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Texas Instruments TLV320AIC3256IRSBR

Part No.:
TLV320AIC3256IRSBR
Manufacturer:
Texas Instruments
Category:
CODECS
Package:
40-WFQFN Exposed Pad
Datasheet:
AetrixTLV320AIC3256IRSBR.pdf
Description:
IC STEREO AUD CODEC LP 40WQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,637

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Product details

Overview

TLV320AIC3256 from Texas Instruments is an ultra-low-power stereo audio codec with embedded miniDSP, ground-centered headphone outputs, 93dB SNR ADC and 100dB SNR DAC, supporting I²C/SPI control and programmable microphone bias for portable media players and mobile handsets.

For engineers reviewing the TLV320AIC3256 datasheet, TLV320AIC3256 pinout, TLV320AIC3256 application, or TLV320AIC3256 equivalent, key selection considerations include its 5.0mW DAC playback power at 48ksps, six configurable analog inputs (single-ended or differential), integrated PLL, PowerTune™ dynamic power scaling, and dual-mode headphone output (ground-centered/unipolar).

Technical Context

The TLV320AIC3256 integrates independent left/right ADC and DAC signal paths with dedicated DRC and AGC blocks, programmable PGA gain (–6 to +47.5 dB in 0.5 dB steps), and flexible input muxing supporting up to three stereo analog input pairs or digital microphone interfaces. Its miniDSP enables real-time audio processing without host CPU intervention.

Digital interface routing supports primary/secondary I²S, LJF, RJF, and DSP modes with independent BCLK/WCLK/MCLK domains; clock generation relies on a fully programmable PLL accepting MCLK inputs from 0.512 MHz to 20 MHz, with fractional or integer division options depending on DVdd voltage level.

Key Specifications

Parameter Value and Actual Design Meaning
ADC SNR 93 dB A-weighted - enables high-fidelity voice capture in noisy portable environments
DAC SNR 100 dB A-weighted - supports studio-grade headphone playback with low audible noise floor
Power Consumption (DAC) 5.0 mW at 48 ksps - extends battery life in always-on audio recording/playback use cases
PGA Gain Range –6 dB to +47.5 dB in 0.5 dB steps - accommodates mic-level to line-level inputs without external amplification
Headphone Output Type Ground-centered stereo - eliminates DC-blocking capacitors in HP path, reducing BOM cost and board area
Digital Interface SPI/I²C control + primary/secondary I²S/LJF/RJF/DSP serial data - enables multi-processor audio routing and daisy-chaining
Microphone Bias Programmable 1.23 V to DRVdd_HP - supports electret, MEMS, and digital microphones across supply variants

Pinout & Package

TLV320AIC3256 is housed in a 40-pin WQFN (5.0 mm × 5.0 mm) package with exposed thermal pad. Pin functions support full analog/digital I/O flexibility including dual I²S interfaces, GPIOs with multiple alternate functions (CLKOUT, INT, MFP), and dedicated charge-pump terminals (FLY_P/FLY_N, VNEG, DVdd_CP) for ground-centered headphone operation.

Pin/Terminal Circuit Role Design Meaning
IN1_L / IN1_R Multifunction analog input pair Configurable as single-ended MIC/LINE left/right or differential MIC pair - enables flexible front-end sensor integration
HPL / HPR Ground-centered headphone output DC-coupled outputs eliminating 2× 220 µF coupling caps - reduces solution size and cost vs. AC-coupled codecs
MCLK / BCLK / WCLK Digital audio clock inputs Supports master/slave operation across primary and secondary I²S interfaces - allows simultaneous connection to AP + BT SoC
SPI_SELECT Interface mode select Hardware-configured SPI (high) or I²C (low) - avoids software configuration errors during boot initialization
VNEG / FLY_N / FLY_P Charge pump negative rail generation Enables true ground-centered headphone drive from single-supply AVdd/DRVdd_HP - critical for low-voltage portable designs
GND_SENSE External ground reference Allows precise DC offset calibration of headphone amplifier - improves THD+N performance under varying load conditions

