My Inquiry
My Account
Texas Instruments TLV320AIC3256IYZFR
- Part No.:
- TLV320AIC3256IYZFR
- Manufacturer:
- Texas Instruments
- Category:
- CODECS
- Package:
- 42-UFBGA, DSBGA
- Datasheet:
-
TLV320AIC3256IYZFR.pdf
- Description:
- IC STEREO AUD CODEC LP 42DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,688
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLV320AIC3256IYZFR from Texas Instruments is an ultra-low-power stereo audio codec with embedded miniDSP, ground-centered headphone outputs, 100dB DAC SNR and 93dB ADC SNR. It supports six single-ended or three fully-differential analog inputs, stereo digital microphone inputs, and programmable microphone bias. Used in mobile handsets for high-fidelity voice capture and playback with PowerTune™ dynamic power scaling.
For engineers reviewing the TLV320AIC3256IYZFR datasheet, TLV320AIC3256IYZFR pinout, TLV320AIC3256IYZFR application, or TLV320AIC3256IYZFR equivalent, key selection considerations include its 5.0 mm × 5.0 mm WQFN-40 package, I²C/SPI dual-control interface, 48 ksps stereo ADC/DAC operation, and integrated charge-pump-based ground-centered headphone driver architecture.
Technical Context
The TLV320AIC3256IYZFR integrates dual sigma-delta ADCs and DACs with independent programmable gain amplifiers (PGA), digital signal processing blocks including DRC and AGC, and a configurable miniDSP engine. Its analog front-end supports flexible input routing across three stereo-capable analog input pairs (IN1–IN3) with selectable single-ended or differential configuration.
Digital interface flexibility includes primary/secondary I²S, left-justified, right-justified, and PDM modes, controlled via SPI or I²C depending on SPI_SELECT pin state. A fully programmable PLL generates required audio clocks from MCLK, while the integrated charge pump enables true ground-centered headphone output without DC-blocking capacitors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DAC SNR | 100 dB A-weighted - enables high-fidelity headphone playback with minimal audible noise floor |
| ADC SNR | 93 dB A-weighted - supports clean voice capture at 48 ksps with low-noise PGA front-end |
| Power Consumption | 5.0 mW DAC playback / 5.2 mW ADC record at 48 ksps - optimized for battery-powered portable devices |
| Headphone Output | Ground-centered stereo, 16 Ω load, no DC-blocking caps required - simplifies PCB layout and reduces BOM cost |
| Microphone Bias | Programmable 1.23 V to DRVdd_HP - supports electret and digital microphones across supply ranges |
| Digital Interface | SPI or I²C control + primary/secondary I²S/LJF/RJF/PDM - enables flexible SoC integration and multi-mic synchronization |
| miniDSP | Embedded 28-bit fixed-point engine - allows real-time acoustic tuning (e.g., EQ, AEC, beamforming) without host CPU load |
Pinout & Package
TLV320AIC3256IYZFR uses a 5.00 mm × 5.00 mm WQFN-40 package (YZF suffix), thermally enhanced with exposed thermal pad connected to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SPI_SELECT | Interface mode select | High = SPI mode; Low = I²C mode - determines SCL/SDA vs. SCLK/MOSI/MISO function mapping |
| IN1_L / IN1_R | Analog input pair | Configurable as single-ended MIC/LINE or differential stereo input - primary channel for headset mic or line-in |
| HPL / HPR | Headphone output | Ground-centered, charge-pump-driven outputs - deliver ±1.8 V swing into 16 Ω, eliminating DC-blocking capacitors |
| MICBIAS | Microphone bias generator | Programmable voltage source (1.23–3.3 V) - powers electret condenser mics with adjustable current sourcing |
| GND_SENSE | Headphone reference | External ground reference input - enables accurate DC offset cancellation for ground-centered headphone stage |
| VNEG / FLY_N / FLY_P / DVdd_CP | Charge pump network | Supports bipolar voltage generation for headphone driver - requires external flying capacitor and negative rail filtering |
Key Features
| Feature | Design Value |
|---|---|
| PowerTune™ dynamic power scaling | Adjusts internal clocking and signal path power per use case - reduces active power by up to 50% during low-SNR operation |
| Programmable PGA gain | 0 to +47.5 dB in 0.5 dB steps (single-ended) - accommodates wide dynamic range of analog mic sources |
