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Texas Instruments TLV320AIC28IRGZR

Part No.:
TLV320AIC28IRGZR
Manufacturer:
Texas Instruments
Category:
CODECS
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixTLV320AIC28IRGZR.pdf
Description:
IC STEREO AUDIO CODEC LP 48-VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,229

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Product details

Overview

TLV320AIC28IRGZR from Texas Instruments is a low-power, highly integrated stereo audio DAC and mono audio ADC with 95-dB SNR playback, 48 ksps sampling, 400-mW 8-Ω BTL speaker driver, capless 16-Ω headphone output, and integrated 12-bit SAR ADC for battery/temperature/auxiliary measurement. It serves as the central audio interface in portable voice-enabled devices requiring simultaneous playback, recording, headset detection, and system monitoring.

For engineers reviewing the TLV320AIC28IRGZR datasheet, TLV320AIC28IRGZR pinout, TLV320AIC28IRGZR application, or TLV320AIC28IRGZR equivalent, key selection considerations include its dual-mode audio I/O (I²S/DSP/LJF/RJF), hardware AGC with 59.5-dB gain range, programmable digital audio effects (bass/treble/EQ/de-emphasis), and direct battery measurement up to 6 V - all in a thermally enhanced 48-pin QFN package.

Technical Context

The TLV320AIC28IRGZR implements a sigma-delta ADC architecture with decimation filtering and a sigma-delta DAC with interpolation filtering, supporting independent 16/20/24/32-bit word lengths and sampling rates from 8 ksps to 48 ksps. Its on-chip PLL enables flexible MCLK-to-audio-clock synthesis, allowing operation from common crystal or system clocks (e.g., 12 MHz, 24 MHz) without external timing components.

Audio routing is managed via register-controlled analog switches and configurable drivers: two microphone inputs (handset/headset) with independent bias and hardware AGC; stereo headphone outputs with virtual ground (VGND) support for capless design; differential 8-Ω speaker driver with feedback (SPKFC) and 32-Ω earpiece driver; plus dedicated CP_IN/CP_OUT paths for cell phone module interfacing. All digital control uses SPI, while audio data transfers via configurable serial audio interface (BCLK/WCLK/SDIN/SDOUT).

Key Specifications

ParameterValue and Actual Design Meaning
ADC/DAC Resolution16/20/24/32-bit programmable word length - enables compatibility with legacy and high-fidelity audio processors without bit-depth conversion loss.
Max Sampling Rate48 ksps - supports CD-quality audio playback and recording, meeting core requirements for smartphones and DSCs.
DAC SNR (A-weighted)95 dB (typ.) at 48 ksps - ensures high-fidelity stereo playback with minimal audible noise floor in portable headphones.
Speaker Output Power400 mW into 8 Ω (differential BTL) - drives loudspeaker modules directly from battery supply (BVDD up to 4.2 V), eliminating need for external power amps.
Battery Monitor Input0.5–6.0 V range with ±15 mV accuracy - enables precise state-of-charge estimation using single-ended connection to battery rail, no external resistor divider required.
SAR ADC ResolutionProgrammable 8-/10-/12-bit - allows trade-off between measurement speed (up to 1 MSPS) and precision for auxiliary sensing tasks.
Power Consumption19 mW stereo playback (48 ksps, 3.3-V AVDD) - extends battery life in always-on audio subsystems of handheld devices.

Pinout & Package

TLV320AIC28IRGZR is housed in a 48-pin QFN package (7 mm × 7 mm, RGZ designation) with exposed thermal pad for enhanced heat dissipation. The package supports fine-pitch PCB assembly and provides low-inductance grounding via multiple DVSS/AVSS/DRVSS pins.

Pin/TerminalCircuit RoleDesign Meaning
1 (IOVDD)IO supply voltageSupplies 1.1–3.6 V to SPI interface and digital I/O buffers - decoupling critical for noise immunity in mixed-signal systems.
2 (PWR_DN)Hardware power-down controlActive-low signal enabling full chip shutdown (27 µA standby) - used for rapid system-level power gating during idle periods.
25 (MIC_DETECT_IN)Headset insertion sense inputMonitors mechanical switch closure in 3-pole/4-pole jack - triggers automatic configuration of mic bias, routing, and driver modes.
26 (OUT32N)Differential earpiece output (−)Paired with SPK1 (OUT32P) to drive 32-Ω receivers - eliminates need for output coupling capacitors in hearing aid or handset applications.
34 (BVDD)Battery supply inputAccepts 3–4.2 V direct battery connection to power speaker driver - enables efficient Class-D-like operation without DC-DC conversion loss.
37 (DAV)Auxiliary data available flagOpen-drain interrupt signaling valid SAR ADC conversion - simplifies polling-free firmware integration for battery/temperature monitoring.
38–41 (SS/MOSI/MISO/SCLK)SPI control interfaceFull-duplex 4-wire SPI (100 MHz max SCLK) for register configuration - supports daisy-chaining and multi-device addressing in compact layouts.
42–46 (MCLK/WCLK/BCLK/SDOUT/SDIN)Audio serial interfaceConfigurable I²S/DSP/LJF/RJF bus with master/slave clocking - permits seamless integration with DSPs, microcontrollers, and baseband processors.

