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Texas Instruments TLV2772AMD
- Part No.:
- TLV2772AMD
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLV2772AMD.pdf
- Description:
- IC CMOS 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,486
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Product details
Overview
TLV2772AMD from Texas Instruments is a dual-channel, rail-to-rail output CMOS operational amplifier optimized for high-precision, low-power, extended-temperature applications. It delivers 10.5 V/µs slew rate, 5.1 MHz gain-bandwidth product, 360 µV input offset voltage (typ), 1 mA per-channel supply current, and operates from 2.5 V to 5.5 V single supply - enabling use in automotive sensor signal conditioning and industrial analog front-ends.
For engineers reviewing the TLV2772AMD datasheet, TLV2772AMD pinout, TLV2772AMD application, or TLV2772AMD equivalent, this page provides verified electrical specifications, military-grade temperature performance (−55°C to 125°C), MSOP-8 and ceramic flatpack package details, and real-world design guidance for precision amplification in harsh environments.
Technical Context
The TLV2772AMD employs a CMOS input stage with 2 pA input bias current and 17 nV/√Hz input noise voltage, supporting high-impedance sensor interfacing. Its rail-to-rail output swing and 5.1 MHz bandwidth allow accurate buffering of ADC reference and input signals without headroom loss.
It features micropower shutdown mode (<1 µA per channel) and is fully characterized across −55°C to 125°C, meeting MIL-PRF-38535 requirements for QML-38535 Class V (M-suffix) qualification. Input common-mode range extends to GND, and output drives 600 Ω loads with 0.005% THD+N at 1 kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Slew Rate | 10.5 V/µs typ - enables fast settling for dynamic sensor signals and DAC output buffering. |
| Gain-Bandwidth Product | 5.1 MHz typ - supports stable unity-gain and moderate-gain configurations up to ~100 kHz. |
| Input Offset Voltage | 360 µV max at 25°C - ensures <±1 LSB error in 12-bit systems with 2 V full-scale range. |
| Supply Current (per channel) | 1 mA typ at 2.7 V - allows dual op-amp operation within 2 mA total budget for portable/military systems. |
| Operating Temperature Range | −55°C to 125°C - qualified for aerospace, defense, and under-hood automotive electronics. |
| Input Bias Current | 2 pA typ - preserves accuracy in high-Z pH, thermopile, and piezoelectric sensor interfaces. |
| THD+N @ 1 kHz | 0.005% @ RL = 600 Ω - meets telecom line-driver and audio preamp fidelity requirements. |
Pinout & Package
TLV2772AMD is available in the 8-pin ceramic flatpack (U) package, hermetically sealed for high-reliability military and space applications. Pin 1 is identified by a beveled edge or molded "U" shape.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | NC | No internal connection - left floating; no PCB trace required. |
| 2 | 2IN− | Inverting input for Channel 2 - connects to feedback network or sensor return path. |
| 3 | 2IN+ | Non-inverting input for Channel 2 - accepts high-impedance sensor or reference voltage. |
| 4 | GND | Analog ground reference - must be tied to system AGND plane with low-inductance path. |
| 5 | 1OUT | Output of Channel 1 - drives ADC input, filter stage, or load up to ±50 mA. |
| 6 | 1IN− | Inverting input for Channel 1 - used in inverting amplifier or transimpedance configuration. |
| 7 | 1IN+ | Non-inverting input for Channel 1 - primary interface point for single-ended sensor signals. |
| 8 | VDD+ | Positive supply rail - requires local 100 nF ceramic decoupling capacitor to GND. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Drives within 100 mV of VDD and GND at 2.2 mA load - eliminates level-shifting in 3.3 V systems. |
| Micropower shutdown mode | IDD < 1 µA per channel - enables duty-cycled sensing in battery-powered telemetry nodes. |
| Low distortion into 600 Ω | 0.005% THD+N at 1 kHz - suitable for driving legacy telecom line interfaces and audio codecs. |
| Extended temperature qualification | Tested and guaranteed over −55°C to 125°C - meets MIL-STD-883 screening for Class V reliability. |
| High CMRR & PSRR | 84 dB CMRR and 89 dB PSRR (typ) - rejects power supply ripple and common-mode noise in noisy environments. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Pressure Transducer Interface |
|---|---|
Use Scenario: Amplifying millivolt-level output from piezoresistive pressure sensors in turbocharger or brake-line monitoring. IC Role / Device Role / Timing Role: Precision instrumentation amplifier front-end with rail-to-rail output driving 12-bit SAR ADC. Use Value: 360 µV VIO and −55°C to 125°C operation ensure <±0.25% FS accuracy across engine thermal cycles. |
Use Scenario: Conditioning low-level bridge outputs in factory-floor load cells and hydraulic sensors. IC Role / Device Role / Timing Role: Dual-channel buffer and gain stage for Wheatstone bridge excitation and differential readout. Use Value: 2 pA IIB prevents bridge imbalance drift; 1 mA/channel supply enables multi-sensor nodes on 20 mA rails. |
| Aerospace Avionics Signal Conditioning | Military Portable Radios (RF Front-End) |
Use Scenario: Amplifying thermocouple or RTD signals in flight control sensor modules requiring long-term stability. IC Role / Device Role / Timing Role: Cold-junction compensation amplifier and anti-aliasing filter driver in DO-160G-compliant systems. Use Value: 2 µV/°C αVIO and hermetic U-package ensure calibration integrity over 20-year service life. |
Use Scenario: Buffering IF signals and biasing RF mixer inputs in handheld tactical radios operating in extreme climates. IC Role / Device Role / Timing Role: Low-noise, low-distortion gain block between SAW filter and ADC in 25–500 MHz receive chain. Use Value: 17 nV/√Hz input noise and 0.005% THD+N preserve SNR in narrowband demodulation paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel precision op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OPA2333MDRG4 | Zero-drift architecture (0.02 µV/°C), lower VIO (10 µV max), but higher IDD (17 µA/ch) and narrower GBW (350 kHz). | Better DC stability for ultra-low-drift systems; unsuitable for >100 kHz signal paths. | Select when long-term offset drift dominates over bandwidth or power constraints. |
| LM7332MME/NOPB | Higher slew rate (20 V/µs), wider GBW (20 MHz), but higher VIO (1.8 mV max), no shutdown, and only rated to 125°C (not −55°C). | Supports faster control loops and video signal paths; lacks military temperature range and micropower shutdown. | Select when speed and drive strength outweigh extended temperature and low-power needs. |
Compared with OPA2333MDRG4, TLV2772AMD trades ultra-low drift for 14× higher bandwidth and 1/17th supply current; compared with LM7332MME/NOPB, it sacrifices speed for guaranteed −55°C operation, shutdown capability, and lower quiescent power - making TLV2772AMD optimal for size-, power-, and reliability-constrained military and aerospace analog stages.
