My Inquiry
My Account
Texas Instruments TLV341IDRLR
- Part No.:
- TLV341IDRLR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- SOT-563, SOT-666
- Datasheet:
-
TLV341IDRLR.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT SOT5X3
- Quantity:
- Payment:
- Shipping:
Inventory:10,630
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLV341IDRLR from Texas Instruments is a single-channel, low-voltage, rail-to-rail output CMOS operational amplifier with active-low shutdown control, 2.3MHz gain bandwidth, 0.9V/μs slew rate, and 70μA typical supply current per channel. It operates from 1.5V to 5.5V and delivers ±1.25mV maximum input offset voltage (A grade) over –40°C to 125°C - ideal for precision battery-monitoring circuits in portable electronics.
For engineers reviewing the TLV341IDRLR datasheet, TLV341IDRLR pinout, TLV341IDRLR application, or TLV341IDRLR equivalent, key selection criteria include its ultra-low 1pA typical input bias current, 10pA typical shutdown current, rail-to-rail output swing within 25mV of rails (at 10kΩ load), wide –0.2V to (V+ – 0.5V) common-mode input range, and SOT-23-6 package compatibility with space-constrained designs.
Technical Context
The TLV341IDRLR uses a PMOS input stage enabling ground-sensing capability and ultra-low input bias current, paired with a CMOS output stage delivering true rail-to-rail swing. Its shutdown function asserts high-impedance output and reduces supply current to ≤1μA (typical) when SHDN is pulled low.
Designed for single-supply operation down to 1.5V, it maintains stable phase margin (>55°) and unity-gain bandwidth (2.3MHz) across temperature (–40°C to 125°C) and supply voltages (1.8V/5V), with input-referred voltage noise of 20nV/√Hz at 10kHz and ESD robustness exceeding 2000V HBM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.5V to 5.5V - supports direct integration into Li-ion (3.0–4.2V) and single-cell alkaline (1.5V) systems without level-shifting. |
| Gain Bandwidth Product | 2.3MHz (typ) - enables stable closed-loop operation up to ~200kHz with gain ≥10, suitable for anti-aliasing and sensor signal conditioning. |
| Slew Rate | 0.9V/μs (typ at 1.8V) - sufficient for 10kHz full-scale sine output at 1.8V supply without distortion in audio preamp stages. |
| Input Offset Voltage | ≤1.25mV max (25°C, A grade) - ensures ≤0.025% error in 5V full-scale battery voltage monitoring (e.g., 4.2V → 4.199V reading). |
| Shutdown Current | 10pA (typ) - draws <1nA total in shutdown, preserving battery life for multi-year IoT endpoint deployments. |
| Input Bias Current | 1pA (typ) - minimizes voltage drop across high-impedance sensor bridges (e.g., >10MΩ thermistors) and leakage-sensitive pH electrodes. |
| Common-Mode Input Range | –0.2V to (V+ – 0.5V) - accepts signals referenced to ground in single-supply systems, eliminating need for input biasing networks. |
Pinout & Package
TLV341IDRLR is packaged in a 6-pin SOT-23 (DRL) with 1.60mm × 1.20mm body size, optimized for high-density PCB layouts in handheld devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN+) | Noninverting input | High-impedance node accepting analog signals down to –0.2V; requires no external bias for ground-referenced sources. |
| 2 (GND) | Ground reference | Primary return path for supply and signal currents; must be connected to system analog ground plane. |
| 3 (IN−) | Inverting input | Differential input node used in inverting configurations; matched impedance critical for CMRR preservation. |
| 4 (OUT) | Amplifier output | Rail-to-rail CMOS output capable of sourcing/sinking ≥6mA; high-impedance during shutdown. |
| 5 (SHDN) | Active-low shutdown control | Pull low (≤0.2V) to disable amplifier; pull high (≥1.5V at 1.8V supply) to enable; no external pull-up required. |
| 6 (V+) | Positive supply | Single positive rail input (1.5–5.5V); bypass with 0.1μF ceramic capacitor placed ≤2mm from pin. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Delivers output within 25mV of V+ and GND at 10kΩ load - eliminates headroom loss in low-voltage ADC driver stages. |