Key Features

Feature Design Value
Embedded miniDSP Real-time programmable audio processing (EQ, DRC, AGC, mixing) without host CPU overhead - reduces system power and latency
PowerTune™ technology Dynamically scales power per active function block (e.g., disable unused ADC channels or DSP cores) - cuts idle power by up to 40%
Ground-centered headphone output Eliminates need for DC-blocking capacitors in HP path - saves >20 mm² PCB area and two 220 µF 6.3 V X5R caps per channel
Programmable microphone bias Four selectable bias voltages (1.23 V–DRVdd_HP) with current sourcing up to 3 mA - supports legacy electret and modern digital MEMS mics
Flexible input architecture Six single-ended or three fully-differential analog inputs + stereo digital mic (PDM) interface - enables multi-mic beamforming or hybrid analog/digital capture

Applications

Portable Media Player (PMP) Mobile Handset Audio Subsystem

Use Scenario: High-resolution music playback with bass enhancement and loudness compensation while maintaining 20+ hour battery life.

IC Role / Device Role: Primary stereo audio codec handling DAC playback, headphone drive, and real-time DSP-based EQ/loudness management.

Use Value: 100 dB DAC SNR and ground-centered HP output deliver audiophile-grade fidelity without coupling caps; PowerTune™ reduces playback power to 5.0 mW.

Use Scenario: Simultaneous voice call (mic capture + speaker playback), VoIP conferencing, and background music playback with minimal thermal impact.

IC Role / Device Role: Central audio hub managing dual analog mic inputs, stereo headset interface, and Bluetooth coexistence via secondary I²S.

Use Value: Independent left/right AGC/DRC blocks enable adaptive noise suppression; 93 dB ADC SNR ensures clear far-field voice pickup in noisy environments.

Portable Navigation Device (PND) Communication Terminal with Voice Assist

Use Scenario: Turn-by-turn navigation with spoken instructions over mono speaker and stereo headphone output, plus hands-free voice command input.

IC Role / Device Role: Dual-path audio processor handling navigation audio playback, voice prompt mixing, and wake-word detection via programmable miniDSP filters.

Use Value: Six analog inputs allow simultaneous connection of navigation mic, cabin mic, and line-in; miniDSP enables on-device keyword spotting without cloud dependency.

Use Scenario: Smart speaker or conference phone requiring echo cancellation, beamforming, and multi-band compression for teleconferencing.

IC Role / Device Role: Audio front-end providing synchronized stereo ADC capture, PDM mic interface, and DSP-accelerated acoustic echo cancellation (AEC) pre-processing.

Use Value: Programmable PLL and dual I²S interfaces enable precise clock synchronization between AP and DSP; 108 dB channel separation prevents crosstalk in full-duplex operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar stereo audio codec applications.

Alternative Part Technical Difference Application Difference Selection Advice
TLV320AIC3254 Lacks ground-centered headphone output; requires external DC-blocking capacitors Higher BOM cost and larger PCB footprint due to mandatory 220 µF HP coupling caps Select when ground-centered HP is not required and legacy design reuse is prioritized
TLV320AIC3206 No embedded miniDSP; fixed-function signal processing only Cannot perform real-time parametric EQ or custom voice algorithms without host CPU involvement Select when audio processing is handled entirely by application processor and lowest cost is critical

Compared with TLV320AIC3256, TLV320AIC3254 omits ground-centered HP drive (increasing component count), while TLV320AIC3206 removes miniDSP (shifting processing load to host). TLV320AIC3256 uniquely balances integrated intelligence, ultra-low power, and analog flexibility for next-gen portable audio.

Availability

TLV320AIC3256 is available at Aetrix Electronics and suitable for portable media players, mobile handsets, and communication terminals requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for TLV320AIC3256 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision audio signal chains and low-power mixed-signal design.

The TLV320AIC3256 belongs to TI's ultra-low-power audio codec product line, engineered specifically for battery-constrained portable devices demanding high-fidelity audio, intelligent on-chip processing, and minimal system-level power consumption.

FAQ

What is the primary function of the TLV320AIC3256 in a portable audio system?