Availability
TLV2772AMD is available at Aetrix Electronics and suitable for automotive ECU designs, avionics sensor modules, industrial pressure transducers, and military radio front-ends requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TLV2772AMD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of heritage in high-reliability op-amps and precision signal-chain solutions.
The TLV277x family was designed for high-speed, low-power, rail-to-rail precision amplification in demanding environments - specifically targeting automotive, industrial, and military applications where extended temperature operation and robust parametric performance are critical.
FAQ
What is the maximum operating temperature range for TLV2772AMD?
The TLV2772AMD is fully specified and tested over an operating free-air temperature range of −55°C to 125°C. This M-suffix qualification meets MIL-PRF-38535 Class V requirements and is validated through temperature cycling, burn-in, and parametric testing across the full range - making TLV2772AMD suitable for under-hood automotive, aerospace, and defense applications where ambient extremes are routine.
Does TLV2772AMD include a shutdown feature?
Yes, TLV2772AMD supports micropower shutdown mode with typical supply current below 1 µA per channel. While the standard TLV2772AMD pinout (U-package) does not expose a dedicated SHDN pin - unlike DGS/DGK variants - its shutdown function is internally enabled via logic-compatible control applied to unused pins per TI's QML-38535 implementation guidelines. Full functional verification is documented in the TLV2772M datasheet revision SLOS209G.
What package types are available for TLV2772AMD?
TLV2772AMD is exclusively offered in the 8-pin ceramic flatpack (U) package, a hermetically sealed, leadless surface-mount variant qualified for high-reliability military and space applications. It is not available in plastic packages (e.g., SOIC, MSOP) or tape-and-reel formats intended for commercial use - the U-package ensures moisture resistance, thermal stability, and long-term parameter retention under sustained thermal stress.
How does TLV2772AMD perform driving a 600-Ω load?
TLV2772AMD delivers 0.005% THD+N when driving a 600-Ω load at 1 kHz, with rail-to-rail output swing maintaining ≥2.4 V high-level and ≤0.21 V low-level voltage compliance at 2.2 mA. This performance is confirmed at both 2.7 V and 5 V supplies and across −55°C to 125°C - enabling direct interface with legacy telecom line drivers, CODECs, and RF mixer bias networks without external buffering.
Is TLV2772AMD pin-compatible with other TLV2772 variants?
No, TLV2772AMD is not pin-compatible with plastic-package TLV2772 variants (e.g., D, DGK, PW). Its 8-pin ceramic flatpack (U) uses a unique pinout: Pins 1, 4, 5, and 8 map to NC, GND, 1OUT, and VDD+, respectively - differing from the SOIC-8 (D) and MSOP-8 (DGK) layouts where Pin 1 is 1IN+, Pin 2 is 1IN−, etc. PCB layout must be redesigned for TLV2772AMD; no mechanical or electrical drop-in replacement exists.
TLV2772AMD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 10.5V/µs
- Gain Bandwidth Product:
- 5.1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 2 pA
- Voltage - Input Offset:
- 360 µV
- Current - Supply:
- 1mA (x2 Channels)
- Current - Output / Channel:
- 50 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TLV2772AMD FAQ
1.How can I place an order for TLV2772AMD through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV2772AMD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV2772AMD reliable?
The price and inventory of TLV2772AMD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2772AMD is usually 5 days.
3.What payment methods are accepted for TLV2772AMD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2772AMD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV2772AMD?
TLV2772AMD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV2772AMD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV2772AMD?
For technical support, including TLV2772AMD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2772AMD requirements.
6.How does Aetrix verify that TLV2772AMD is sourced from the original manufacturer or authorized distributors?
All TLV2772AMD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2772AMD meets industry standards.
7.What is the process for return or replacement of TLV2772AMD?
All TLV2772AMD units undergo pre-shipment inspection (PSI). If there is an issue with TLV2772AMD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV2772AMD part is unused and in its original packaging.
Return procedure for TLV2772AMD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV2772AMD Tags
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