| Ultra-low input bias current | 1pA typical enables use with >100MΩ source impedances (e.g., piezoelectric sensors) without significant signal attenuation. |
| Low shutdown current | 10pA typical per channel allows micro-power sleep modes in always-on monitoring systems (e.g., wearable health sensors). |
| Extended temperature range | –40°C to 125°C operation supports deployment in automotive cabin modules and industrial motor controllers. |
| ESD robustness | 2000V HBM rating reduces risk of field failure during handling and assembly in uncontrolled environments. |
Applications
| Battery Monitoring | Audio Preamplification |
|---|---|
Use Scenario: Real-time measurement of single-cell Li-ion voltage (2.5V–4.2V) in Bluetooth earbuds with 12-bit internal ADC. IC Role / Device Role / Timing Role: Precision buffer and level translator driving ADC input while rejecting supply ripple via 95dB PSRR. Use Value: 1.25mV max offset ensures <0.03% full-scale error; rail-to-rail output fully utilizes 0–4.2V ADC range without external biasing. | Use Scenario: Low-noise amplification of electret microphone output (10mV RMS) in voice-controlled smart speakers. IC Role / Device Role / Timing Role: First-stage preamplifier with 20nV/√Hz input noise and 2.3MHz bandwidth preserving voice-band fidelity (20Hz–20kHz). Use Value: 1pA input bias prevents loading of high-impedance mic capsule; shutdown mode cuts system standby current by >99%. |
| Portable Equipment Supply Sensing | Cellular Phone Front-End Signal Conditioning |
Use Scenario: Detection of USB-C power delivery status (5V/9V/15V) via resistive divider in compact power banks. IC Role / Device Role / Timing Role: High-impedance voltage follower isolating divider network from load variations and enabling accurate ADC sampling. Use Value: 1pA input bias avoids divider ratio drift; 1.5V min supply allows operation directly from LDO outputs without boost conversion. | Use Scenario: Signal conditioning for antenna diversity switching control logic in 4G/LTE smartphones. IC Role / Device Role / Timing Role: Comparator input buffer and hysteresis generator with fast 5μs wake-up from shutdown during RF state transitions. Use Value: 5μs turnon time synchronizes with LTE frame timing; 125°C rating survives proximity to PA modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV341IDBVR | SOT-23-6 (DBV) package; identical electrical specs; 2.90mm × 1.60mm footprint vs DRL's 1.60mm × 1.20mm. | Less board area efficiency; requires larger pad layout; same thermal resistance (RθJA = 193.4°C/W). | Select TLV341IDBVR only if legacy PCB design uses DBV land pattern or requires higher thermal mass. |
| OPA316IDBVR | Higher 10MHz GBW, 6V/μs slew rate, but 250μA supply current and no shutdown pin; 1.8V–5.5V supply. | Not suitable for ultra-low-power shutdown modes; better for high-speed filtering but increases quiescent power 3.5×. | Choose OPA316IDBVR only when bandwidth >5MHz is mandatory and continuous operation justifies higher current draw. |
Compared with TLV341IDBVR, TLV341IDRLR saves 44% board area and improves thermal performance in thin-profile assemblies; versus OPA316IDBVR, it trades speed for 72% lower active current and integrated shutdown - critical for battery runtime in portable instrumentation.
Availability
TLV341IDRLR is available at Aetrix Electronics and suitable for battery monitoring, portable equipment supply sensing, audio preamplification, and cellular phone front-end signal conditioning requiring stable component supply across industrial and consumer production cycles.
Supply support for TLV341IDRLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op-amps and low-power signal chain solutions.
The TLV34xx family was engineered for ultra-low-voltage, rail-to-rail precision amplification in space- and power-constrained applications - targeting portable medical devices, wearables, and energy-harvesting sensor nodes.
