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Texas Instruments TLV2782CDGKR

Part No.:
TLV2782CDGKR
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTLV2782CDGKR.pdf
Description:
IC OPAMP GP 2 CIRCUIT 8VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,413

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Product details

Overview

TLV2782CDGKR from Texas Instruments is a dual rail-to-rail input/output operational amplifier optimized for low-voltage, low-power applications. It operates from 1.8 V to 3.6 V, delivers 8 MHz gain-bandwidth, 4.8 V/µs slew rate at 2.7 V, and draws only 650 µA per channel - enabling high-speed signal conditioning in battery-powered sensor interfaces and portable data acquisition systems.

For engineers reviewing the TLV2782CDGKR datasheet, TLV2782CDGKR pinout, TLV2782CDGKR application, or TLV2782CDGKR equivalent, key selection criteria include its rail-to-rail I/O swing down to 1.8 V supply, −0.2 V to VDD+0.2 V common-mode input range, 9 nV/√Hz input noise at 10 kHz, shutdown capability (900 nA/channel), and MSOP-8 packaging for space-constrained designs.

Technical Context

The TLV2782CDGKR implements a CMOS input stage with rail-to-rail input common-mode range extending 0.2 V beyond both supply rails and rail-to-rail output swing within 180 mV of each rail at 1.8 V supply. Its 8 MHz unity-gain bandwidth is achieved with only 650 µA per channel, enabled by optimized transconductance and compensation design.

It features an active shutdown function (SHDN pin) that reduces supply current to 900 nA per channel and places outputs in high-impedance state - critical for power-gated stages in portable instrumentation. The device supports operation across 0°C to 70°C (C-suffix) and meets industrial-grade thermal stability with <8 µV/°C input offset drift.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage Range1.8 V to 3.6 V - enables direct operation from two alkaline or NiMH cells without regulation.
Gain-Bandwidth Product8 MHz - supports stable closed-loop gain ≥10 up to ~800 kHz with adequate phase margin.
Slew Rate4.8 V/µs at VDD = 2.7 V - allows full-scale 1-V step response in ≤210 ns, suitable for 12-bit DAC buffering.
Input Noise Voltage9 nV/√Hz at 10 kHz - preserves SNR in precision analog front-ends for 16-bit ADC drivers.
Input Offset Voltage3000 µV max (25°C), 4500 µV max (full range) - defines minimum resolvable DC signal in sensor amplification.
Shutdown Current900 nA per channel - reduces system standby power by >99.8% vs active mode (650 µA).
Common-Mode Input Range−0.2 V to VDD+0.2 V - accepts inputs below ground or above supply, simplifying level-shifting circuits.

Pinout & Package

TLV2782CDGKR is housed in an 8-pin MSOP (DGK) package - 3.0 mm × 3.0 mm × 1.0 mm body, 0.65 mm pitch - optimized for high-density PCB layouts and automated assembly.

Pin/TerminalCircuit RoleDesign Meaning
1 (OUT1)Channel 1 outputDelivers rail-to-rail voltage swing; high-impedance during shutdown.
2 (IN−1)Channel 1 inverting inputHigh-impedance CMOS node; requires short trace routing to minimize noise pickup.
3 (IN+1)Channel 1 noninverting inputAccepts signals from −0.2 V to VDD+0.2 V; matches IN−1 bias current (2.5 pA typ).
4 (GND)Analog ground referenceSingle ground connection shared by both channels; must connect to low-impedance ground plane.
5 (SHDN)Channel 1 shutdown controlActive-low logic input; <0.6 V disables amp, >2 V enables; floating = enabled.
6 (VDD)Positive supply railAccepts 1.8–3.6 V; requires local 0.1 µF ceramic + 6.8 µF tantalum decoupling.
7 (OUT2)Channel 2 outputIndependent rail-to-rail output; high-Z when SHDN asserted (shared control with Pin 5).
8 (IN−2)Channel 2 inverting inputElectrically isolated from Channel 1; same bias and noise specs as IN−1.

Key Features

FeatureDesign Value
Rail-to-rail I/OEnables full dynamic range utilization in single-supply systems - e.g., 0–1.8 V input → 0–1.8 V output with <180 mV headroom.
Ultra-low supply current650 µA per channel at 1.8 V allows continuous operation for >1 year on a CR2032 coin cell in always-on sensor nodes.
Wide supply range1.8–3.6 V operation eliminates need for LDOs in multi-cell or Li-ion–based portable equipment.
Integrated shutdownReduces total quiescent current to <2 µA for dual-channel configuration - critical for energy harvesting systems.
Low input bias current2.5 pA typical enables high-impedance source interfacing (e.g., pH electrodes, piezoelectric sensors) without significant error.

Applications

Portable Medical SensorsIndustrial Data Acquisition

Use Scenario: Amplifying microvolt-level ECG or EEG signals in handheld patient monitors with coin-cell power.

IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier front-end with one channel for signal path and second for reference/offset cancellation.

Use Value: Rail-to-rail I/O and 9 nV/√Hz noise preserve weak biological signal integrity; 650 µA/channel extends battery life beyond 72 hours.

Use Scenario: Conditioning thermocouple or RTD outputs in modular PLC I/O modules operating from 3.3 V backplane rails.

IC Role / Device Role / Timing Role: Precision buffer and level shifter between sensor bridge and SAR ADC input.

Use Value: −0.2 V to VDD+0.2 V VICR accommodates cold-junction compensation offsets; 8 MHz GBW supports oversampling at 1 MSPS ADC rates.

Wireless Sensor NodesAutomotive Cabin Monitoring

Use Scenario: Signal conditioning for MEMS microphone or accelerometer in Bluetooth LE–enabled environmental sensors.

