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Texas Instruments TLV2633IDGSR

Part No.:
TLV2633IDGSR
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTLV2633IDGSR.pdf
Description:
IC OPAMP GP 2 CIRCUIT 10VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,262

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Product details

Overview

TLV2633IDGSR from Texas Instruments is a dual-channel, rail-to-rail output operational amplifier with shutdown control, designed for precision analog signal conditioning in single-supply systems. It operates from 2.7 V to 5.5 V, delivers 9 MHz gain-bandwidth, draws only 730 µA per channel, and supports industrial temperature range (−40°C to 125°C). It interfaces directly with ground-referenced sensors and ADCs in battery-powered data acquisition.

For engineers reviewing the TLV2633IDGSR datasheet, TLV2633IDGSR pinout, TLV2633IDGSR application, or TLV2633IDGSR equivalent, key selection criteria include its rail-to-rail output swing, ultralow 4 µA shutdown current, 9 MHz GBW at 730 µA, input common-mode range extending to GND, and MSOP-10 packaging for space-constrained designs.

Technical Context

The TLV2633IDGSR integrates two independent op-amps with individual shutdown pins (pins 5 and 10), enabling selective channel power gating. Its input stage includes ground-sensing capability (VICR = GND to VDD − 1 V), and output stage delivers rail-to-rail swing with ±28 mA drive capability.

It features a unity-gain-stable architecture with 9 MHz gain-bandwidth product, 9.5 V/µs negative slew rate (at VDD = 5 V), and 50 nV/√Hz input voltage noise - optimized for high-resolution SAR ADC drivers and low-distortion signal chains where supply current and dynamic performance must coexist.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 2.7 V to 5.5 V - compatible with Li-ion cells and MSP430 microcontrollers without level-shifting.
Gain-Bandwidth Product 9 MHz - enables stable unity-gain buffer operation up to ~9 MHz or closed-loop gain of 10 at ~900 kHz.
Supply Current per Channel 730 µA - allows dual-channel operation under 1.5 mA total, critical for always-on sensor front-ends.
Shutdown Current per Channel 4 µA - reduces system standby power by >99% versus active mode, enabling long battery life in intermittent sensing.
Input Common-Mode Range GND to VDD − 1 V - accepts 0 V input signals directly, eliminating need for biasing networks in ground-referenced transducer interfaces.
Output Drive Capability ±28 mA - drives 2 kΩ loads to rail while maintaining linearity, suitable for driving ADC reference buffers or small capacitive loads.
Input Voltage Noise 50 nV/√Hz at 1 kHz - preserves SNR in 16-bit+ data converter interfaces where noise contribution must be <1 LSB.

Pinout & Package

TLV2633IDGSR is housed in a 10-pin MSOP (DGS) package (4.0 mm × 3.0 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation. Pin 1 is marked via laser etch or mold index; pin 1 location confirmed per JEDEC MO-187.

Pin/Terminal Circuit Role Design Meaning
1 1OUT Output of first amplifier channel - rail-to-rail capable, drives external load or next-stage input.
2 1IN− Inverting input of first channel - used for feedback configuration (e.g., inverting amplifier, transimpedance).
3 1IN+ Non-inverting input of first channel - accepts ground-referenced sensor signals without level shift.
4 GND Analog ground reference - shared return path for both channels and shutdown logic; requires low-impedance PCB connection.
5 1SHDN Active-low shutdown control for Channel 1 - pulls below 0.4 V to disable amplifier; high-Z when inactive.
6 VDD Positive supply rail - powers both amplifiers and internal bias circuitry; decoupling capacitor required at pin.
7 2IN+ Non-inverting input of second channel - independently configurable for differential or single-ended inputs.
8 2IN− Inverting input of second channel - supports matched feedback networks for precision instrumentation topologies.
9 2OUT Output of second amplifier channel - fully independent; can be used for reference buffering or signal conditioning.
10 2SHDN Active-low shutdown control for Channel 2 - enables independent power management per channel.

Key Features

Feature Design Value
Rail-to-rail output swing Drives within 100 mV of rails at 10 mA load, maximizing dynamic range for 3.3 V or 5 V ADCs.
Ground-sensing input range Accepts 0 V common-mode input, eliminating DC bias resistors in thermocouple or bridge sensor interfaces.
Ultralow shutdown current 4 µA per channel ensures <1 µA total quiescent current when both channels disabled - ideal for wake-on-event architectures.
Industrial temperature rating Specified from −40°C to 125°C, supporting deployment in automotive engine control modules and industrial motor drives.
Low input voltage noise 50 nV/√Hz at 1 kHz enables accurate amplification of µV-level signals from strain gauges or RTDs without added filtering.
MSOP-10 thermal performance ΘJA = 259.7°C/W enables 97 mW power dissipation at TA = 125°C - sufficient for dual-channel operation at full spec.

Applications

High-Speed Data Acquisition Portable Medical Sensors

Use Scenario: Driving the input of a 16-bit SAR ADC sampling at 1 MSPS in a handheld ECG monitor.

IC Role / Device Role / Timing Role: Precision buffer and anti-alias filter driver with rail-to-rail output and low noise to preserve signal integrity.

Use Value: 50 nV/√Hz input noise and 9 MHz GBW ensure <0.01% THD+N at 10 kHz, meeting AAMI EC11 clinical accuracy requirements.

Use Scenario: Amplifying low-level piezoelectric pulse oximeter signals in a battery-powered wearable.

IC Role / Device Role / Timing Role: Low-power, ground-referenced transducer amplifier with selectable shutdown during sleep cycles.

Use Value: 4 µA shutdown current extends battery life to >7 days on a single CR2032 cell, while GND-to-VDD−1 V input range eliminates biasing components.