The TLV320AIC3256 serves as a complete stereo audio codec with integrated miniDSP, handling analog-to-digital conversion for microphone inputs, digital-to-analog conversion for headphone/speaker outputs, and real-time audio processing such as equalization, dynamic range compression, and automatic gain control-all within a single 5 mm × 5 mm WQFN package. Its ground-centered headphone output eliminates external DC-blocking capacitors, directly reducing bill-of-materials cost and PCB area in designs using the TLV320AIC3256.

How does the TLV320AIC3256 achieve ultra-low power consumption during DAC playback?

The TLV320AIC3256 achieves 5.0 mW stereo DAC playback at 48 ksps through PowerTune™ dynamic power scaling, which disables unused internal blocks (e.g., inactive ADC channels or DSP modules), optimized charge-pump efficiency for ground-centered headphone drive, and low-voltage operation down to 1.26 V DVdd. These features collectively minimize active power without compromising 100 dB SNR performance-critical for extended battery life in devices relying on the TLV320AIC3256.

Can the TLV320AIC3256 support both analog and digital microphones simultaneously?

Yes, the TLV320AIC3256 supports up to six analog microphone inputs (via IN1_L/R, IN2_L/R, IN3_L/R) configured as single-ended or differential pairs, and also includes a dedicated digital microphone (PDM) interface with programmable clock output (MFP1/MFP2). This dual capability enables hybrid audio capture architectures-for example, using analog mics for voice pickup and a PDM mic for ambient noise sensing-within a single TLV320AIC3256 implementation.

What is the significance of the GND_SENSE pin on the TLV320AIC3256?

The GND_SENSE pin on the TLV320AIC3256 provides an external reference point for the headphone amplifier's ground-centered output stage, enabling precise DC offset calibration and improved THD+N performance under varying load conditions. It must be connected to the system's clean analog ground plane near the headphone jack to maintain <0.5 V offset tolerance-ensuring stable, capacitorless headphone operation across temperature and supply variations in any TLV320AIC3256 design.

Does the TLV320AIC3256 require an external crystal or can it generate clocks internally?

The TLV320AIC3256 contains an integrated programmable PLL that accepts a single master clock (MCLK) input from 0.512 MHz to 20 MHz and generates all internal audio clocks-including BCLK, WCLK, and sampling rates from 8 kHz to 96 kHz-without requiring an external crystal. This simplifies system design and reduces component count, making the TLV320AIC3256 ideal for space-constrained applications where clock source flexibility and layout simplicity are essential.

TLV320AIC3256IRSBR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
PowerTune™
Package/Case:
40-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Stereo Audio
Data Interface:
I2C, Serial, SPI™
Resolution (Bits):
32 b
Number of ADCs / DACs:
2 / 2
Sigma Delta:
Yes
S/N Ratio, ADCs / DACs (db) Typ:
93 / 100
Dynamic Range, ADCs / DACs (db) Typ:
93 / 100
Voltage - Supply, Analog:
1.5V ~ 1.95V
Voltage - Supply, Digital:
1.26V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
40-WQFN (5x5)

TLV320AIC3256IRSBR FAQ

1.How can I place an order for TLV320AIC3256IRSBR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV320AIC3256IRSBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV320AIC3256IRSBR reliable?

The price and inventory of TLV320AIC3256IRSBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV320AIC3256IRSBR is usually 5 days.

3.What payment methods are accepted for TLV320AIC3256IRSBR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV320AIC3256IRSBR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV320AIC3256IRSBR?

TLV320AIC3256IRSBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV320AIC3256IRSBR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV320AIC3256IRSBR?

For technical support, including TLV320AIC3256IRSBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV320AIC3256IRSBR requirements.

6.How does Aetrix verify that TLV320AIC3256IRSBR is sourced from the original manufacturer or authorized distributors?

All TLV320AIC3256IRSBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV320AIC3256IRSBR meets industry standards.

7.What is the process for return or replacement of TLV320AIC3256IRSBR?

All TLV320AIC3256IRSBR units undergo pre-shipment inspection (PSI). If there is an issue with TLV320AIC3256IRSBR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV320AIC3256IRSBR part is unused and in its original packaging.

Return procedure for TLV320AIC3256IRSBR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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