| Dual-path digital signal processing | Independent DRC and AGC on ADC/DAC paths - enables simultaneous noise suppression and loudness normalization |
| Flexible clock architecture | Integrated PLL with fractional/integer divide - accepts 0.512–20 MHz MCLK and generates precise audio sample rates |
| Analog bypass mode | Direct analog path from IN1_L/R to HPL/HPR - enables ultra-low-latency voice call path with <100 µs group delay |
Applications
| Mobile Voice Call Path | Smart Speaker Far-Field Audio |
|---|---|
Use Scenario: Real-time bidirectional voice communication in cellular handsets with echo cancellation and noise suppression. IC Role / Device Role / Timing Role: Audio codec provides synchronized ADC/DAC sampling, analog mic preamp, ground-centered headphone drive, and miniDSP-accelerated AEC. Use Value: Enables full-duplex call quality with <10 ms round-trip latency and >30 dB echo return loss using on-chip DSP resources. |
Use Scenario: Multi-microphone array processing in battery-powered smart speakers for wake-word detection and beamforming. IC Role / Device Role / Timing Role: Simultaneous acquisition from three stereo analog input pairs with matched gain/phase, plus PDM digital mic support. Use Value: Supports synchronized 6-channel recording at 48 ksps with <±0.5° phase matching - critical for directional audio processing. |
| Portable Media Player Playback | Wearable Biometric Audio Monitoring |
Use Scenario: High-resolution music playback through wired headphones in PMPs with extended battery life. IC Role / Device Role / Timing Role: Stereo DAC with 100 dB SNR drives ground-centered 16 Ω loads; PowerTune™ scales power based on volume level. Use Value: Delivers >10 hours playback on single-cell Li-ion with no audible hiss at -30 dB volume setting. |
Use Scenario: Continuous physiological audio monitoring (e.g., heart/lung sounds) in compact wearable medical devices. IC Role / Device Role / Timing Role: Ultra-low-noise ADC (93 dB SNR) with programmable PGA captures sub-50 µV bio-signals; miniDSP performs real-time spectral analysis. Use Value: Achieves 110 dB effective dynamic range for diagnostic-grade audio capture with <3.3 µV RMS idle-channel noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar stereo audio codec applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV320AIC3254IRSBT | Lacks ground-centered headphone outputs; uses AC-coupled outputs requiring DC-blocking capacitors | Suitable for designs where board space permits 2× 100 µF electrolytics and system ground is stable | Select when miniDSP functionality is required but ground-centered HP drive is not needed |
| TLV320AIC3206IRHBT | No embedded miniDSP; fixed-function signal processing only; same ground-centered HP architecture | Better suited for cost-sensitive consumer audio where host processor handles all DSP tasks | Select when external DSP or host-based algorithms replace on-chip miniDSP requirements |
Compared with TLV320AIC3256IYZFR, TLV320AIC3254IRSBT requires additional passive components for headphone coupling and lacks integrated ground-reference control, while TLV320AIC3206IRHBT eliminates the programmable miniDSP engine-reducing flexibility in acoustic tuning but lowering software development overhead.
Availability
TLV320AIC3256IYZFR is available at Aetrix Electronics and suitable for mobile handsets, portable media players, and smart speaker designs requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for TLV320AIC3256IYZFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and signal chain solutions.
The TLV320AIC3256IYZFR belongs to TI's ultra-low-power audio codec product line, designed specifically for battery-constrained portable devices requiring high-fidelity audio capture, playback, and on-the-fly acoustic processing.
FAQ
What is the maximum supported sample rate for TLV320AIC3256IYZFR ADC and DAC operation?
The TLV320AIC3256IYZFR supports stereo ADC and DAC operation up to 96 ksps in standard mode, with 48 ksps being the typical operating point for lowest power consumption. At 48 ksps, it achieves 93 dB ADC SNR and 100 dB DAC SNR. Higher rates require increased MCLK frequency and may impact PowerTune™ efficiency and thermal performance.