IC Role / Device Role / Timing Role: Low-noise preamplifier with shutdown controlled by MCU GPIO to gate power between wake cycles.

Use Value: 900 nA shutdown current minimizes sleep-mode drain; 4.8 V/µs slew rate supports audio-band transient fidelity up to 20 kHz.

Use Scenario: Occupancy detection using IR pyroelectric sensors in automotive HVAC control units.

IC Role / Device Role / Timing Role: AC-coupled amplifier with adjustable gain for pulse-shaped IR signal bursts.

Use Value: 3000 µV max VIO ensures reliable detection of small ΔT signals; 0°C to 70°C rating matches cabin ambient specification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TLV2782CDRSame die, SOIC-8 package (4.9 mm × 3.9 mm); no shutdown pin; fixed 3000 µV VIO max.Lacks shutdown control; larger footprint; suited for cost-sensitive, non-battery applications.Select when board space permits larger package and shutdown is unnecessary.
OPA2333AIDGKRZero-drift architecture; 0.02 µV/°C offset drift; 17 µV max VIO; 1.8 V to 5.5 V supply; no shutdown.Superior DC precision but higher 17 µA supply current; no power gating capability.Select when ultra-low drift dominates over power consumption and shutdown is not required.

Compared with TLV2782CDR and OPA2333AIDGKR, TLV2782CDGKR uniquely balances ultra-low power (650 µA), integrated shutdown (900 nA), and compact MSOP-8 packaging - making it optimal for space- and energy-constrained dual-channel analog signal chains where moderate DC precision suffices.

Availability

TLV2782CDGKR is available at Aetrix Electronics and suitable for portable medical sensors, industrial data acquisition modules, wireless sensor nodes, and automotive cabin monitoring systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV2782CDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with deep expertise in precision analog, low-power design, and high-volume manufacturing.

The TLV278x family was engineered for single-supply, low-voltage signal conditioning in portable and battery-operated systems - emphasizing rail-to-rail performance, micropower operation, and robustness across commercial and industrial temperature grades.

FAQ

What is the maximum recommended supply voltage for TLV2782CDGKR?

The absolute maximum supply voltage for TLV2782CDGKR is 4 V, but the recommended operating range is strictly 1.8 V to 3.6 V per the datasheet. Exceeding 3.6 V risks parametric degradation or reliability failure. At 3.6 V, the device achieves highest slew rate (5 V/µs) and output drive capability while maintaining rail-to-rail functionality - critical for maximizing dynamic range in 3.3 V systems.

Does TLV2782CDGKR support true rail-to-rail input and output?

Yes, TLV2782CDGKR supports true rail-to-rail input (VICR = −0.2 V to VDD+0.2 V) and rail-to-rail output (VOH ≥ VDD−180 mV and VOL ≤ 180 mV at 1.8 V). This allows direct interfacing with ADCs and DACs operating at the same supply without level-shifting circuitry - verified across 0°C to 70°C and at both 1.8 V and 2.7 V supplies per SLOS245E Section 7.

How does the shutdown function operate on TLV2782CDGKR?

TLV2782CDGKR's shutdown pin (Pin 5) is active-low: pulling it ≤0.6 V disables both amplifiers, reducing supply current to 900 nA per channel and placing outputs in high-impedance state. Leaving it floating or pulling ≥2 V enables normal operation. The turnon/turnoff times are 800 ns and 200 ns respectively - fast enough for duty-cycled sensor readouts without introducing timing jitter into measurement windows.

What is the input offset voltage specification for TLV2782CDGKR?

TLV2782CDGKR has a maximum input offset voltage of 3000 µV at 25°C and 4500 µV across the full 0°C to 70°C operating range. Its temperature coefficient is 8 µV/°C, meaning offset drift contributes ≤120 µV over a 15°C ambient shift. This is confirmed in the "Electrical Characteristics" table (Page 5) under VIO parameter for TLV2782C grade devices.

Can TLV2782CDGKR drive capacitive loads directly?

TLV2782CDGKR can safely drive ≤10 pF capacitive loads without external compensation. For larger loads (e.g., ADC input capacitance >10 pF), a series resistor (RNULL) must be added between the output and load per Figure 30 in SLOS245E - otherwise phase margin degrades, causing ringing or oscillation. Typical RNULL values range from 20 Ω to 100 Ω depending on CL and layout parasitics.

TLV2782CDGKR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
General Purpose
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
5V/µs
Gain Bandwidth Product:
8 MHz
-3db Bandwidth:
-
Current - Input Bias:
2.5 pA
Voltage - Input Offset:
250 µV
Current - Supply:
650µA (x2 Channels)
Current - Output / Channel:
23 mA
Voltage - Supply Span (Min):
1.8 V
Voltage - Supply Span (Max):
3.6 V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-VSSOP

TLV2782CDGKR FAQ

1.How can I place an order for TLV2782CDGKR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV2782CDGKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV2782CDGKR reliable?

The price and inventory of TLV2782CDGKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV2782CDGKR is usually 5 days.

3.What payment methods are accepted for TLV2782CDGKR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV2782CDGKR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV2782CDGKR?

TLV2782CDGKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV2782CDGKR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV2782CDGKR?

For technical support, including TLV2782CDGKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV2782CDGKR requirements.

6.How does Aetrix verify that TLV2782CDGKR is sourced from the original manufacturer or authorized distributors?

All TLV2782CDGKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV2782CDGKR meets industry standards.

7.What is the process for return or replacement of TLV2782CDGKR?

All TLV2782CDGKR units undergo pre-shipment inspection (PSI). If there is an issue with TLV2782CDGKR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV2782CDGKR part is unused and in its original packaging.

Return procedure for TLV2782CDGKR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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