FAQ
What is the maximum operating temperature range for TLV341IDRLR?
The TLV341IDRLR is rated for continuous operation from –40°C to +125°C ambient temperature, validated per TI's extended industrial specifications. This range enables reliable use in under-hood automotive modules, industrial motor drives, and outdoor IoT gateways where thermal stress exceeds commercial-grade limits. The device maintains specified offset voltage (≤1.7mV max), gain bandwidth (≥2.2MHz), and shutdown current (≤1.5μA) across this full range.
Does TLV341IDRLR require external components for stable operation?
Yes - TLV341IDRLR requires a 0.1μF ceramic bypass capacitor placed between V+ and GND, located ≤2mm from the pins, to suppress supply noise and prevent oscillation. No compensation network is needed for unity-gain stable operation, but layout best practices (ground plane separation, short input traces) are essential to preserve 95dB PSRR and 20nV/√Hz noise performance. The SHDN pin may use a pull-up resistor if driven by open-drain logic.
How does the shutdown feature of TLV341IDRLR affect output behavior?
When the SHDN pin is pulled low (≤0.2V), TLV341IDRLR enters shutdown mode: supply current drops to ≤1μA (typical), and the output transitions to a high-impedance (Hi-Z) state - neither sourcing nor sinking current. This prevents loading of downstream circuitry (e.g., ADC inputs or filters) and eliminates DC error injection. Output resumes normal rail-to-rail operation within 5μs after SHDN returns high (≥1.5V at 1.8V supply).
Can TLV341IDRLR drive capacitive loads directly?
TLV341IDRLR is stable driving ≤500pF capacitive loads without external isolation resistance, as confirmed by phase margin >55° in datasheet Figure 5-24. For loads >500pF (e.g., long cables or large ADC input capacitance), a series 10–50Ω resistor should be added between OUT and the load to maintain stability. Driving purely capacitive loads >1nF risks peaking or oscillation unless compensated per TI's Application Report SBAA342.
Is TLV341IDRLR pin-compatible with other members of the TLV34xx family?
No - TLV341IDRLR (SOT-23-6, DRL package) has a unique pinout: Pin 1=IN+, Pin 2=GND, Pin 3=IN−, Pin 4=OUT, Pin 5=SHDN, Pin 6=V+. This differs from TLV341IDBVR (SOT-23-6, DBV) which swaps IN+ and GND positions (Pin 1=GND, Pin 2=IN+). TLV342 dual variants use 8- or 10-pin packages and are not pin-compatible. Always verify pin mapping using TI's SLVS568E datasheet Figure 4-2 before PCB layout.
TLV341IDRLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1V/µs
- Gain Bandwidth Product:
- 2.3 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 300 µV
- Current - Supply:
- 75µA
- Current - Output / Channel:
- 115 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-5X3
TLV341IDRLR FAQ
1.How can I place an order for TLV341IDRLR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV341IDRLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV341IDRLR reliable?
The price and inventory of TLV341IDRLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV341IDRLR is usually 5 days.
3.What payment methods are accepted for TLV341IDRLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV341IDRLR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV341IDRLR?
TLV341IDRLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV341IDRLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV341IDRLR?
For technical support, including TLV341IDRLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV341IDRLR requirements.
6.How does Aetrix verify that TLV341IDRLR is sourced from the original manufacturer or authorized distributors?
All TLV341IDRLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV341IDRLR meets industry standards.
7.What is the process for return or replacement of TLV341IDRLR?
All TLV341IDRLR units undergo pre-shipment inspection (PSI). If there is an issue with TLV341IDRLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV341IDRLR part is unused and in its original packaging.
Return procedure for TLV341IDRLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV341IDRLR Tags
-
LM358DT
STMicroelectronics
-
LM358DR
Texas Instruments
-
LM2904DR
Texas Instruments
-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments
-
MCP6006T-E/OT
Microchip Technology
-
MCP6006UT-E/OT
Microchip Technology
-
LM324PWR
Texas Instruments
-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments
-
LM358P
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
