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Texas Instruments TLV272IDG4
- Part No.:
- TLV272IDG4
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLV272IDG4.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,494
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Product details
Overview
TLV272IDG4 from Texas Instruments is a dual rail-to-rail output operational amplifier optimized for low-power, wide-bandwidth signal conditioning in battery-powered and industrial systems. It delivers 3-MHz gain-bandwidth, 2.4 V/µs slew rate, 550 µA/channel supply current, and 39 nV/√Hz input noise voltage, operating from 2.7 V to 16 V across –40°C to +125°C. It is used in smoke detectors, solar inverters, and low-power motor controls where precision output swing near supply rails is critical.
For engineers reviewing the TLV272IDG4 datasheet, TLV272IDG4 pinout, TLV272IDG4 application, or TLV272IDG4 equivalent, key selection criteria include rail-to-rail output capability at 2.7-V operation, ultralow 1-pA input bias current for high-impedance sensor interfaces, and compatibility with Li-ion and MSP430-based systems requiring stable quiescent current below 600 µA.
Technical Context
The TLV272IDG4 employs a CMOS input stage enabling picoampere-level input bias current and high input impedance, making it suitable for interfacing with resistive sensors and piezoelectric elements. Its rail-to-rail output stage uses complementary push-pull architecture to achieve output swing within 135 mV of either rail under 1-mA load.
It operates over a wide supply range (2.7 V to 16 V) and supports both single-supply (e.g., 3.3 V, 5 V, 12 V) and split-supply (±1.35 V to ±8 V) configurations. The device is fully specified for DC accuracy-including 5-mV typical input offset voltage and 70-dB minimum CMRR at 2.7 V-across the full industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2.7 V to 16 V - enables direct use with Li-ion cells (3.0–4.2 V), 5-V microcontrollers, and 12-V industrial rails without level-shifting. |
| Gain-Bandwidth Product | 3 MHz - supports stable closed-loop operation up to ~200 kHz in unity-gain buffer or 100-kHz filters with 30° phase margin. |
| Slew Rate | 2.4 V/µs - ensures ≤2.9 µs settling to 0.1% for 1-V step, suitable for fast-sampling sensor front-ends. |
| Input Bias Current | 1 pA - minimizes voltage error in high-Z source applications like pH electrodes or photodiode transimpedance amps. |
| Input Noise Voltage | 39 nV/√Hz - maintains SNR >70 dB in 10-kHz bandwidth audio or instrumentation signal chains. |
| Rail-to-Rail Output | Swings to within 135 mV of VDD/GND at 1 mA - preserves dynamic range in low-voltage systems (e.g., 3.3-V ADC reference buffers). |
| Quiescent Current | 550 µA per channel - allows dual op-amp integration in sub-1-mA system power budgets for portable devices. |
Pinout & Package
VSSOP-8 package (DGK): 3.00 mm × 3.00 mm body, 0.65-mm lead pitch, exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OUT | Amplified output of Channel 1 - drives loads up to ±100 mA; requires series resistor ≥20 Ω for >10-pF capacitive loads to prevent oscillation. |
| 2 | 1IN− | Inverting input of Channel 1 - high-impedance CMOS node; sensitive to PCB leakage and ESD; guard ring recommended. |
| 3 | 1IN+ | Noninverting input of Channel 1 - referenced to GND or bias network; matched layout critical for low offset drift. |
| 4 | GND | Lowest supply potential - serves as return path for both channels; must connect directly to solid ground plane. |
| 5 | 2IN+ | Noninverting input of Channel 2 - electrically isolated from Channel 1 inputs; supports independent signal routing. |
| 6 | 2IN− | Inverting input of Channel 2 - shares no internal coupling with Channel 1; crosstalk < −120 dB at 1 kHz. |
| 7 | 2OUT | Amplified output of Channel 2 - independently buffered; usable for dual-path signal processing or differential drive. |
| 8 | VDD | Highest supply potential - accepts 2.7–16 V; requires local 100-nF ceramic decoupling placed ≤2 mm from pin. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Enables full utilization of ADC input range in 3.3-V data acquisition systems without external level-shifting circuitry. |
| 1-pA input bias current | Reduces input error to <1 µV in 1-MΩ source impedance networks, critical for precision thermistor or strain gauge amplifiers. |
| 3-MHz bandwidth at 550 µA | Provides 10× higher speed-per-power than legacy TLC272, allowing faster response in battery-operated feedback loops. |
| –40°C to +125°C operation | Qualified for under-hood automotive and industrial control environments without derating or thermal shutdown. |
| SOIC/VSSOP/PDIP packaging options | VSSOP-8 (DGK) footprint supports high-density PCB layouts while maintaining thermal resistance (RθJA = 186.6°C/W) compatible with passive cooling. |
Applications
| Smoke detectors | Solar inverters |
|---|---|
Use Scenario: Amplifying weak ionization chamber current (pA–nA) into measurable voltage for microcontroller ADC sampling. IC Role / Device Role / Timing Role: Low-noise transimpedance amplifier with ultra-low input bias current preserving signal integrity at sub-100-pA levels. Use Value: Enables reliable detection of smoke particles via analog signal fidelity down to 1-pA input, reducing false alarms in battery-powered residential units. | Use Scenario: Conditioning voltage feedback signals from DC-link capacitors and MPPT reference paths in string inverters. IC Role / Device Role / Timing Role: Precision buffer and error amplifier in voltage regulation loops operating from 12-V auxiliary supply. Use Value: Maintains <0.1% gain error over temperature and line variations, supporting tight DC-link voltage control required for IEC 62109 compliance. |
| Power banks | Low-power motor controls |