Key Features

FeatureDesign Value
Capless headphone outputVirtual ground (VGND) generation eliminates 2× 220-µF DC-blocking capacitors per channel - reduces BOM cost and PCB area by >15 mm² in space-constrained designs.
Hardware AGC with 59.5-dB rangeProgrammable 0.5-dB steps enable real-time microphone gain adjustment without CPU intervention - maintains consistent recording level across varying acoustic environments.
Integrated 12-bit SAR ADCMeasures battery voltage (0.5–6 V), temperature (0.3°C resolution), and two auxiliary inputs - replaces discrete ADC and sensor signal conditioning circuitry.
Programmable digital audio effectsBass/treble/midrange/EQ/de-emphasis filters implemented in fixed-point DSP engine - enables OEM audio tuning without modifying host processor firmware.
Auto-detection of jack, headset type, button pressDedicated analog comparators and state machine detect plug insertion, TRRS/TRS configuration, and keypress events - reduces host MCU GPIO and software overhead.

Applications

Smartphone Voice InterfaceDigital Still Camera Audio

Use Scenario: Simultaneous speakerphone call handling, voice memo recording, and headset-based media playback in a 4G/LTE smartphone.

IC Role / Device Role / Timing Role: Central audio codec managing dual-mic NR processing, capless stereo headphone output, 400-mW loudspeaker drive, and battery telemetry.

Use Value: Single-chip solution eliminates need for separate ADC, DAC, speaker amp, and sensor ADC - reduces component count by ≥7 and layout complexity in tight RF-sensitive zones.

Use Scenario: Recording short video clips with synchronized stereo audio and providing playback through built-in speaker or connected headphones.

IC Role / Device Role / Timing Role: Audio front-end converting microphone signals to I²S stream for SoC encoder, driving 8-Ω speaker at 400 mW, and monitoring battery health during capture.

Use Value: 95-dB DAC SNR ensures clean playback; 48 ksps sampling meets broadcast-grade audio requirements; integrated PLL avoids external crystal for compact camera module design.

Portable VoIP HandsetIndustrial Handheld Terminal

Use Scenario: Full-duplex SIP communication over Wi-Fi with echo cancellation, headset detection, and push-to-talk button feedback.

IC Role / Device Role / Timing Role: Audio transceiver with CP_IN/CP_OUT path for baseband interconnect, hardware sidetone mixing, and keyclick generation on GPIO-triggered events.

Use Value: Dedicated cell-phone interface pins simplify integration with PMIC/baseband; programmable keyclick tone provides tactile UI feedback without host CPU involvement.

Use Scenario: Ruggedized field device capturing voice notes in noisy environments, logging battery voltage/temperature, and playing alerts through mono speaker.

IC Role / Device Role / Timing Role: Low-power audio subsystem performing 8-ksps mono recording with hardware AGC, 12-bit SAR measurements, and 19-mW playback mode.

Use Value: 59.5-dB AGC range adapts to factory-floor noise; −40°C to +85°C operating range matches industrial temp specs; 27-µA hardware power-down extends battery life during intermittent use.

Equivalent & Alternatives

The following parts are listed as comparable options for similar audio codec applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TLV320AIC3106IRGZRLower power (12 mW playback), no speaker driver, 94-dB DAC SNR, added ultra-low-noise mic preampTargeted at battery-critical wearables and hearables where speaker output is handled externallySelect when system already includes Class-D speaker amplifier and prioritizes lowest possible active power draw.
WM8960GEFL/VHigher SNR (100 dB), integrated Class-D speaker amp (1 W), but no battery monitor or SAR ADCUsed in premium portable media players requiring louder speaker output and superior audio fidelityChoose when application demands >400 mW speaker power and highest dynamic range, and external battery sensing is acceptable.

Compared with TLV320AIC28IRGZR, TLV320AIC3106IRGZR trades speaker drive capability for lower power and enhanced mic performance, while WM8960GEFL/V delivers higher output power and SNR at the expense of integrated system monitoring - making TLV320AIC28IRGZR optimal for cost-sensitive, feature-integrated portable voice terminals.

Availability

TLV320AIC28IRGZR is available at Aetrix Electronics and suitable for smartphone voice interfaces, digital still camera audio subsystems, portable VoIP handsets, and industrial handheld terminals requiring stable component supply across long production lifecycles.

