Texas Instruments TLV3802DSSR

Overview

TLV3802DSSR from Texas Instruments is a dual-channel, 225-ps propagation delay, LVDS-output high-speed comparator in a 12-pin WSON package (3.00 mm × 2.00 mm), operating from 2.7 V to 5.25 V single or split supply, with 2 mV internal hysteresis and 240-ps minimum input pulse width detection. It serves as the core timing decision element in LIDAR distance sensing and time-of-flight sensor front-ends.

For engineers reviewing the TLV3802DSSR datasheet, TLV3802DSSR pinout, TLV3802DSSR application, or TLV3802DSSR equivalent, key selection criteria include sub-250-ps propagation delay consistency across temperature, channel-to-channel skew ≤6 ps, LVDS output compatibility with FPGA clock/data capture inputs, and dual-channel integration for differential trigger pair processing in high-speed test equipment.

Technical Context

The TLV3802DSSR implements a fully differential input stage with independent VCC/VEE rails-enabling flexible single-supply (VEE = GND) or split-supply operation-while its LVDS output stage references GND and delivers ±350-mV differential swing at 1.25-V common-mode voltage. Its architecture minimizes overdrive dispersion (5 ps) and common-mode dispersion (2 ps) to preserve timing fidelity under varying signal conditions.

Each channel features matched propagation paths with ≤2.5-ps intra-channel skew and ≤6-ps inter-channel skew, supporting synchronous dual-edge sampling in oscilloscope trigger chains and parallel time-of-flight binning. The device's 3-GHz toggle frequency and 6-Gbps data rate capability are validated under 50-mV input overdrive with 50% output swing.

Key Specifications

Pinout & Package

TLV3802DSSR is housed in a thermally enhanced 12-pin WSON package (3.00 mm × 2.00 mm, DSS variant) with exposed thermal pad connected to VEE. The package supports high-density PCB layouts in optical sensor modules and portable test instrumentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed comparator applications.

Compared with TLV3802DSSR, TLV3801DCKR offers half the channel count in 30% less area but cannot support correlated dual-edge timing; LMH7322MA/NOPB provides broader supply range and higher voltage tolerance but sacrifices 125 ps of speed and requires external LVDS translation circuitry.

Availability

TLV3802DSSR is available at Aetrix Electronics and suitable for LIDAR subsystems, time-of-flight sensor modules, and high-speed oscilloscope trigger circuits requiring stable component supply, long-term production continuity, and guaranteed TI original packaging.

Supply support for TLV3802DSSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed signal conditioning and precision timing solutions.

The TLV3802DSSR belongs to TI's high-speed comparator product line, engineered specifically for sub-nanosecond timing-critical applications including optical sensing, test equipment, and real-time industrial feedback loops.

FAQ

What is the maximum operating temperature for TLV3802DSSR?

The TLV3802DSSR is rated for operation from –40°C to +125°C ambient temperature. Its junction temperature can reach up to 150°C under recommended operating conditions, making it suitable for under-hood automotive LIDAR modules and industrial enclosures without active cooling. Thermal resistance RθJA is 63.2°C/W in the 12-pin WSON package.

Does TLV3802DSSR require external hysteresis for noise immunity?

The TLV3802DSSR includes 2 mV of internal hysteresis, sufficient for most industrial and optical sensing applications with moderate noise. External hysteresis is optional and only recommended when input signals exhibit significant low-frequency noise or very slow slew rates-design guidance is provided in Section 8.2.2 of the TLV3802DSSR datasheet.

Can TLV3802DSSR operate from a single 3.3-V supply?

Yes. TLV3802DSSR supports single-supply operation: connect VEE to GND and apply 3.3 V to VCC pins (7 and 10). Input common-mode range becomes GND + 1.5 V to 3.3 V, and LVDS outputs deliver ±350 mV swing referenced to 1.25 V, fully compliant with 3.3-V FPGA I/O standards.

How is channel-to-channel skew specified for TLV3802DSSR?

TLV3802DSSR specifies ΔtPD (channel-to-channel propagation delay skew) as 6 ps maximum under VOVERDRIVE = VUNDERDRIVE = 50 mV and 50-MHz square wave conditions. This value is measured across temperature and supply variations and guarantees deterministic timing alignment between Channel 1 and Channel 2 outputs.

Is the thermal pad on TLV3802DSSR required to be connected?

Yes. The exposed thermal pad on the TLV3802DSSR WSON package must be soldered to a PCB copper pour tied to the VEE net. Per datasheet Table 5-2, the thermal pad connects directly to VEE internally; omitting this connection degrades thermal performance and risks exceeding junction temperature limits during sustained 3-GHz toggling.