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Texas Instruments TLV2772MD
- Part No.:
- TLV2772MD
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLV2772MD.pdf
- Description:
- IC CMOS 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,132
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Product details
Overview
TLV2772MD from Texas Instruments is a dual-channel, rail-to-rail output CMOS operational amplifier optimized for high-speed precision analog signal conditioning in extended-temperature military and aerospace systems. It delivers 10.5 V/µs slew rate, 5.1 MHz gain-bandwidth product, 360 µV input offset voltage (typ), 2 pA input bias current, and operates from 2.5 V to 5.5 V single supply across −55°C to 125°C. It drives ADC reference inputs and telecom line drivers with 0.005% THD+N into 600 Ω.
For engineers reviewing the TLV2772MD datasheet, TLV2772MD pinout, TLV2772MD application, or TLV2772MD equivalent, this page provides verified electrical specifications, military-grade package details (Ceramic Flatpack, U), thermal derating data, shutdown behavior, and real-world use cases in avionics sensor interfaces and ruggedized data acquisition systems.
Technical Context
The TLV2772MD uses a CMOS input stage enabling ultra-low input bias current (2 pA) and high input impedance (>10¹² Ω), paired with a rail-to-rail output stage capable of sourcing/sinking ±2.2 mA while maintaining <0.6 V saturation at 5 V supply. Its 5.1 MHz bandwidth and 10.5 V/µs slew rate support fast-settling, low-distortion amplification in closed-loop configurations up to unity gain.
Designed for −55°C to 125°C operation, the device features guaranteed performance over full temperature range including input offset drift ≤2 µV/°C, CMRR ≥60 dB (full range), and supply voltage rejection ratio ≥70 dB - critical for precision instrumentation in unregulated power environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Slew Rate | 10.5 V/µs typ - enables accurate reproduction of fast transient signals without distortion in active filters or buffer stages. |
| Gain-Bandwidth Product | 5.1 MHz typ - supports stable unity-gain and moderate-gain configurations (e.g., G = 10) up to ~500 kHz. |
| Input Offset Voltage | 360 µV max at 25°C - ensures minimal DC error in precision sensor front-ends and low-level signal amplification. |
| Supply Current per Channel | 1 mA typ at 2.7 V - balances speed and power efficiency for battery-backed or thermally constrained military modules. |
| Operating Temperature Range | −55°C to 125°C - qualified for MIL-PRF-38535 Class K/Q and space-grade applications requiring extreme environmental resilience. |
| Rail-to-Rail Output | Swings within 0.2 V of rails at 2.2 mA load - maximizes dynamic range when interfacing with 12-bit+ SAR ADCs powered from same supply. |
| Total Harmonic Distortion + Noise | 0.005% typ at 1 kHz, RL = 600 Ω - meets telecom line driver requirements and audio-grade signal chain fidelity. |
Pinout & Package
Ceramic Flatpack (U) package, 10-pin, hermetically sealed, leadless, surface-mountable with solderable metallized leads. Designed for high-reliability, low-outgassing environments including avionics and satellite subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | NC | No internal connection - left floating; no PCB trace required. |
| 2 | 2OUT | Inverting amplifier output channel 2 - drives external load or feedback network directly. |
| 3 | NC | No internal connection - electrically isolated; must not be connected. |
| 4 | 2IN− | Inverting input of channel 2 - high-impedance node; guard trace recommended in sensitive layouts. |
| 5 | NC | No internal connection - mechanical pad only; no electrical function. |
| 6 | NC | No internal connection - reserved for internal test; leave unconnected. |
| 7 | 1IN− | Inverting input of channel 1 - referenced to differential pair; matched layout critical for CMRR. |
| 8 | NC | No internal connection - structural pad; no routing needed. |
| 9 | 1IN+ | Non-inverting input of channel 1 - accepts high-impedance sensor or reference signals with minimal loading. |
| 10 | NC | No internal connection - mechanical anchor; no electrical tie. |
| 11 | NC | No internal connection - unused terminal; avoid routing or grounding. |
| 12 | 1OUT | Inverting amplifier output channel 1 - drives ADC reference or analog multiplexer with rail-to-rail swing. |
| 13 | NC | No internal connection - isolation pad; no PCB connection required. |
