Texas Instruments TLV3811CYBGT

Overview

TLV3811CYBGT from Texas Instruments is a single-channel, 225-ps propagation delay high-speed comparator with LVDS differential outputs, designed for ultra-fast timing-critical signal discrimination in optical and RF sensing systems. It operates from 2.7 V to 5.25 V single supply, delivers 1.1 mV internal hysteresis, supports 240-ps minimum input pulse detection, and is housed in a 1.218 mm × 0.818 mm 6-pin DSBGA package for space-constrained LIDAR receiver modules.

For engineers reviewing the TLV3811CYBGT datasheet, TLV3811CYBGT pinout, TLV3811CYBGT application, or TLV3811CYBGT equivalent, key selection criteria include its sub-250-ps propagation delay consistency across temperature, LVDS output compatibility with FPGA/CPU receivers, low 17 mA quiescent current at 125°C, and precise 1.1 mV hysteresis optimized for noise-immune ToF signal thresholding in drone vision and industrial distance sensing.

Technical Context

The TLV3811CYBGT uses a fully differential input stage referenced to GND (no VEE pin), enabling operation solely on single-supply rails while maintaining high common-mode rejection (80 dB) over 1.5 V to VCC input range. Its LVDS output driver delivers ±350 mV differential swing at 1.25 V common-mode voltage into 100 Ω termination, with matched rise/fall times of 135 ps and <±2.5 ps propagation delay skew.

Unlike the TLV380x series, TLV3811CYBGT integrates input and output power domains onto one supply rail (VCC–GND), eliminating split-supply complexity but requiring careful PCB layout to minimize ground bounce on the shared DSBGA ground terminal. Its 1.1 mV hysteresis is factory-trimmed and stable over –40°C to +125°C, making it suitable for unattended outdoor sensing deployments without external feedback networks.

Key Specifications

Pinout & Package

TLV3811CYBGT is packaged in a 1.218 mm × 0.818 mm, 6-pin DSBGA (YBG) with bottom-side solder balls. The package features a single exposed thermal pad connected internally to GND, requiring direct PCB copper connection for thermal performance and EMI control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed comparator applications.

Compared with TLV3811YBGT, TLV3811CYBGT adds deterministic 1.1 mV hysteresis for noise immunity without external components; compared with ADCMP572, it reduces propagation delay by 125 ps, cuts supply voltage range by 40%, and halves board area via DSBGA-6 packaging-making it optimal for next-gen compact ToF sensors.

Availability

TLV3811CYBGT is available at Aetrix Electronics and suitable for LIDAR modules, drone vision subsystems, and high-speed test equipment requiring stable component supply, long-term production continuity, and guaranteed traceable sourcing.

Supply support for TLV3811CYBGT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed signal conditioning and precision timing solutions.

The TLV3811CYBGT belongs to TI's ultra-high-speed comparator product line, engineered specifically for time-of-flight, LIDAR, and optical sensing applications demanding picosecond-level timing fidelity and minimal board footprint.

FAQ

What is the maximum operating temperature for TLV3811CYBGT?

The TLV3811CYBGT is rated for continuous operation from –40°C to +125°C ambient temperature. Its quiescent current remains stable at ≤23 mA across this full range, and propagation delay variation is limited to ±0.2 ps/°C, making it suitable for under-hood automotive LIDAR and industrial outdoor enclosures without derating.

Does TLV3811CYBGT require external hysteresis components?

No, TLV3811CYBGT includes factory-trimmed 1.1 mV internal hysteresis, eliminating the need for external positive-feedback resistors. This simplifies PCB layout, reduces component count, and ensures consistent hysteresis performance across temperature and process variation-critical for repeatable ToF measurements in TLV3811CYBGT-based systems.

Can TLV3811CYBGT drive standard FPGA LVDS inputs directly?

Yes, TLV3811CYBGT's LVDS outputs are fully compliant with ANSI TIA/EIA-644-A and deliver ±350 mV differential swing into a 100 Ω load terminated at 1.25 V common-mode voltage-matching the input requirements of Xilinx Kintex/Virtex and Intel Stratix/Cyclone FPGAs without external AC-coupling or level-shifting circuitry.

What is the recommended PCB layout practice for TLV3811CYBGT's DSBGA package?

For TLV3811CYBGT, place 6-mil-wide traces no longer than 2 mm from each pin to matching 0.3-mm-diameter vias; connect the bottom thermal pad to a solid GND plane using ≥4 thermal vias; use separate 100 nF ceramic capacitors placed within 1 mm of VCC and GND pins; and route IN+/IN− as tightly coupled 50-Ω differential pairs with no stubs or discontinuities.

How does TLV3811CYBGT differ from TLV3801 in power architecture?

TLV3811CYBGT uses a single-supply architecture (VCC–GND only) with integrated input/output referencing, whereas TLV3801 requires dual supplies (VCC and VEE) to separate input and output ground domains. This makes TLV3811CYBGT simpler to implement in compact systems but limits its common-mode input range to GND-referenced signals, unlike TLV3801's wider split-supply flexibility.