Texas Instruments TLV2782IDGK

Overview

TLV2782IDGK from Texas Instruments is a dual rail-to-rail input/output operational amplifier optimized for low-voltage, low-power applications. It operates from 1.8 V to 3.6 V, delivers 8 MHz bandwidth and 4.8 V/µs slew rate at 650 µA per channel, and supports −40°C to 125°C industrial temperature range. It is used in high-resolution data acquisition front-ends where precision, speed, and battery efficiency are critical.

For engineers reviewing the TLV2782IDGK datasheet, TLV2782IDGK pinout, TLV2782IDGK application, or TLV2782IDGK equivalent, key selection criteria include its rail-to-rail I/O swing at 1.8 V supply, shutdown capability (enabled on select variants), input offset voltage ≤3 mV over temperature, and MSOP-8 package compatibility with space-constrained PCB layouts.

Technical Context

The TLV2782IDGK implements a CMOS input stage enabling ultra-low input bias current (2.5 pA typical) and rail-to-rail common-mode input range (−0.2 V to VDD+0.2 V). Its internal compensation ensures stable unity-gain operation with 58° phase margin into 2 kΩ//25 pF loads.

It features independent shutdown control per channel (pins 5 and 12), allowing selective channel disablement to reduce system quiescent current to <1 µA per disabled channel. Output drive capability reaches ±10 mA while maintaining rail-to-rail swing - e.g., VOH ≥2.6 V and VOL ≤170 mV at VDD = 2.7 V and IOL = 5 mA.

Key Specifications

Pinout & Package

TLV2782IDGK is housed in an 8-pin MSOP (DGK) package - 3.0 mm × 3.0 mm footprint, 0.65 mm pitch, exposed thermal pad optional. Designed for reflow soldering and high-density routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.

Compared with TLV2782CDGK, TLV2782IDGK adds guaranteed operation at −40°C and 125°C - critical for automotive and industrial deployments. Versus OPA2333AIDGKR, TLV2782IDGK trades zero-drift stability for 23× higher bandwidth and 40% lower quiescent current, making it superior for AC-coupled, high-speed signal conditioning.

Availability

TLV2782IDGK is available at Aetrix Electronics and suitable for portable medical sensors, automotive cabin pressure monitoring, and industrial data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV2782IDGK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The TLV278x family was designed specifically for ultra-low-voltage, rail-to-rail signal conditioning in battery-powered and energy-conscious systems - emphasizing bandwidth-per-microamp efficiency and robustness across harsh thermal environments.

FAQ

What is the maximum recommended supply voltage for TLV2782IDGK?

The absolute maximum supply voltage for TLV2782IDGK is 4 V, but the recommended operating range is strictly 1.8 V to 3.6 V. Exceeding 3.6 V risks parametric shift and reduced reliability; operation at 3.6 V is validated for full performance including rail-to-rail output swing and 8 MHz bandwidth. TI specifies 3.6 V as the upper limit for guaranteed functionality across −40°C to 125°C.

Does TLV2782IDGK support true rail-to-rail input common-mode range?

Yes, TLV2782IDGK supports a common-mode input voltage range from −0.2 V to VDD+0.2 V. This means it accepts input signals 200 mV below ground or 200 mV above VDD - enabling accurate amplification of signals near supply rails, such as those from resistive sensors tied to VDD or GND. This specification is confirmed across the full −40°C to 125°C temperature range.

How does the shutdown function work on TLV2782IDGK?

TLV2782IDGK has two independent active-low shutdown pins (SHDN1 on pin 5, SHDN2 on pin 10). Pulling either pin to GND reduces that channel's supply current to ≤1.7 µA (typical 900 nA), disables the amplifier, and places its output in high-impedance state. Leaving the pin open or tying it to VDD enables normal operation. No external pull-up is required, but parasitic leakage must be managed in high-impedance PCB layouts.

Can TLV2782IDGK drive capacitive loads directly?

TLV2782IDGK is stable for capacitive loads ≤10 pF with no series resistance. For larger loads (e.g., ADC input capacitance >10 pF), TI recommends adding a small isolation resistor (RNULL = 5–50 Ω) between the amplifier output and the load to preserve phase margin and prevent ringing. This is documented in Figure 30 of the SLOS245E datasheet and verified via phase margin testing at 58° with 25 pF load.

What is the input offset voltage specification for TLV2782IDGK over temperature?

For TLV2782IDGK (I-suffix), the input offset voltage is specified as ≤3000 µV maximum across the full −40°C to 125°C operating range. At 25°C, the typical value is 250 µV, with a maximum of 2000 µV for the 'A' grade variant. The temperature coefficient is 8 µV/°C, meaning drift contributes ≤1.2 mV over the full range - a key factor in uncalibrated precision applications.