| 14 | 2IN+ | Non-inverting input of channel 2 - independent high-Z node for second sensor or signal path. |
| 15 | NC | No internal connection - filler pad; ignore in layout. |
| 16 | NC | No internal connection - mechanical feature only. |
| 17 | NC | No internal connection - no internal bond wire; leave open. |
| 18 | NC | No internal connection - thermal pad variant not present; no heatsink attachment. |
| 19 | VDD+ | Positive supply rail - decoupling capacitor (0.1 µF X7R) required within 2 mm of pin for stability. |
| 20 | GND | Analog ground reference - connect to clean, low-impedance ground plane; separate from digital return if possible. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Delivers full-scale signal headroom into 600 Ω loads, preserving SNR when driving ADC references or DAC buffers. |
| 10.5 V/µs slew rate + 5.1 MHz GBW | Enables fast settling (<0.6 µs to 0.01%) in data acquisition front-ends without sacrificing DC precision. |
| 2 pA input bias current | Minimizes voltage error across high-value sensor resistors (e.g., RTDs, piezoresistive bridges) in cold-junction compensation circuits. |
| −55°C to 125°C operation | Qualified per MIL-PRF-38535 QML Class Q/M - eliminates derating concerns in engine bay, radar, or space payload electronics. |
| 0.005% THD+N @ 1 kHz | Meets ITU-T G.712 linearity specs for voiceband and narrowband telecom signal paths. |
| 360 µV input offset voltage (max) | Reduces calibration overhead in multi-channel sensor arrays where channel matching is critical. |
Applications
| Avionics Sensor Signal Conditioning | High-Reliability Data Acquisition Front-End |
|---|---|
|
Use Scenario: Amplifying low-level outputs from MEMS accelerometers and pressure transducers in flight control units. IC Role / Device Role / Timing Role: Dual-channel precision buffer and gain stage before 16-bit SAR ADC sampling at 100 kSPS. Use Value: Rail-to-rail output ensures full utilization of ADC input range; 2 pA bias current prevents drift in 100 kΩ bridge configurations. |
Use Scenario: Signal conditioning for distributed temperature monitoring in turbine engine compartments. IC Role / Device Role / Timing Role: Cold-junction compensation amplifier and RTD excitation buffer in Class K thermocouple measurement modules. Use Value: −55°C to 125°C guaranteed operation eliminates need for external heating/cooling; 360 µV offset minimizes calibration frequency. |
| Military Radio IF Chain Buffer | Spacecraft Telemetry Analog Interface |
|
Use Scenario: Driving 600 Ω analog IF outputs in SDR transceivers operating in harsh EMI environments. IC Role / Device Role / Timing Role: Low-distortion line driver between mixer and anti-alias filter in 2–30 MHz HF/VHF receivers. Use Value: 0.005% THD+N preserves modulation fidelity; ceramic flatpack package resists radiation-induced parametric shift. |
Use Scenario: Analog interface for radiation-hardened telemetry sensors in LEO satellite payloads. IC Role / Device Role / Timing Role: Precision voltage follower for photodiode current-to-voltage conversion in star tracker focal planes. Use Value: Hermetic ceramic package prevents outgassing contamination; 17 nV/√Hz noise floor maintains photon-counting resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel precision op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OPA2333MDRG4 | Zero-drift architecture (0.02 µV/°C offset drift), lower noise (1.1 µVpp), but slower slew rate (0.16 V/µs) and narrower bandwidth (350 kHz). | Better for ultra-stable DC-coupled sensor nodes; unsuitable for >100 kHz signal paths or fast-settling ADC drivers. | Select OPA2333MDRG4 only when long-term DC stability outweighs speed requirements - not a drop-in replacement. |
| LMC6482IMX/NOPB | CMOS input (1 fA bias), wider supply range (3–15 V), but lower slew rate (1.3 V/µs), higher offset (1.5 mV), and no military temp grade. | Acceptable for commercial industrial controls; lacks −55°C rating and radiation-tolerant packaging for aerospace deployment. | LMC6482IMX/NOPB may serve as cost-sensitive alternative in non-military designs, but requires full requalification for thermal and reliability margins. |
Compared with TLV2772MD, OPA2333MDRG4 trades speed for ultra-low drift, while LMC6482IMX/NOPB offers broader voltage range but fails to meet military temperature and packaging requirements - making TLV2772MD uniquely suited for high-speed, high-reliability analog signal chains in defense and space systems.