Does TLV320AIC3256IYZFR support digital microphone (PDM) inputs?
Yes, TLV320AIC3256IYZFR supports stereo digital microphone inputs via dedicated PDM clock and data pins (DIN/MFP1 and MISO/MFP4). It includes built-in PDM-to-I²S decimation filters and can process two PDM streams simultaneously with programmable decimation ratios and noise shaping.
How does the charge pump in TLV320AIC3256IYZFR enable ground-centered headphone output?
The TLV320AIC3256IYZFR uses an internal charge pump with external flying capacitors (FLY_P/FLY_N) to generate a regulated negative rail (VNEG), allowing the headphone amplifier to swing symmetrically around 0 V. This eliminates the need for large DC-blocking capacitors and enables true ground-centered output into 16 Ω loads.
Can TLV320AIC3256IYZFR operate with AVdd = 1.5 V and DRVdd_HP = 1.8 V simultaneously?
Yes, TLV320AIC3256IYZFR supports mixed-supply operation: AVdd can be set to 1.5 V (minimum) while DRVdd_HP is independently supplied at 1.8 V for headphone drive. The datasheet specifies that DRVdd_HP must be ≥1.5 V in ground-centered mode, and Vsys must be ≥AVdd - both conditions are satisfied in this configuration.
What is the function of the GND_SENSE pin on TLV320AIC3256IYZFR?
The GND_SENSE pin on TLV320AIC3256IYZFR provides an external reference point for the headphone amplifier's virtual ground. It allows compensation for PCB ground bounce or IR drop, ensuring accurate DC offset cancellation and stable ground-centered output - especially critical in high-current headphone drive scenarios.
TLV320AIC3256IYZFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- PowerTune™
- Package/Case:
- 42-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Stereo Audio
- Data Interface:
- I2C, Serial, SPI™
- Resolution (Bits):
- 32 b
- Number of ADCs / DACs:
- 2 / 2
- Sigma Delta:
- Yes
- S/N Ratio, ADCs / DACs (db) Typ:
- 93 / 100
- Dynamic Range, ADCs / DACs (db) Typ:
- 93 / 100
- Voltage - Supply, Analog:
- 1.5V ~ 1.95V
- Voltage - Supply, Digital:
- 1.26V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 42-DSBGA (3.75x3.25)
TLV320AIC3256IYZFR FAQ
1.How can I place an order for TLV320AIC3256IYZFR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV320AIC3256IYZFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV320AIC3256IYZFR reliable?
The price and inventory of TLV320AIC3256IYZFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV320AIC3256IYZFR is usually 5 days.
3.What payment methods are accepted for TLV320AIC3256IYZFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV320AIC3256IYZFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV320AIC3256IYZFR?
TLV320AIC3256IYZFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV320AIC3256IYZFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV320AIC3256IYZFR?
For technical support, including TLV320AIC3256IYZFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV320AIC3256IYZFR requirements.
6.How does Aetrix verify that TLV320AIC3256IYZFR is sourced from the original manufacturer or authorized distributors?
All TLV320AIC3256IYZFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV320AIC3256IYZFR meets industry standards.
7.What is the process for return or replacement of TLV320AIC3256IYZFR?
All TLV320AIC3256IYZFR units undergo pre-shipment inspection (PSI). If there is an issue with TLV320AIC3256IYZFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV320AIC3256IYZFR part is unused and in its original packaging.
Return procedure for TLV320AIC3256IYZFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV320AIC3256IYZFR Tags
-
NAU88C22YG
Nuvoton Technology Corporation
-
TLV320AIC3100IRHBR
Texas Instruments
-
DA7212-01UM2
Renesas
-
NAU8810YG
Nuvoton Technology Corporation
-
DA7218-00U32
Renesas
-
CMX655DQ6-TR1K
CML Micro
-
SGTL5000XNLA3
NXP Semiconductors
-
TLV320AIC3104IRHBR
Texas Instruments
-
MAX9867EWV+T
Analog Devices Inc./Maxim Integrated
-
MAX9860ETG+T
Analog Devices Inc./Maxim Integrated
-
TLV320AIC3106IRGZR
Texas Instruments
-
SGTL5000XNLA3R2
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