Supply support for TLV320AIC28IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer applications.

The TLV320AIC28IRGZR belongs to TI's low-power portable audio codec product line, engineered to consolidate audio signal chain functions - including ADC, DAC, amplification, sensing, and interface logic - into a single IC for space- and power-constrained mobile devices.

FAQ

What audio interface protocols does the TLV320AIC28IRGZR support?

The TLV320AIC28IRGZR supports I²S, left-justified (LJF), right-justified (RJF), and DSP serial audio formats via its configurable SDIN/SDOUT/BCLK/WCLK interface. It operates in master or slave mode, with programmable word length (16/20/24/32 bits) and sampling rates up to 48 ksps. The TLV320AIC28IRGZR also includes an on-chip PLL for flexible clock generation from common MCLK sources like 12 MHz or 24 MHz crystals.

Does the TLV320AIC28IRGZR integrate speaker driver functionality?

Yes, the TLV320AIC28IRGZR integrates a 400-mW differential Class-AB speaker driver optimized for 8-Ω loads, powered directly from the BVDD battery rail. It features SPK1/SPK2 outputs, feedback pin (SPKFC), and thermal protection. This eliminates the need for an external speaker amplifier in many portable designs, reducing BOM count and PCB area. The TLV320AIC28IRGZR also includes a 32-Ω differential earpiece driver (SPK1/OUT32N) for handset applications.

Can the TLV320AIC28IRGZR perform battery voltage monitoring?

Yes, the TLV320AIC28IRGZR includes a dedicated VBAT input (Pin 15) that accepts 0.5–6.0 V, enabling direct battery rail monitoring without external resistive dividers. Its integrated 12-bit SAR ADC measures battery voltage with ±15 mV accuracy after system calibration. The TLV320AIC28IRGZR also provides auxiliary inputs (AUX1/AUX2) and on-chip temperature sensing (0.3°C resolution), consolidating system health monitoring into one device.

How does the TLV320AIC28IRGZR handle headset and button detection?

The TLV320AIC28IRGZR implements hardware-based headset detection via MIC_DETECT_IN (Pin 25), which senses mechanical switch closure in 3-pole or 4-pole jacks. It automatically configures mic bias, audio routing, and driver modes upon insertion. Button press detection is performed using internal comparators on headset mic lines, generating interrupts via GPIO or DAV. The TLV320AIC28IRGZR also supports programmable keyclick generation on SPK1/SPK2 for tactile UI feedback without host CPU involvement.

What power supply configurations does the TLV320AIC28IRGZR require?

The TLV320AIC28IRGZR requires five independent supplies: AVDD1/AVDD2 (3.0–3.6 V) for ADC/DAC/PLL analog circuits; DRVDD (3.0–3.6 V) for headphone drivers; BVDD (3.0–4.2 V) for speaker driver; DVDD (1.65–1.95 V) for digital core; and IOVDD (1.1–3.6 V) for SPI and I/O buffers. Each supply must be decoupled per TI's layout guidelines. The TLV320AIC28IRGZR achieves 19-mW stereo playback at 48 ksps with 3.3-V AVDD and supports hardware power-down (PWR_DN) to 27 µA.

TLV320AIC28IRGZR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Stereo Audio
Data Interface:
Serial
Resolution (Bits):
24 b
Number of ADCs / DACs:
1 / 2
Sigma Delta:
Yes
S/N Ratio, ADCs / DACs (db) Typ:
90 / 95
Dynamic Range, ADCs / DACs (db) Typ:
-
Voltage - Supply, Analog:
3V ~ 3.6V
Voltage - Supply, Digital:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VQFN (7x7)

TLV320AIC28IRGZR FAQ

1.How can I place an order for TLV320AIC28IRGZR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV320AIC28IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV320AIC28IRGZR reliable?

The price and inventory of TLV320AIC28IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV320AIC28IRGZR is usually 5 days.

3.What payment methods are accepted for TLV320AIC28IRGZR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV320AIC28IRGZR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV320AIC28IRGZR?

TLV320AIC28IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV320AIC28IRGZR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV320AIC28IRGZR?

For technical support, including TLV320AIC28IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV320AIC28IRGZR requirements.

6.How does Aetrix verify that TLV320AIC28IRGZR is sourced from the original manufacturer or authorized distributors?

All TLV320AIC28IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV320AIC28IRGZR meets industry standards.

7.What is the process for return or replacement of TLV320AIC28IRGZR?

All TLV320AIC28IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with TLV320AIC28IRGZR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV320AIC28IRGZR part is unused and in its original packaging.

Return procedure for TLV320AIC28IRGZR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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