Availability
TLV2772MD is available at Aetrix Electronics and suitable for avionics sensor interfaces, military radio IF stages, spacecraft telemetry analog interfaces, and high-reliability data acquisition front-ends requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TLV2772MD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of heritage in high-reliability military and aerospace components.
The TLV2772MD belongs to TI's TLV277x family of high-speed, rail-to-rail CMOS op-amps engineered specifically for precision analog signal conditioning in extreme-environment applications - including defense electronics, avionics, and space systems.
FAQ
What is the maximum operating temperature range for the TLV2772MD?
The TLV2772MD is fully specified and qualified for continuous operation from −55°C to 125°C. This range is validated per MIL-PRF-38535 Class M requirements and includes guaranteed performance for input offset voltage, CMRR, and output drive capability across the entire span - essential for engine-mounted or space-exposed electronics where ambient extremes are unavoidable.
Does the TLV2772MD include a shutdown feature?
No, the TLV2772MD does not incorporate a shutdown function. Unlike variants such as TLV2772CD or TLV2772ID, the M-suffix ceramic flatpack version omits the SHDN pin to maximize die area for analog performance and reliability in hermetic packaging. Power management must be handled externally via supply sequencing or discrete FET switching on VDD+.
What is the input common-mode voltage range for TLV2772MD at 5 V supply?
At VDD = 5 V, the TLV2772MD supports an input common-mode voltage range from −0.3 V to VDD − 1.3 V (i.e., −0.3 V to 3.7 V), as confirmed in the "Recommended Operating Conditions" table. This allows operation with inputs below ground (e.g., AC-coupled signals with negative excursions) and maintains CMRR >60 dB across the full specified temperature range.
Can TLV2772MD drive a 600 Ω load with rail-to-rail output swing?
Yes, the TLV2772MD delivers true rail-to-rail output swing into 600 Ω loads: at VDD = 5 V, VOH ≥4.4 V and VOL ≤0.6 V under 4.2 mA sourcing/sinking conditions. This capability is explicitly characterized in the Electrical Characteristics tables and enables direct interfacing with legacy telecom line standards and precision ADC reference inputs without level-shifting circuitry.
Is the TLV2772MD pin-compatible with other TLV2772 variants like TLV2772CD or TLV2772ID?
No, the TLV2772MD is not pin-compatible with plastic-package variants. Its 10-pin Ceramic Flatpack (U) footprint differs mechanically and electrically from the 8-pin SOIC (D), MSOP (DGK), or PDIP (P) packages - which include dedicated SHDN pins and different pinouts. Layout redesign and schematic revision are required when substituting TLV2772MD into designs originally using plastic-package TLV2772 devices.
TLV2772MD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 10.5V/µs
- Gain Bandwidth Product:
- 5.1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 2 pA
- Voltage - Input Offset:
- 360 µV
- Current - Supply:
- 1mA (x2 Channels)
- Current - Output / Channel:
- 50 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TLV2772MD FAQ
1.How can I place an order for TLV2772MD through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV2772MD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV2772MD reliable?
The price and inventory of TLV2772MD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2772MD is usually 5 days.
3.What payment methods are accepted for TLV2772MD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2772MD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV2772MD?
TLV2772MD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV2772MD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV2772MD?
For technical support, including TLV2772MD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2772MD requirements.
6.How does Aetrix verify that TLV2772MD is sourced from the original manufacturer or authorized distributors?
All TLV2772MD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2772MD meets industry standards.
7.What is the process for return or replacement of TLV2772MD?
All TLV2772MD units undergo pre-shipment inspection (PSI). If there is an issue with TLV2772MD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV2772MD part is unused and in its original packaging.
Return procedure for TLV2772MD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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