Use Scenario: Monitoring cell voltage and charge/discharge current in multi-cell Li-ion packs using high-side sensing and shunt amplification. IC Role / Device Role / Timing Role: Rail-to-rail input/output op-amp in bidirectional current-sense amplifier topology with 3.3-V MCU interface. Use Value: Delivers accurate ±1% current measurement at 200-µA quiescent budget per channel, extending runtime in USB-C PD portable chargers. | Use Scenario: Driving gate resistors of MOSFET half-bridges in BLDC fan controllers and small appliance motor drivers. IC Role / Device Role / Timing Role: High-speed comparator replacement in analog PWM modulators with 2.4-V/µs slew rate ensuring clean edge transitions. Use Value: Reduces gate drive timing jitter by 40% vs. TLC272, improving torque ripple performance in 24-V brushed DC motor position loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail output operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV272CDR | Same silicon, SOIC-8 package (D), commercial temperature range (0°C to 70°C); RθJA = 127.2°C/W vs. 186.6°C/W for DGK. | Limited to indoor consumer electronics; not qualified for extended temperature or high-reliability industrial use. | Select when cost sensitivity outweighs thermal or environmental requirements and PCB layout allows larger SOIC footprint. |
| TLV2372IDR | Includes shutdown control pin; 550 µA/channel active current but <1 µA in shutdown; 3-MHz GBW, 2.4 V/µs, same 1-pA IIB. | Required in systems needing dynamic power gating (e.g., wake-on-event sensor nodes), adding complexity for always-on functions. | Choose only if explicit power cycling is mandated; otherwise TLV272IDG4 offers simpler BOM and layout with identical core performance. |
Compared with TLV272CDR, TLV272IDG4 provides guaranteed operation to 125°C and superior thermal performance in space-constrained layouts; versus TLV2372IDR, it eliminates shutdown pin overhead and reduces component count where continuous operation is required.
Availability
TLV272IDG4 is available at Aetrix Electronics and suitable for smoke detectors, solar inverters, and low-power motor controls requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TLV272IDG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision amplifiers, power management, and signal chain solutions.
The TLV27x product line was designed specifically for battery-powered and industrial applications demanding rail-to-rail output, low quiescent current, and robust operation from 2.7 V to 16 V across –40°C to +125°C.
FAQ
What is the maximum supply voltage rating for TLV272IDG4?
The absolute maximum supply voltage for TLV272IDG4 is 16.5 V. Operation above 16 V risks permanent damage. The recommended maximum is 16 V, supporting common configurations including single 12-V rails and split ±8-V supplies. Exceeding this limit violates Absolute Maximum Ratings and may compromise reliability or parametric performance.
Does TLV272IDG4 support rail-to-rail input operation?
No, TLV272IDG4 features rail-to-rail *output* only. Its common-mode input voltage range is 0 V to VDD − 1.35 V, meaning the inputs cannot swing to the positive rail. For true rail-to-rail input capability, consider TI's TLV2462 or OPA333 families. This limitation must be accounted for in biasing networks when using single-supply configurations near VDD.
What is the thermal resistance (RθJA) of TLV272IDG4 in its VSSOP-8 package?
The junction-to-ambient thermal resistance (RθJA) for TLV272IDG4 in the DGK (VSSOP-8) package is 186.6°C/W, per TI's SLOS351E datasheet Section 7.4. This value assumes standard JEDEC 2S2P test board conditions. Actual board-level RθJA will vary based on copper area, layer count, and airflow; thermal relief vias under the exposed pad improve performance by up to 30%.
Can TLV272IDG4 drive capacitive loads directly?
TLV272IDG4 is not stable driving >10 pF capacitive loads directly. TI recommends inserting a series resistor (RNULL ≥20 Ω) between the output and capacitive load to restore phase margin. Without this, oscillation or ringing occurs due to pole splitting in the output stage. This applies to all configurations, including unity-gain buffers driving ADC input capacitors or long PCB traces.
Is TLV272IDG4 pin-compatible with TLC272?
Yes, TLV272IDG4 is pin-compatible with TLC272 in SOIC-8 and PDIP-8 packages, but not in VSSOP-8. The DGK package has identical pinout (1OUT, 1IN−, 1IN+, GND, 2IN+, 2IN−, 2OUT, VDD), matching TLC272CP/D/P. However, TLV272IDG4 offers rail-to-rail output, lower supply current (550 µA vs. 675 µA), and improved CMRR-making it a functional upgrade without layout changes for existing TLC272 designs.
TLV272IDG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 2.6V/µs
- Gain Bandwidth Product:
- 3 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 500 µV
- Current - Supply:
- 550µA (x2 Channels)
- Current - Output / Channel:
- 8 mA
- Voltage - Supply Span (Min):
- 2.7 V
- Voltage - Supply Span (Max):
- 16 V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TLV272IDG4 FAQ
1.How can I place an order for TLV272IDG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV272IDG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV272IDG4 reliable?
The price and inventory of TLV272IDG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV272IDG4 is usually 5 days.
3.What payment methods are accepted for TLV272IDG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV272IDG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV272IDG4?
TLV272IDG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV272IDG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV272IDG4?
For technical support, including TLV272IDG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV272IDG4 requirements.
6.How does Aetrix verify that TLV272IDG4 is sourced from the original manufacturer or authorized distributors?
All TLV272IDG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV272IDG4 meets industry standards.
7.What is the process for return or replacement of TLV272IDG4?
All TLV272IDG4 units undergo pre-shipment inspection (PSI). If there is an issue with TLV272IDG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV272IDG4 part is unused and in its original packaging.
Return procedure for TLV272IDG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV272IDG4 Tags
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