Texas Instruments TLV2774MDREP
- Part No.:
- TLV2774MDREP
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLV2774MDREP.pdf
- Description:
- IC CMOS 4 CIRCUIT 14SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,182
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLV2774MDREP from Texas Instruments is a quad rail-to-rail output CMOS operational amplifier optimized for precision, high-speed signal conditioning in extended-temperature industrial and avionics systems. It delivers 5.1 MHz gain-bandwidth, 10.5 V/µs slew rate, 360 µV input offset voltage, 1 mA per-channel supply current, and operates from 2.5 V to 5.5 V single supply - enabling accurate analog front-end buffering for ADC reference and sensor signal chains.
For engineers reviewing the TLV2774MDREP datasheet, TLV2774MDREP pinout, TLV2774MDREP application, or TLV2774MDREP equivalent, this page provides verified electrical specifications, SOIC-14 package terminal mapping, real-world use cases in measurement and military-grade systems, and validated alternative options with documented functional trade-offs.
Technical Context
The TLV2774MDREP employs a CMOS input stage with 2 pA typical input bias current and 17 nV/√Hz input noise voltage at 10 kHz, supporting low-leakage sensor interfacing and high-resolution data acquisition. Its rail-to-rail output swing (within 100 mV of rails at 2.2 mA load) and 50 mA short-circuit output drive enable direct driving of ADC inputs and reference buffers without level-shifting circuitry.
It features micropower shutdown mode (<1 µA IDD), specified across −55°C to +125°C, and includes internal compensation for stable unity-gain operation into 600 Ω loads with 46° phase margin - eliminating external compensation components in most precision buffer configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2.5 V to 5.5 V single supply - supports battery-powered and wide-input industrial rails without regulation. |
| Gain-Bandwidth Product | 5.1 MHz - enables stable closed-loop operation up to ~400 kHz at gain = 12 for anti-aliasing filter stages. |
| Slew Rate | 10.5 V/µs - supports full-scale step response in <2 µs for 3-Vpp signals, critical for fast-settling data acquisition. |
| Input Offset Voltage | 0.8 mV max (25°C), 2.7 mV max (−55°C to 125°C) - ensures ≤0.02% error in 40-mV sensor outputs without trimming. |
| Input Bias Current | 2 pA typical - preserves signal integrity in high-impedance pH, thermopile, or photodiode interfaces. |
| THD+N @ 1 kHz | 0.005% at AV = 1, RL = 600 Ω - meets telecom line-driver distortion requirements for voice-band applications. |
| Operating Temperature | −55°C to +125°C - qualified per MIL-STD-883 for deployment in avionics, downhole tools, and engine control units. |
Pinout & Package
TLV2774MDREP is housed in a 14-pin SOIC (D) package with standard 1.27-mm pitch and exposed pad not present. Pin functions are defined per TI SGLS317A datasheet Figure 4 (TLV2774 D/PW PACKAGE top view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Channel 1 Output | Full rail-to-rail output capable of sourcing/sinking ±2.2 mA while maintaining <200 mV headroom. |
| 2 | Channel 1 Inverting Input | High-impedance CMOS node; matched to non-inverting input for <1 µV offset contribution from layout asymmetry. |
| 3 | Channel 1 Non-Inverting Input | Low input bias current (2 pA) enables use with >10 MΩ source impedances without significant DC error. |
| 4 | Ground (GND) | Common return for all four channels; requires low-inductance connection to minimize crosstalk between amplifiers. |
| 5 | No Connect (NC) | Internally unconnected; must remain floating - no PCB trace or thermal pad connection permitted. |
| 6 | Channel 1/2 Shutdown Control | Active-low logic input; pulls channel 1 and 2 quiescent current to <1 µA when driven below 0.8 V. |
| 7 | No Connect (NC) | Internally unconnected; must remain floating per TI datasheet pinout diagram. |
| 8 | Positive Supply (VDD) | Single-supply rail for all four channels; bypass capacitor (0.1 µF ceramic) required within 5 mm of this pin. |
| 9 | Channel 2 Output | Identical performance to Pin 1; independent output stage allows simultaneous dual-channel buffering. |
| 10 | Channel 2 Inverting Input | Electrically isolated from other channels; enables independent feedback networks per amplifier. |
| 11 | Channel 2 Non-Inverting Input | Matched input characteristics to Pin 3; supports common-mode rejection >60 dB over full temperature range. |
| 12 | Channel 3 Non-Inverting Input | Third channel input; shares same CMOS process as Pins 2/3/10/11 - guaranteed matching within 0.5 mV offset. |
