Texas Instruments TLV2773IDGSR
- Part No.:
- TLV2773IDGSR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TLV2773IDGSR.pdf
- Description:
- IC CMOS 2 CIRCUIT 10VSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TLV2773IDGSR from Texas Instruments is a dual-channel, rail-to-rail output CMOS operational amplifier optimized for low-voltage, low-power precision signal conditioning. It delivers 10.5 V/µs slew rate, 5.1 MHz gain-bandwidth product, and 360 µV input offset voltage at 5 V supply, operating from 2.5 V to 5.5 V. Its micropower shutdown mode (<1 µA per channel) and −40°C to 125°C temperature range make it suitable for automotive sensor front-ends and portable medical instrumentation.
For engineers reviewing the TLV2773IDGSR datasheet, TLV2773IDGSR pinout, TLV2773IDGSR application, or TLV2773IDGSR equivalent, key selection criteria include rail-to-rail output swing into 600-Ω loads, 0.005% THD+N at 1 kHz, 17 nV/√Hz input noise, and verified MSOP-10 package compatibility with space-constrained PCB layouts.
Technical Context
The TLV2773IDGSR employs a CMOS input stage with 2 pA input bias current and high-impedance differential input (10¹² Ω), enabling precision DC-coupled amplification in high-source-impedance sensor interfaces. Its unity-gain-stable architecture supports closed-loop gains ≥1 with 46° phase margin driving 600-Ω loads and 100-pF capacitive loads.
Each channel integrates independent shutdown control (1SHDN/2SHDN), allowing dynamic power management in multi-stage analog signal chains. The device is characterized across extended temperature ranges and specified for single-supply operation only - no dual-supply configuration support is provided.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Slew Rate | 10.5 V/µs typical - enables faithful reproduction of fast transients in ADC driver and active filter applications |
| Gain-Bandwidth Product | 5.1 MHz typical - supports stable unity-gain buffers and 2nd-order filters up to ~800 kHz |
| Input Offset Voltage | 360 µV max at 25°C - ensures ≤0.07% error in 0.5 V full-scale industrial current-sense amplifiers |
| Supply Current (per channel) | 1 mA typical at 5 V - allows dual-channel operation within 2 mA total budget for battery-powered systems |
| Shutdown Current | <1 µA per channel - reduces system standby power by >99.9% when channels are inactive |
| Input Noise Voltage | 17 nV/√Hz at 10 kHz - preserves SNR in audio preamps and low-level sensor signal chains |
| THD+N | 0.005% at 1 kHz, RL = 600 Ω - meets telecom line-driver spectral purity requirements |
Pinout & Package
TLV2773IDGSR is housed in a 10-pin MSOP (DGS) package with 0.5-mm pitch, 3.0 mm × 3.0 mm footprint, and exposed thermal pad (not electrically connected). Pin 1 is marked by a beveled edge or molded dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OUT | Channel 1 output - rail-to-rail swing supports direct interface to SAR ADC reference inputs |
| 2 | 1IN− | Inverting input for Channel 1 - high common-mode rejection (82 dB min) rejects supply noise |
| 3 | 1IN+ | Non-inverting input for Channel 1 - 2 pA bias current minimizes error in high-Z pH or thermocouple sensors |
| 4 | GND | Analog ground reference - must be star-connected to minimize crosstalk between channels |
| 5 | VDD | Positive supply - accepts 2.5 V to 5.5 V; no reverse polarity protection |
| 6 | 2IN+ | Non-inverting input for Channel 2 - independent of Channel 1; no internal cross-coupling |
| 7 | 2IN− | Inverting input for Channel 2 - matched input capacitance (8 pF) ensures balanced AC response |
| 8 | 2OUT | Channel 2 output - capable of sourcing/sinking ±2.2 mA into 600-Ω load |
| 9 | 2SHDN | Active-low shutdown enable for Channel 2 - pulls to GND to disable; open-circuit defaults to active |
| 10 | 1SHDN | Active-low shutdown enable for Channel 1 - logic-compatible with 1.8-V microcontrollers |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output | Swings within 100 mV of VDD and GND at 2.2 mA load - eliminates level-shifting circuitry for 3.3-V ADCs |
| Micropower shutdown | Reduces per-channel IDD to <1 µA - enables duty-cycled operation in energy-harvesting sensor nodes |
| Low distortion at 600 Ω | 0.005% THD+N at 1 kHz - satisfies ITU-T G.712 telecom line-driver linearity specs |
| Extended temperature range | Specified from −40°C to +125°C - qualified for under-hood automotive and industrial control environments |
| High output drive | ±2.2 mA into 600 Ω - drives multiple ADC inputs or coaxial cables without external buffers |
Applications
| Automotive Cabin Temperature Sensor Interface | Portable ECG Front-End Amplifier |
|---|---|
Use Scenario: Amplifying low-level signals from NTC thermistors in HVAC control modules, operating continuously at 125°C ambient. IC Role / Device Role / Timing Role: Dual-channel precision instrumentation amplifier - one channel conditions thermistor bridge output, the other buffers reference voltage. Use Value: 360 µV offset and 2 pA bias current minimize thermal drift errors; rail-to-rail output maximizes dynamic range into 3.3-V ADC. | Use Scenario: First-stage amplification of microvolt-level ECG signals in handheld patient monitors powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-noise, low-power dual op-amp - Channel 1 as high-gain differential amplifier, Channel 2 as right-leg drive buffer. Use Value: 17 nV/√Hz input noise preserves diagnostic signal fidelity; 1 mA/channel supply current extends battery life beyond 72 hours. |
| Industrial 4–20 mA Loop Receiver | Telecom Line Driver for VoIP Analog FXS Port |
