Texas Instruments TLV320AIC3253IYZKR

Overview

TLV320AIC3253IYZKR from Texas Instruments is a low-power stereo audio codec with embedded miniDSP, 100dB SNR DAC, 4.1mW 48ksps playback, and programmable PowerTune™ for voice-to-192kHz audio. It integrates stereo headphone drivers (16Ω SE / 32Ω differential), digital microphone PDM interface, LDO, PLL, and dual I²S/SPI control interfaces - deployed in mobile handsets and portable computing audio subsystems.

For engineers reviewing the TLV320AIC3253IYZKR datasheet, TLV320AIC3253IYZKR pinout, TLV320AIC3253IYZKR application, or TLV320AIC3253IYZKR equivalent, key selection criteria include its 2.7mm × 2.7mm WCSP package, -6dB to +29dB programmable volume control in 1dB steps, analog bypass mode, and configurable GPIO/MFP pins supporting headset detection and clock routing.

Technical Context

The TLV320AIC3253IYZKR implements a fully register-programmable signal path: stereo ADC/DAC with independent volume control (-6dB to +29dB, 1dB steps), analog bypass routing (INL→HPL, INR→HPR), and flexible clock sourcing via MCLK, BCLK, GPIO, or fractional PLL (512kHz–50MHz input). Its PowerTune™ architecture enables dynamic trade-offs between power (e.g., 4.1mW stereo playback at 48ksps) and performance (100dB SNR).

Digital interface flexibility includes primary I²S with WCLK/BCLK/DIN/DOUT, secondary I²S support, SPI/I²C control bus (selected by SPI_SELECT pin), and multifunction pins (MFP1–MFP5) enabling clock output, interrupt generation, or digital microphone clock/data routing - all configurable per register settings without hardware changes.

Key Specifications

Pinout & Package

TLV320AIC3253IYZKR uses the 2.7mm × 2.7mm S-XBGA-N25 (YZK) wafer-level chip-scale package with 25-ball array and 0.4mm pitch. All balls are assigned to functional terminals; multiple balls per pin name (e.g., AVss, DVss) must be connected on PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar stereo audio codec applications.

Compared with TLV320AIC3253IYZKR, TLV320AIC3101IRGET offers lower integration but simpler configuration, while PCM3168APFBR provides expanded I/O at the expense of size, power, and embedded processing - making TLV320AIC3253IYZKR optimal for space-constrained, battery-sensitive stereo audio endpoints.

Availability

TLV320AIC3253IYZKR is available at Aetrix Electronics and suitable for mobile handset audio, portable computing audio, communication device audio, and wearable audio subsystems requiring stable component supply, long-term lifecycle support, and wafer-level packaging compatibility.

Supply support for TLV320AIC3253IYZKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision audio signal chains and low-power system solutions.

The TLV320AIC3253 product line delivers ultra-low-power, highly integrated audio codecs for battery-operated portable devices - designed to replace discrete audio subsystems with single-chip solutions featuring miniDSP, PowerTune™, and flexible digital interfaces.

FAQ

What is the package type and pin count of the TLV320AIC3253IYZKR?

The TLV320AIC3253IYZKR uses the S-XBGA-N25 (YZK) wafer-level chip-scale package: 2.7mm × 2.7mm footprint, 0.4mm ball pitch, and 25-ball array. This compact WCSP enables high-density PCB layouts in space-constrained mobile designs while maintaining thermal performance via substrate-level grounding.

Does the TLV320AIC3253IYZKR support digital microphone inputs?

Yes, the TLV320AIC3253IYZKR supports stereo digital microphone PDM inputs via DIN (when SPI_SELECT = 0) and DMDIN/MFP3. It provides programmable DMCLK output on DMCLK/MFP4 and supports sampling rates up to 128Fs - enabling direct connection of MEMS microphones without external decimation logic.

What are the voltage supply requirements for the TLV320AIC3253IYZKR?

The TLV320AIC3253IYZKR requires three independent supplies: LDOIN (1.9V–3.6V) for internal LDO and headphone power, AVdd (1.5V–1.95V) for analog circuitry, and DVdd (1.26V–1.95V) for digital core. IOVDD (1.1V–3.6V) sets I/O logic levels, allowing interfacing with 1.2V, 1.8V, or 3.3V host processors.

How does PowerTune™ technology function in the TLV320AIC3253IYZKR?

PowerTune™ in the TLV320AIC3253IYZKR enables runtime selection of power-performance trade-offs via register-controlled profiles (e.g., PTM_P3 for low-noise, PTM_P4 for ultra-low-power). It dynamically adjusts clock frequencies, block enable states, and bias currents - reducing power from 4.1mW (48ksps playback) to sub-mW standby without sacrificing audio fidelity.

Can the TLV320AIC3253IYZKR operate without an external crystal?

Yes, the TLV320AIC3253IYZKR can derive its internal clock from multiple sources including MCLK, BCLK, GPIO, or its integrated fractional PLL. The PLL accepts input clocks from 512kHz to 50MHz - allowing use of system clocks or low-cost oscillators instead of crystals, reducing BOM count and board area.