Texas Instruments TLV27L2IDGKR

Overview

TLV27L2IDGKR from Texas Instruments is a dual-channel micropower rail-to-rail output operational amplifier designed for ultra-low-power signal conditioning in battery-operated systems. It delivers 160 kHz gain-bandwidth, 0.1 V/μs slew rate, 7 μA per channel quiescent current, and operates from 2.7 V to 16 V supply across −40°C to +125°C industrial temperature range - enabling use in portable medical sensors and low-power smoke detectors.

For engineers reviewing the TLV27L2IDGKR datasheet, TLV27L2IDGKR pinout, TLV27L2IDGKR application, or TLV27L2IDGKR equivalent, key selection criteria include its BiMOS input stage (1 pA bias current), rail-to-rail output swing (within 50 mV of rails at ±5 V), and VSSOP-8 packaging optimized for space-constrained PCB layouts.

Technical Context

The TLV27L2IDGKR employs a BiMOS input stage to achieve 1 pA typical input bias current while maintaining rail-to-rail output swing via complementary bipolar output transistors. Its 160 kHz unity-gain bandwidth and 0.1 V/μs slew rate are optimized for DC-coupled, low-frequency sensor interfaces rather than high-speed signal processing.

It supports single-supply operation down to 2.7 V and dual-supply operation from ±1.35 V to ±8 V, with input common-mode voltage range extending from −0.2 V to VS+1.2 V - allowing direct sensing of signals near ground or supply rails without level-shifting circuitry.

Key Specifications

Pinout & Package

VSSOP-8 (DGK) package: 3 mm × 3 mm body, 0.65 mm pitch, exposed pad optional, JEDEC MO-187AC compliant - provides 40% PCB area reduction vs. SOIC-8 while maintaining thermal performance via solderable thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar op-amp applications.

Compared with TLV2382IDGKR and TLC27L2CDR, the TLV27L2IDGKR uniquely combines rail-to-rail output, 1 pA input bias, and VSSOP-8 packaging - making it the only option among the three that supports both ultra-low-power operation and wide-input-voltage-range signal acquisition in compact form factors.

Availability

TLV27L2IDGKR is available at Aetrix Electronics and suitable for portable medical devices, industrial power monitoring systems, and low-power security detection requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLV27L2IDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 90 years of innovation in precision analog ICs.

The TLV27L2IDGKR belongs to TI's micropower rail-to-rail op-amp product line, engineered specifically for energy-constrained applications where battery life, signal fidelity, and operating temperature range are critical design constraints.

FAQ

What is the maximum supply voltage rating for TLV27L2IDGKR?

The absolute maximum supply voltage for TLV27L2IDGKR is 16.5 V, with recommended operating range specified from 2.7 V to 16 V. Exceeding 16.5 V risks permanent damage. The device supports dual-supply operation from ±1.35 V to ±8 V, making it compatible with split-rail sensor interfaces while maintaining full rail-to-rail output functionality in TLV27L2IDGKR designs.

Does TLV27L2IDGKR support rail-to-rail input operation?

No, TLV27L2IDGKR does not support rail-to-rail input operation. Its input common-mode voltage range is specified from −0.2 V to VS+1.2 V, meaning it accepts inputs slightly beyond the supply rails but not all the way to VDD or GND. This differs from true rail-to-rail input op-amps; however, the extended range enables direct interfacing with sensors whose outputs swing near ground or above VDD - a key capability confirmed in the TLV27L2IDGKR datasheet.

What is the thermal resistance (θJA) of TLV27L2IDGKR in its VSSOP-8 package?

The TLV27L2IDGKR in VSSOP-8 (DGK) package has a junction-to-ambient thermal resistance (θJA) of 260°C/W on a low-thermal-conductivity PCB, as documented in TI's thermal characterization data. This value assumes no airflow and standard JEDEC test conditions. For reliable operation at 125°C ambient, power dissipation must remain below 96 mW - consistent with its 7 μA per channel quiescent current and typical load conditions in TLV27L2IDGKR applications.

Can TLV27L2IDGKR drive capacitive loads directly?

TLV27L2IDGKR can drive capacitive loads up to 50 pF stably, as verified by phase margin measurements showing 62° at 25°C with 100-kΩ load and 50-pF capacitance. Driving larger capacitive loads (e.g., >100 pF) may cause peaking or oscillation unless isolated with a series resistor (≥100 Ω) or compensated via external feedback network - a requirement explicitly noted in the TLV27L2IDGKR application notes for maintaining stability in sensor interface circuits.

Is TLV27L2IDGKR pin-compatible with other members of the TLV27Lx family?

Yes, TLV27L2IDGKR is pin-compatible with other TLV27L2 variants in VSSOP-8 (DGK) and SOIC-8 (D) packages, including TLV27L2CDGKR and TLV27L2IDR. All share identical 8-pin pinout: 1OUT, 1IN−, 1IN+, GND, VDD, 2OUT, 2IN−, 2IN+. This allows direct substitution between commercial (C) and industrial (I) grade versions in the same package - simplifying qualification and enabling TLV27L2IDGKR deployment in harsh-environment designs without layout changes.