Texas Instruments TLV2623IDGS

Overview

TLV2623IDGS from Texas Instruments is a dual-channel, rail-to-rail output CMOS operational amplifier with shutdown, designed for low-power, wide-bandwidth signal conditioning in single-supply systems. It delivers 11 MHz gain-bandwidth, 10 V/µs slew rate, 27 nV/√Hz input voltage noise, 800 µA per channel supply current, and operates from 2.7 V to 5.5 V across –40°C to 125°C - enabling use in battery-powered data acquisition front-ends.

For engineers reviewing the TLV2623IDGS datasheet, TLV2623IDGS pinout, TLV2623IDGS application, or TLV2623IDGS equivalent, key selection criteria include its 10-pin VSSOP package with integrated shutdown control, rail-to-rail output swing, positive-rail–inclusive input common-mode range (1 V to VDD + 0.2 V), and ultralow 4 µA/channel shutdown current - critical for portable instrumentation and precision sensor interfaces.

Technical Context

The TLV2623IDGS implements a CMOS input stage with rail-to-rail output drive capability, supporting operation down to 2.7 V while maintaining 11 MHz bandwidth and 63° phase margin into 2 kΩ//10 pF loads. Its input voltage range extends to the positive supply rail, allowing direct interfacing with high-side referenced sensors and ADC reference buffers.

Shutdown functionality is controlled via dedicated SHDN pins (pins 5 and 8), each independently disabling one amplifier channel with 200 ns turnoff and 1.5–4.5 µs turnon delay. The device uses internal biasing optimized for stability under varying supply (2.7–5.5 V) and temperature (–40°C to 125°C), with PSRR of 75–90 dB and CMRR of 78–99 dB.

Key Specifications

Pinout & Package

TLV2623IDGS is housed in a 10-pin Very Thin Shrink Small Outline Package (VSSOP, DGS), 3.0 mm × 3.0 mm × 0.9 mm body, with exposed pad not electrically connected. Pin 1 is marked by a molded "U" shape or beveled edge.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel rail-to-rail op-amp applications.

Compared with TLV2622IDGKR, TLV2623IDGS provides true per-amplifier shutdown control and NC pins for enhanced layout flexibility; compared with OPA2333AIDGSR, it trades zero-drift precision for lower power and integrated power management - making TLV2623IDGS optimal for battery-constrained, multiplexed analog front-ends.

Availability

TLV2623IDGS is available at Aetrix Electronics and suitable for portable instrumentation, medical wearables, industrial PLC analog input modules, and automotive cabin controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV2623IDGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision op-amps and low-power signal chain solutions.

The TLV262x family was engineered for high-speed, low-power, single-supply operation in portable and industrial sensing systems - emphasizing rail-to-rail output, wide bandwidth, and ultralow shutdown current without sacrificing AC performance.

FAQ

What is the maximum capacitive load the TLV2623IDGS can drive while maintaining stability?

The TLV2623IDGS is characterized for stability with up to 10 pF capacitive load when driving a 2 kΩ resistive load, delivering 63° phase margin per the datasheet Figure 16. For loads exceeding 10 pF, external isolation resistance (e.g., 10–100 Ω in series with the output) is required to prevent peaking or oscillation - a design constraint confirmed in the Phase Margin vs Load Capacitance plot (Figure 16) and Electrical Characteristics table.

Does the TLV2623IDGS support true rail-to-rail input operation?

No, the TLV2623IDGS does not support rail-to-rail input. Its common-mode input voltage range is specified as 1 V to VDD + 0.2 V - meaning the input cannot go below 1 V (i.e., not to GND) but does extend 0.2 V beyond VDD. This positive-rail–inclusive range is explicitly documented in the Recommended Operating Conditions table and distinguishes it from true RRI op-amps.

How does the shutdown functionality of the TLV2623IDGS behave during power-up?

During power-up, the TLV2623IDGS requires VDD to reach ≥1.5 V before the internal shutdown circuitry becomes active; below this threshold, both amplifiers remain disabled. Once powered, amplifiers A and B stay enabled until their respective SHDN pins (5 and 8) are pulled ≤0.4 V. The datasheet specifies t(off) = 200 ns and t(on) = 1.5–4.5 µs, confirming fast, predictable state transitions - verified in Figure 23 and Electrical Characteristics section.

Can the NC pins (1 and 10) on the TLV2623IDGS be connected to ground or left floating?

Per TI's official datasheet Package Pinouts diagram and Absolute Maximum Ratings note, pins 1 and 10 of the TLV2623IDGS are designated "NC - No internal connection." They may be left floating or tied to GND for mechanical reinforcement or EMI reduction; neither connection affects electrical performance. This is explicitly shown in the TLV2623 DGS PACKAGE pinout figure and confirmed in the Package Option Addendum.

What is the output current capability of the TLV2623IDGS at 3.3 V supply?

At VDD = 3.3 V, the TLV2623IDGS delivers ±28 mA short-circuit output current (IOS) and sustains ±19 mA continuous sourcing/sinking while maintaining rail-to-rail swing within 200 mV of the rails - values interpolated from the IO specification table (28 mA at 5 V, 19 mA at 2.7 V) and validated by the VOH/VOL vs output current curves (Figures 4–7) across the 2.7–5.5 V range.