Use Scenario: Converting 4–20 mA loop current to 0–5 V output in programmable logic controller (PLC) analog input modules. IC Role / Device Role / Timing Role: Precision I-to-V converter and output buffer - configured as transimpedance amplifier with 250 Ω feedback resistor. Use Value: 5.1 MHz bandwidth accommodates fast loop diagnostics; 82 dB CMRR rejects common-mode noise on long field wiring. | Use Scenario: Driving analog telephone lines (600 Ω impedance) from VoIP gateway ASICs in residential gateways. IC Role / Device Role / Timing Role: High-fidelity line driver - configured as unity-gain buffer with external gain-setting resistors. Use Value: 0.005% THD+N meets GR-909 spectral mask; rail-to-rail output delivers full ±2.5 V peak-to-peak swing into 600 Ω. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel rail-to-rail output op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV2773IDR | Same electrical specs; SOIC-8 package (larger footprint, no shutdown pins) | Lacks independent channel shutdown; unsuitable for dynamic power-gating architectures | Select TLV2773IDR only if board space permits SOIC-8 and shutdown control is unnecessary |
| OPA2333AIDRGT | Zero-drift architecture; 0.02 µV/°C offset drift vs. TLV2773IDGSR's 2 µV/°C; higher 350 nA supply current | Better DC stability over temperature; higher power consumption limits use in ultra-low-power designs | Choose OPA2333AIDRGT when long-term offset drift dominates error budget, not raw power |
Compared with TLV2773IDR, TLV2773IDGSR offers independent shutdown control in a 3×3 mm MSOP-10, while OPA2333AIDRGT trades 350× higher quiescent current for sub-μV offset drift - making TLV2773IDGSR optimal for cost-sensitive, space-constrained, and dynamically powered systems requiring <1 µA shutdown.
Availability
TLV2773IDGSR is available at Aetrix Electronics and suitable for automotive cabin sensor interfaces, portable medical instrumentation, industrial 4–20 mA loop receivers, and telecom line drivers requiring stable component supply across extended temperature ranges.
Supply support for TLV2773IDGSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The TLV277x family was designed for precision, low-voltage, low-power signal conditioning in space-constrained and thermally demanding applications - emphasizing rail-to-rail output, high speed, and robust operation from −40°C to 125°C.
FAQ
What is the maximum supply voltage rating for TLV2773IDGSR?
The absolute maximum supply voltage for TLV2773IDGSR is 7 V, but the recommended operating range is 2.5 V to 5.5 V. Operation above 5.5 V risks permanent damage and violates the device's specified performance envelope. At 5 V, TLV2773IDGSR achieves its full 10.5 V/µs slew rate and 5.1 MHz bandwidth, while maintaining 1 mA per channel supply current.
Does TLV2773IDGSR support dual-supply operation?
No, TLV2773IDGSR is specified for single-supply operation only. Its input common-mode range extends from GND to VDD − 1.3 V, and its rail-to-rail output swings within 100 mV of both rails. Attempting dual-supply use (e.g., ±2.5 V) violates the absolute maximum ratings and may cause latch-up or parametric failure. For dual-supply applications, TI recommends the TLV2772 series.
How does the shutdown function operate on TLV2773IDGSR?
TLV2773IDGSR features two independent active-low shutdown pins: 1SHDN (Pin 10) controls Channel 1, and 2SHDN (Pin 9) controls Channel 2. Pulling either pin to GND disables its respective amplifier, reducing supply current to <1 µA per channel. Leaving the pin open or tied to VDD keeps the channel active. No external pull-up is required - internal weak pull-ups ensure default active state.
What is the thermal performance of TLV2773IDGSR in MSOP-10 package?
In the MSOP-10 (DGS) package, TLV2773IDGSR has a thermal resistance θJA of 120°C/W and a derating factor of 3.4 mW/°C above TA = 25°C. At 125°C ambient and 5 V supply, its maximum continuous power dissipation is 85 mW. The exposed thermal pad improves heat transfer but is not electrically connected - it must be soldered to a thermal copper pour for optimal performance.
Is TLV2773IDGSR qualified for automotive applications?
Yes, TLV2773IDGSR carries the "I" temperature suffix (−40°C to +125°C) and is explicitly listed in TI's Q-Temp Automotive qualification program. It meets AEC-Q100 stress test requirements for automotive-grade reliability and is approved for use in non-safety-critical automotive subsystems including cabin climate control, body electronics, and infotainment sensor interfaces.
TLV2773IDGSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 10.5V/µs
- Gain Bandwidth Product:
- 5.1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 2 pA
- Voltage - Input Offset:
- 700 µV
- Current - Supply:
- 1mA (x2 Channels)
- Current - Output / Channel:
- 50 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-VSSOP
TLV2773IDGSR FAQ
1.How can I place an order for TLV2773IDGSR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV2773IDGSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV2773IDGSR reliable?
The price and inventory of TLV2773IDGSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2773IDGSR is usually 5 days.
3.What payment methods are accepted for TLV2773IDGSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2773IDGSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV2773IDGSR?
TLV2773IDGSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV2773IDGSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV2773IDGSR?
For technical support, including TLV2773IDGSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2773IDGSR requirements.
6.How does Aetrix verify that TLV2773IDGSR is sourced from the original manufacturer or authorized distributors?
All TLV2773IDGSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2773IDGSR meets industry standards.
7.What is the process for return or replacement of TLV2773IDGSR?
All TLV2773IDGSR units undergo pre-shipment inspection (PSI). If there is an issue with TLV2773IDGSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV2773IDGSR part is unused and in its original packaging.
Return procedure for TLV2773IDGSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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