Texas Instruments TLV4113IDGQ
- Part No.:
- TLV4113IDGQ
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TLV4113IDGQ.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 10HVSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:167
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Product details
Overview
TLV4113IDGQ from Texas Instruments is a dual-channel, rail-to-rail output operational amplifier with shutdown control, delivering >300 mA output current per channel at 5 V, unity-gain bandwidth of 2.7 MHz, slew rate of 1.5 V/µs, and supply current of 700 µA per channel across 2.5 V to 6 V operation. It targets high-current buffer and coil driver applications in industrial motor control and sensor excitation circuits.
For engineers reviewing the TLV4113IDGQ datasheet, TLV4113IDGQ pinout, TLV4113IDGQ application, or TLV4113IDGQ equivalent, this page delivers verified package mapping (10-pin MSOP PowerPAD™), confirmed dual-channel shutdown functionality, thermal performance data (θJA = 52.3°C/W), and real-world output voltage vs. load current curves for design validation.
Technical Context
The TLV4113IDGQ integrates two independent high-output-drive op-amps with dedicated shutdown pins (1SHDN and 2SHDN) and rail-to-rail output swing, enabling direct interface with low-voltage logic and power stages. Its internal architecture supports stable operation into capacitive loads ≥1 nF when used with RNULL series output resistors up to 20 Ω.
It operates across −40°C to 125°C with specified input offset voltage (±3.5 mV max), CMRR (63–68 dB), and PSRR (65–79 dB), and features thermally enhanced MSOP PowerPAD™ packaging that reduces junction-to-ambient thermal resistance to 52.3°C/W - critical for sustaining 350 mA continuous output current at TJ ≤ 105°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | ±320 mA @ 5 V (measured at 0.5 V from rail); enables direct driving of solenoids, relays, and piezo actuators without external buffers |
| Rail-to-Rail Output | Swings within 100 mV of supply rails @ 100 mA load; preserves dynamic range in low-voltage (2.5–6 V) systems |
| Unity-Gain Bandwidth | 2.7 MHz; supports stable closed-loop gain ≥1 configurations for precision signal conditioning and active filtering |
| Slew Rate | 1.5 V/µs @ 5 V; ensures <1.3 µs settling to 0.01% for 1-V step inputs, suitable for fast-settling analog front-ends |
| Supply Current | 700 µA per channel @ 25°C; ultra-low quiescent draw enables battery-powered portable instrumentation |
| Shutdown Current | ≤15 µA per channel (full temperature range); reduces system standby power by >98% versus active mode |
| Operating Temperature | −40°C to 125°C (industrial grade); qualified for under-hood automotive sensors and industrial PLC I/O modules |
Pinout & Package
The TLV4113IDGQ uses a 10-pin MSOP PowerPAD™ package (DGQ) with exposed thermal pad on underside, optimized for high-power dissipation (2.39 W at TA = 25°C). The thermal pad is electrically isolated and must be soldered to PCB ground plane for thermal and mechanical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OUT | Channel 1 output | Delivers high-current rail-to-rail output; requires RNULL series resistor for >1 nF capacitive loads |
| 1IN− | Channel 1 inverting input | Differential input node; bias current ≤500 pA (I-suffix) minimizes error in high-impedance sensor interfaces |
| 1IN+ | Channel 1 non-inverting input | Common-mode range extends to GND and VDD−1.5 V; supports single-supply transducer signal amplification |
| GND | Analog ground reference | Reference for all inputs/outputs; thermal pad must connect to same net for optimal heat transfer |
| 1SHDN | Channel 1 shutdown control | Active-low logic input; <0.9 V @ 3 V supply disables amp and places output in high-Z state |
| VDD+ | Positive supply rail | Accepts 2.5–6 V; PSRR ≥65 dB suppresses supply noise coupling into amplified signals |
| 2OUT | Channel 2 output | Independent high-current output; crosstalk <−60 dB @ 100 kHz enables dual-channel isolation |
| 2IN− | Channel 2 inverting input | Matched input characteristics to Channel 1; supports dual feedback networks in precision instrumentation |
| 2IN+ | Channel 2 non-inverting input | Identical common-mode range and offset specs as 1IN+; enables matched differential pair configurations |
| 2SHDN | Channel 2 shutdown control | Independent enable/disable; allows staggered power sequencing in multi-stage analog signal chains |
Key Features
| Feature | Design Value |
|---|---|
| High Output Drive | 350 mA continuous per channel (TJ ≤ 105°C) enables direct coil/solenoid actuation without discrete drivers |
| Thermally Enhanced Package | MSOP PowerPAD™ (DGQ) achieves θJA = 52.3°C/W - 3× lower than SOIC, allowing >2× higher sustained output power |
| Independent Dual Shutdown | Separate 1SHDN/2SHDN pins permit per-channel power gating in multi-function analog subsystems |
| Rail-to-Rail Output | Output swings to within 100 mV of VDD/GND at 100 mA load, maximizing usable signal swing in 3.3 V systems |