Li-ion Powered Industrial IoT Nodes Automotive Cabin Temperature Sensing

Use Scenario: Conditioning PT1000 RTD outputs in a wireless condition-monitoring node powered by a 3.7 V Li-ion cell.

IC Role / Device Role / Timing Role: Precision instrumentation amplifier front-end with programmable gain and low-drift biasing.

Use Value: 250 µV max input offset and 3 µV/°C drift minimize temperature measurement error across −40°C to 125°C ambient range.

Use Scenario: Signal conditioning for NTC thermistors in HVAC control modules inside vehicle dashboards.

IC Role / Device Role / Timing Role: Dual-channel sensor interface: one channel for temperature, one for humidity sensor biasing.

Use Value: Dual independent shutdown (pins 5 & 10) allows dynamic power gating - reducing system idle current by 1.46 mA versus always-on operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual operational amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
TLV2632IDGKR Dual op-amp, same family, no shutdown function; 750 µA/ch supply current; identical GBW (9 MHz) and noise (50 nV/√Hz). Lacks per-channel shutdown - unsuitable for duty-cycled sensor nodes requiring ultra-low standby power. Select TLV2632IDGKR only if shutdown is unnecessary and cost minimization is prioritized over power flexibility.
OPA2343UA Higher supply current (850 µA/ch), lower GBW (5.5 MHz), wider VICR (−0.3 V to VDD+0.3 V), but no shutdown. Better input overvoltage tolerance; not rated for 125°C operation - limited to commercial/industrial ambient ≤85°C. Choose OPA2343UA only when input fault protection beyond rail is required and extended temperature operation is not needed.

Compared with TLV2633IDGSR, TLV2632IDGKR offers identical performance without shutdown overhead, while OPA2343UA trades bandwidth and temperature range for enhanced input voltage range - making TLV2633IDGSR the sole option combining shutdown, 125°C rating, and 9 MHz GBW in MSOP-10.

Availability

TLV2633IDGSR is available at Aetrix Electronics and suitable for portable medical devices, industrial IoT edge nodes, and automotive cabin sensor systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV2633IDGSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op-amps and low-power signal chain solutions.

The TLV263x family was engineered for high-speed, low-voltage, rail-to-rail analog signal conditioning in battery-powered and thermally demanding applications - balancing bandwidth, power, and robustness.

FAQ

What is the maximum operating junction temperature for TLV2633IDGSR?

The absolute maximum junction temperature for TLV2633IDGSR is 150°C. Under recommended operating conditions (TA = −40°C to 125°C), the device maintains full electrical specifications. Thermal design must ensure θJA = 259.7°C/W and proper PCB copper area under the exposed pad to avoid exceeding TJ(max) during continuous 28 mA output loading.

Does TLV2633IDGSR support split-supply operation?

Yes, TLV2633IDGSR supports split-supply operation with ±1.35 V to ±2.75 V rails, as specified in the recommended operating conditions. However, its rail-to-rail output and ground-inclusive input range are optimized for single-supply use; split-supply configurations require careful biasing of IN+ and IN− to maintain common-mode compliance.

What is the typical turn-on time for TLV2633IDGSR after asserting SHDN high?

The typical amplifier turn-on time for TLV2633IDGSR is 1.5 µs (at VDD = 5 V, RL = 2 kΩ, CL = 10 pF), defined as the interval between SHDN rising above 2 V and supply current reaching 50% of its active value. This fast enable time supports burst-mode sensing in energy-harvesting systems.

Can TLV2633IDGSR drive a 1000 pF capacitive load stably?

No - TLV2633IDGSR is unity-gain stable only for capacitive loads ≤100 pF, as confirmed by phase margin testing (≥50° at CL = 10 pF). Driving 1000 pF directly causes severe peaking and potential oscillation; a series resistor (≥100 Ω) or isolation buffer is required for larger capacitive loads.

Is the exposed thermal pad on TLV2633IDGSR electrically connected internally?

No - the exposed pad on the TLV2633IDGSR MSOP-10 package is not electrically connected to any internal node. It is intended solely for thermal conduction and must be soldered to a large PCB copper pour tied to GND for optimal thermal performance and mechanical reliability.

TLV2633IDGSR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Amplifier Type:
General Purpose
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
10V/µs
Gain Bandwidth Product:
9 MHz
-3db Bandwidth:
-
Current - Input Bias:
0.7 pA
Voltage - Input Offset:
1.1 mV
Current - Supply:
3.8mA (x2 Channels)
Current - Output / Channel:
28 mA
Voltage - Supply Span (Min):
2.7 V
Voltage - Supply Span (Max):
5.5 V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-VSSOP

TLV2633IDGSR FAQ

1.How can I place an order for TLV2633IDGSR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV2633IDGSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV2633IDGSR reliable?

The price and inventory of TLV2633IDGSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2633IDGSR is usually 5 days.

3.What payment methods are accepted for TLV2633IDGSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2633IDGSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV2633IDGSR?

TLV2633IDGSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV2633IDGSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV2633IDGSR?

For technical support, including TLV2633IDGSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2633IDGSR requirements.

6.How does Aetrix verify that TLV2633IDGSR is sourced from the original manufacturer or authorized distributors?

All TLV2633IDGSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2633IDGSR meets industry standards.

7.What is the process for return or replacement of TLV2633IDGSR?

All TLV2633IDGSR units undergo pre-shipment inspection (PSI). If there is an issue with TLV2633IDGSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV2633IDGSR part is unused and in its original packaging.

Return procedure for TLV2633IDGSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLV2633IDGSR Tags

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