 125°C); identical electrical specs and pinout.Required for under-hood automotive or industrial control environments exceeding 70°C ambient.Select TLV2462IDR when design must operate reliably at junction temperatures up to 125°C.
OPA2340UALower input offset (50 µV max), higher GBW (10 MHz), but no shutdown function and 1.2 mA/channel supply current.Better for high-precision, high-speed applications where power budget allows >2× current draw and shutdown is unnecessary.Choose OPA2340UA only if 50 µV offset and 10 MHz bandwidth are mandatory and shutdown is not required.

Compared with TLV2462IDR, the TLV2462CDR trades extended temperature capability for lower cost and qualification scope, while OPA2340UA sacrifices micropower operation and shutdown for enhanced DC precision and AC performance-making TLV2462CDR optimal for cost-sensitive, battery-powered portable systems requiring flexible power management.

Availability

TLV2462CDR is available at Aetrix Electronics and suitable for portable medical devices, industrial sensor interfaces, USB-powered data loggers, and automotive cabin air quality monitors requiring stable component supply across production lifecycles.

Supply support for TLV2462CDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing solutions, with decades of expertise in precision op-amps and low-power signal chain components.

The TLV246x family was designed specifically for portable, battery-operated applications demanding rail-to-rail I/O, micropower consumption, and robust performance across voltage and temperature variations.

FAQ

What is the maximum supply voltage for TLV2462CDR?

The absolute maximum supply voltage for TLV2462CDR is 6 V. Operating continuously above this level risks permanent damage. The recommended operating range is 2.7 V to 6 V for single-supply use or ±1.35 V to ±3 V for split-supply configurations. At 5 V supply, TLV2462CDR delivers its full ±80 mA output drive capability and 1.6 V/µs slew rate as specified in the datasheet.

Does TLV2462CDR support true rail-to-rail input and output?

Yes, TLV2462CDR supports true rail-to-rail input common-mode voltage range (0 V to VDD) and rail-to-rail output swing (within 100 mV of VDD and GND at ±10 mA load). This capability is confirmed in the datasheet's Electrical Characteristics tables for both 3 V and 5 V supplies, enabling direct interfacing with 3.3 V ADCs without level-shifting circuitry.

How does the shutdown feature work on TLV2462CDR?

The TLV2462CDR has dedicated SHDN pins (Pin 5 for Channel A, Pin 8 for Channel B) that enable independent per-channel shutdown. When SHDN is pulled ≥2 V above GND (VIH), the corresponding amplifier enters ultralow-current mode (0.3 µA/channel) and its output transitions to high-impedance state. Pulling SHDN ≤0.7 V (VIL) returns the channel to normal operation. Both channels can be controlled simultaneously or separately.

What is the input offset voltage specification for TLV2462CDR?

The input offset voltage for TLV2462CDR is 100 µV (typical) and 2000 µV (maximum) at 25°C, with a maximum of 2200 µV across the full 0°C to 70°C operating range. This value is measured under standard test conditions (VDD = 3 V or 5 V, VIC = VDD/2, VO = VDD/2) and reflects the device's C-suffix commercial-grade tolerance, making it suitable for medium-precision signal conditioning tasks.

Which package type does TLV2462CDR use, and what are its key mechanical features?

TLV2462CDR uses the TSSOP-8 (DGK) package: 3.0 mm × 4.4 mm body size, 0.65 mm lead pitch, and an exposed thermal pad (non-functional, not electrically connected). This surface-mount package supports automated assembly and provides improved thermal performance over SOIC-8, with JEDEC-standard footprint compatibility and RoHS compliance.

TLV2462CDR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
General Purpose
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
1.6V/µs
Gain Bandwidth Product:
6.4 MHz
-3db Bandwidth:
-
Current - Input Bias:
1.3 nA
Voltage - Input Offset:
500 µV
Current - Supply:
550µA (x2 Channels)
Current - Output / Channel:
80 mA
Voltage - Supply Span (Min):
2.7 V
Voltage - Supply Span (Max):
6 V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

TLV2462CDR FAQ

1.How can I place an order for TLV2462CDR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV2462CDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV2462CDR reliable?

The price and inventory of TLV2462CDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2462CDR is usually 5 days.

3.What payment methods are accepted for TLV2462CDR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2462CDR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV2462CDR?

TLV2462CDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV2462CDR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV2462CDR?

For technical support, including TLV2462CDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2462CDR requirements.

6.How does Aetrix verify that TLV2462CDR is sourced from the original manufacturer or authorized distributors?

All TLV2462CDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2462CDR meets industry standards.

7.What is the process for return or replacement of TLV2462CDR?

All TLV2462CDR units undergo pre-shipment inspection (PSI). If there is an issue with TLV2462CDR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV2462CDR part is unused and in its original packaging.

Return procedure for TLV2462CDR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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