Texas Instruments TLV4112IDGN

Overview

TLV4112IDGN from Texas Instruments is a dual-channel, rail-to-rail output operational amplifier optimized for high-current buffer and coil driver applications. It delivers >300 mA per channel at 5 V, features 2.7 MHz unity-gain bandwidth, 1.5 V/µs slew rate, and operates from 2.5 V to 6 V supply with 700 µA/channel quiescent current. It is specified for −40°C to 125°C industrial temperature range and housed in thermally enhanced MSOP-8 PowerPAD™ package.

For engineers reviewing the TLV4112IDGN datasheet, TLV4112IDGN pinout, TLV4112IDGN application, or TLV4112IDGN equivalent, key selection criteria include continuous output current capability under thermal constraints, rail-to-rail output swing at high load, shutdown compatibility (not supported on TLV4112), and MSOP PowerPAD layout requirements for thermal management.

Technical Context

The TLV4112IDGN employs a proprietary output stage architecture enabling >300 mA continuous sourcing/sinking per channel while maintaining rail-to-rail output swing down to within 200 mV of rails at 100 mA load. Its internal compensation ensures stability with capacitive loads up to 1 nF without external snubbing, and phase margin remains ≥66° with 100 Ω load and 10 pF capacitance.

Unlike TLV4110/TLV4113, TLV4112IDGN lacks a dedicated shutdown pin - it is a non-shutdown variant in the dual-channel configuration. Its input stage provides 63–68 dB CMRR across 3 V/5 V supplies and supports common-mode input range from GND to VDD−1.5 V.

Key Specifications

Pinout & Package

TLV4112IDGN uses an 8-pin MSOP PowerPAD™ package with exposed thermal pad (electrically isolated, must be soldered to PCB ground plane). The package provides θ_JA = 52.7°C/W and θ_JC = 4.7°C/W, enabling >2 W power dissipation with proper PCB layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current operational amplifier applications.

Compared with OPA2541IDR and LM7332MA/NOPB, TLV4112IDGN uniquely balances 300+ mA output, rail-to-rail swing, ultra-low quiescent current (700 µA), and MSOP PowerPAD thermal performance - making it optimal for space- and power-constrained industrial and automotive actuators where 2.5–6 V operation is mandatory.

Availability

TLV4112IDGN is available at Aetrix Electronics and suitable for industrial automation, automotive subsystems, and medical device manufacturing requiring stable component supply with guaranteed long-term availability and traceable sourcing.

Supply support for TLV4112IDGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog ICs, embedded processors, and digital signal processors for industrial, automotive, and consumer markets.

The TLV411x family was engineered specifically for high-current, single-supply operational amplifier applications - emphasizing thermal efficiency, rail-to-rail output, and robustness in harsh environments like motor control and solenoid actuation.

FAQ

What is the maximum continuous output current for TLV4112IDGN at 125°C ambient?

The TLV4112IDGN delivers up to 350 mA continuous output current per channel when junction temperature is maintained ≤105°C. At 125°C ambient, thermal design must limit power dissipation to keep TJ ≤105°C - achievable via the MSOP PowerPAD™ package's 4.7°C/W junction-to-case thermal resistance and proper PCB copper area. Datasheet specifies 110 mA continuous per channel if TJ reaches 150°C.

Does TLV4112IDGN include a shutdown pin?

No, TLV4112IDGN does not have a shutdown pin. Shutdown functionality is only available on TLV4110 (single) and TLV4113 (dual with shutdown), not on TLV4112. The TLV4112IDGN is a non-shutdown dual op-amp variant intended for always-on high-current buffer applications where rapid enable/disable is not required.

Can TLV4112IDGN drive a 100 pF capacitive load stably?

Yes, TLV4112IDGN is internally compensated for stable operation with capacitive loads up to 1 nF (1000 pF) when driving 100 Ω loads. A 100 pF load is well within this specification - no external series resistor (RNULL) is needed. Phase margin remains ≥66° under these conditions, preventing ringing or oscillation in applications like piezo actuator drivers or coaxial cable interfaces.

What is the recommended PCB layout for the TLV4112IDGN PowerPAD™ thermal pad?

The TLV4112IDGN's exposed thermal pad must be soldered to a solid GND copper area on the PCB. Texas Instruments recommends five 13-mil-diameter thermal vias under the pad, connected fully (not webbed) to an internal GND plane. The pad itself must be left unmasked on the top side and covered on the bottom side to prevent solder wicking. This layout achieves θ_JA = 52.7°C/W and enables >2 W power dissipation.

How does the rail-to-rail output of TLV4112IDGN improve performance in 3.3 V systems?

In 3.3 V systems, TLV4112IDGN's rail-to-rail output delivers >3.1 V swing at 100 mA load - preserving 94% of full-scale dynamic range. This maximizes SNR in ADC-driven feedback loops and avoids signal clipping in low-voltage audio or sensor signal chains, unlike conventional op-amps that lose 1–2 V of headroom and require higher supply rails or level-shifting circuitry.