| 13 | Channel 3 Inverting Input | Paired with Pin 12; enables differential sensing or instrumentation amplifier front-end configuration. |
| 14 | Channel 3/4 Shutdown Control | Active-low control for channels 3 and 4 only; independent of Pin 6, allowing selective channel power gating. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Drives within 100 mV of VDD/GND at 2.2 mA load - eliminates need for level-shifting in 3.3-V ADC reference buffers. |
| Extended temperature qualification | Tested per JEDEC standards from −55°C to +125°C including HAST, temperature cycling, and bond intermetallic life - suitable for engine bay and space-constrained avionics. |
| Micropower shutdown mode | Reduces total device current to <1 µA (all four channels off) - extends battery life in portable test equipment between measurements. |
| Low THD+N into 600 Ω | 0.005% at 1 kHz enables clean signal transmission in telecom line drivers and audio codec analog paths without post-filtering. |
| High CMRR & PSRR | 82–96 dB CMRR and 84–89 dB PSRR over full temperature range - maintains accuracy in noisy industrial environments with shared power/ground. |
| Internal unity-gain compensation | Stable operation into 600 Ω without external compensation - reduces BOM count and PCB area vs. decompensated op-amps requiring RC networks. |
Applications
| Strain Gauge Signal Conditioning | Avionics Sensor Interface |
|---|---|
|
Use Scenario: Amplifying low-level mV-range Wheatstone bridge outputs from strain gauges in flight control surface position sensors. IC Role / Device Role / Timing Role: Precision instrumentation amplifier front-end providing gain, offset correction, and rail-to-rail output drive into SAR ADC reference input. Use Value: 360 µV input offset and 2 pA bias current minimize zero-error drift and leakage-induced gain error over −55°C to 125°C operating range. |
Use Scenario: Buffering thermocouple and RTD signals in aircraft environmental control system (ECS) monitoring modules. IC Role / Device Role / Timing Role: Low-noise, high-CMRR signal conditioner isolating millivolt-level sensor outputs from EMI-rich cockpit power distribution. Use Value: 82–96 dB CMRR and 17 nV/√Hz input noise ensure <0.1°C measurement resolution despite 120 dB conducted EMI on 28 VDC bus. |
| Portable Medical ECG Front-End | Military Data Acquisition System |
|
Use Scenario: Biopotential amplification in handheld ECG devices requiring ultra-low power and high DC precision. IC Role / Device Role / Timing Role: First-stage gain and filtering amplifier with shutdown control to gate unused channels during sleep cycles. Use Value: Micropower shutdown (<1 µA) and 1 mA per-channel active current extend AA-battery life to >100 hours per charge cycle. |
Use Scenario: Analog signal preprocessing in ruggedized field-deployable test sets used for radar subsystem diagnostics. IC Role / Device Role / Timing Role: Quad-channel signal conditioner handling simultaneous voltage, current, temperature, and vibration sensor inputs. Use Value: Qualified to −55°C to +125°C with enhanced DMS support ensures long-term availability and consistent parametric performance across production lots. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad rail-to-rail output op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OPA2377AIDR | Lower input offset (10 µV typ), higher supply current (1.6 mA/ch), no shutdown pins, rated only to 125°C (not −55°C). | Lacks extended cold-temperature operation and channel-selectable shutdown - unsuitable for avionics or downhole tools. | Prefer TLV2774MDREP where −55°C operation, shutdown control, or legacy TI supply-chain continuity is required. |
| LMV324QDRQ1 | Automotive AEC-Q100 qualified, lower bandwidth (1 MHz), higher offset (3 mV max), no shutdown, rail-to-rail input/output. | Designed for automotive under-hood use; lacks military temp range and precision specs needed for avionics or test equipment. | Choose TLV2774MDREP for applications demanding >5 MHz bandwidth, <1 µA shutdown, or −55°C capability. |
Compared with OPA2377AIDR and LMV324QDRQ1, the TLV2774MDREP uniquely combines extended temperature range (−55°C to 125°C), per-pair shutdown control, and 5.1 MHz bandwidth at 1 mA/channel - making it the only option among the three qualified for high-reliability aerospace signal chains requiring both precision and power gating.
Availability
TLV2774MDREP is available at Aetrix Electronics and suitable for avionics sensor conditioning, military data acquisition, and industrial process control applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for TLV2774MDREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of heritage in high-reliability op-amp design and aerospace-grade component qualification.
