Texas Instruments TLV3811YBGT

Overview

TLV3811YBGT from Texas Instruments is a 225-ps propagation delay, single-channel high-speed comparator with LVDS differential outputs, 1.1 mV internal hysteresis, and 240-ps minimum input pulse width detection capability. It operates from a single 2.7 V to 5.25 V supply and delivers 6 Gbps toggle rate for time-critical optical sensing and test equipment interfaces.

For engineers reviewing the TLV3811YBGT datasheet, TLV3811YBGT pinout, TLV3811YBGT application, or TLV3811YBGT equivalent, this device is selected for ultra-low overdrive dispersion (5 ps), split ground-referenced LVDS output compatibility with FPGAs, and space-constrained LIDAR front-ends requiring sub-250-ps timing fidelity.

Technical Context

The TLV3811YBGT employs a fully differential input stage optimized for common-mode voltage range of GND + 1.5 V to VCC, with ESD-protected 50-Ω input resistors. Its LVDS output driver delivers ±350 mV differential swing at 1.25 V common-mode voltage into 100-Ω termination, enabling direct interface to FPGA I/O banks without level-shifting.

Unlike the WSON-packaged TLV3801/TLV3802, the TLV3811YBGT uses a single-supply architecture-VCC referenced to GND only-with no VEE pin. Its 6-pin DSBGA package integrates thermal pad connected to GND, supporting high-density optical sensor modules where board area and thermal resistance (R_θJB = 41°C/W) are critical.

Key Specifications

Pinout & Package

TLV3811YBGT is housed in a 1.218 mm × 0.818 mm, 6-pin DSBGA (YBG) package with bottom-side thermal pad connected to GND. The package is designed for fine-pitch optical sensor module assembly and supports reflow-compatible soldering.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed comparator applications.

Compared with TLV3811CYBGT, TLV3811YBGT adds 1.1 mV hysteresis for noise immunity without sacrificing speed; compared with TLV3801RGTR, it reduces footprint by 67% and lowers quiescent current by ~20%, making it optimal for miniaturized optical sensing nodes.

Availability

TLV3811YBGT is available at Aetrix Electronics and suitable for LIDAR subsystems, time-of-flight sensor modules, and high-speed test equipment requiring stable component supply, tight timing performance, and miniature packaging.

Supply support for TLV3811YBGT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with broad portfolio coverage across industrial, automotive, and communications markets.

The TLV3811YBGT belongs to TI's high-speed comparator product line, engineered specifically for ultra-low-latency, high-fidelity signal discrimination in optical sensing, test instrumentation, and precision timing applications.

FAQ

What is the propagation delay specification for TLV3811YBGT?

The TLV3811YBGT has a typical propagation delay of 225 ps under standard test conditions (50 mV overdrive, 50 MHz square wave). This value is guaranteed across –40°C to +125°C ambient temperature and represents the time from input crossing to valid LVDS output transition, enabling precise timing in LIDAR and ToF systems.

Does TLV3811YBGT require a negative supply voltage?

No, TLV3811YBGT operates exclusively from a single positive supply (2.7 V to 5.25 V) referenced to GND. Unlike TLV3801/TLV3802, it has no VEE pin and does not support split-supply operation-its input common-mode range is GND + 1.5 V to VCC, simplifying power architecture in compact modules.

What is the hysteresis value of TLV3811YBGT and how does it affect performance?

The TLV3811YBGT features 1.1 mV of internal hysteresis, which stabilizes output against noise on moderate-slew inputs without degrading sensitivity to fast edges. This value is confirmed in the Electrical Characteristics table and differs from TLV3811CYBGT (0 mV) and TLV3801 (2 mV), allowing tailored selection based on signal integrity requirements.

Can TLV3811YBGT drive standard LVDS receivers directly?

Yes, TLV3811YBGT's LVDS outputs meet ANSI/TIA/EIA-644-A specifications, delivering ±350 mV differential swing into a 100-Ω load with 1.25 V common-mode voltage. It interfaces directly with FPGA transceivers, ASIC LVDS inputs, and other standards-compliant receivers without external termination or level-shifting components.

What package type is used for TLV3811YBGT and what are its key mechanical properties?

TLV3811YBGT uses a 6-pin DSBGA (YBG) package with nominal body size 1.218 mm × 0.818 mm and 0.4-mm pitch. The bottom thermal pad is electrically and thermally connected to GND, and the package supports IPC/JEDEC J-STD-020-compliant reflow profiles-ideal for high-density optical sensor module assembly.