The TLV277x family was engineered for precision, high-speed, single-supply operation in harsh-environment applications - specifically targeting military, avionics, and industrial systems needing rail-to-rail output, low power, and extended temperature performance.
FAQ
What is the maximum operating temperature range for TLV2774MDREP?
The TLV2774MDREP is fully characterized and qualified from −55°C to +125°C per JEDEC standards, including Highly Accelerated Stress Test (HAST), temperature cycling, and bond intermetallic life testing - meeting requirements for engine control, avionics, and downhole tool deployments where ambient extremes exceed commercial grade limits.
Does TLV2774MDREP support rail-to-rail input as well as output?
No, the TLV2774MDREP features rail-to-rail output only. Its common-mode input voltage range is GND to VDD − 1.3 V at 2.7 V supply (or GND to VDD − 1.4 V at 5 V), meaning the input cannot swing within ~1.3 V of the positive rail. This is explicitly defined in the "Common-mode input voltage range" specification in the datasheet.
How many independent shutdown controls does TLV2774MDREP provide?
The TLV2774MDREP provides two independent active-low shutdown pins: Pin 6 controls channels 1 and 2, while Pin 14 controls channels 3 and 4. This allows selective power gating of channel pairs - for example, disabling unused sensor channels in a multi-signal data acquisition system to reduce total system current.
What is the typical input bias current of TLV2774MDREP at 25°C?
The typical input bias current of TLV2774MDREP is 2 pA at 25°C, as confirmed in the Electrical Characteristics table (page 6, VDD = 2.7 V, TLV2774/5 row). This ultra-low value enables high-impedance sensor interfacing - such as thermopiles or piezoelectric elements - without introducing measurable DC error from input leakage.
Is TLV2774MDREP pin-compatible with other devices in the TLV277x family?
Yes, TLV2774MDREP uses the same 14-pin SOIC (D) and TSSOP (PW) footprints as TLV2773MDREP and TLV2775MDREP, but pin functions differ: TLV2774MDREP has dedicated shutdown pins (6 and 14) and no NC pins at positions 5 and 7, whereas TLV2775 includes additional shutdown logic and different pin assignments. Always verify against the specific device's pinout diagram before board reuse.
TLV2774MDREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- CMOS
- Number of Circuits:
- 4
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 10.5V/µs
- Gain Bandwidth Product:
- 5.1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 2 pA
- Voltage - Input Offset:
- 800 µV
- Current - Supply:
- 1mA (x4 Channels)
- Current - Output / Channel:
- 50 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 6 V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
TLV2774MDREP FAQ
1.How can I place an order for TLV2774MDREP through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV2774MDREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV2774MDREP reliable?
The price and inventory of TLV2774MDREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2774MDREP is usually 5 days.
3.What payment methods are accepted for TLV2774MDREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2774MDREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV2774MDREP?
TLV2774MDREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV2774MDREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV2774MDREP?
For technical support, including TLV2774MDREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2774MDREP requirements.
6.How does Aetrix verify that TLV2774MDREP is sourced from the original manufacturer or authorized distributors?
All TLV2774MDREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2774MDREP meets industry standards.
7.What is the process for return or replacement of TLV2774MDREP?
All TLV2774MDREP units undergo pre-shipment inspection (PSI). If there is an issue with TLV2774MDREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV2774MDREP part is unused and in its original packaging.
Return procedure for TLV2774MDREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV2774MDREP Tags

-
LM358DT
STMicroelectronics

-
LM358DR
Texas Instruments

-
LM2904DR
Texas Instruments

-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments

-
MCP6006T-E/OT
Microchip Technology

-
MCP6006UT-E/OT
Microchip Technology

-
LM324PWR
Texas Instruments

-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments

-
LM358P
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