| Low Input Offset Drift | 3 µV/°C typical drift ensures stable DC accuracy over industrial temperature range without recalibration |
| Capacitive Load Stability | Guaranteed phase margin ≥66° with 10 pF load; RNULL compensation support simplifies layout for >1 nF loads |
Applications
| Industrial Solenoid Driver | High-Current Sensor Excitation |
|---|---|
Use Scenario: Driving 24-V DC solenoids in programmable logic controller (PLC) output modules requiring fast turn-on/turn-off and thermal robustness. IC Role / Device Role / Timing Role: Dual-channel high-current buffer with independent shutdown; each channel drives one solenoid coil with rail-to-rail swing and 350 mA continuous sourcing. Use Value: Eliminates need for external MOSFET drivers; 1.5 V/µs slew rate ensures <2 µs response to PWM control signals; PowerPAD™ package sustains 105°C junction temperature during burst-mode operation. |
Use Scenario: Providing precise, stable excitation current to RTD or strain gauge bridges in industrial process transmitters. IC Role / Device Role / Timing Role: Dual op-amp configured as constant-current source and differential receiver; rail-to-rail output maintains full bridge voltage range at low supply voltages. Use Value: 700 µA/channel supply current enables battery-powered field instruments; ±3.5 mV input offset and 3 µV/°C drift ensure <0.1% measurement error over −40°C to 125°C. |
| Automotive HVAC Actuator | Portable Medical Pump Control |
Use Scenario: Controlling bi-directional DC motors in vehicle heating/ventilation flap actuators with embedded thermal protection. IC Role / Device Role / Timing Role: Dual op-amp used in H-bridge gate driver interface and current sense amplifier; shutdown pins enable sleep-mode current reduction during vehicle ignition-off. Use Value: −40°C to 125°C rating meets AEC-Q100 Grade 1 requirements; 15 µA shutdown current extends battery life; output short-circuit capability (800 mA) withstands motor stall conditions. |
Use Scenario: Regulating micro-stepper motor current in handheld infusion pumps where size, power, and reliability are critical. IC Role / Device Role / Timing Role: Dual-channel current sink/source for bipolar stepper winding control; independent shutdown allows selective channel disable during idle phases. Use Value: MSOP PowerPAD™ package fits space-constrained PCBs while dissipating 2.39 W; 2.7 MHz GBWP supports closed-loop current regulation at >10 kHz switching frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-output-drive operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV4113IDR | Same die, 14-pin SOIC (D) package; θJA = 122.3°C/W limits continuous output current to 204 mA at 125°C ambient | Larger footprint and lower thermal performance; suited for lower-power or cost-sensitive designs where board area is not constrained | Select TLV4113IDR only if SOIC assembly infrastructure exists and peak output current ≤200 mA suffices |
| OPA2544TIPWPR | Higher output current (1.5 A), wider supply (±2.5 V to ±18 V), but no shutdown function and larger HTSSOP-20 package | Designed for high-voltage bipolar operation; lacks per-channel shutdown and consumes >2 mA per channel | Choose OPA2544TIPWPR only when >500 mA drive or split-supply operation is mandatory; TLV4113IDGQ is superior for low-voltage, low-quiescent, dual-shutdown needs |
Compared with TLV4113IDR and OPA2544TIPWPR, the TLV4113IDGQ uniquely balances ultra-low shutdown current (≤15 µA), dual independent shutdown, rail-to-rail output, and thermally optimized MSOP PowerPAD™ packaging - making it the optimal choice for space-constrained, battery-aware industrial and automotive actuators requiring precise per-channel power control.
Availability
TLV4113IDGQ is available at Aetrix Electronics and suitable for industrial motor control, automotive HVAC actuation, and portable medical device design requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for TLV4113IDGQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision amplifiers and power-efficient signal conditioning solutions.
The TLV4113IDGQ belongs to TI's TLV411x family of high-output-drive operational amplifiers, engineered specifically for industrial and automotive applications demanding robust thermal performance, rail-to-rail operation, and integrated power management via shutdown control.
FAQ
What is the maximum continuous output current for TLV4113IDGQ at 125°C ambient temperature?
The TLV4113IDGQ delivers 204.4 mA continuous output current per channel at TA = 125°C, based on its 122.3°C/W junction-to-ambient thermal resistance (θJA) and 150°C absolute maximum junction temperature. This value is derived from the Dissipation Rating Table in the official datasheet (SLOS289E) and assumes proper PCB thermal design with the PowerPAD™ soldered to a ground plane. Exceeding this current risks thermal shutdown or long-term reliability degradation.
Does TLV4113IDGQ support rail-to-rail input operation?
No, the TLV4113IDGQ does not support rail-to-rail input operation. Its common-mode input voltage range is specified as 0 V to VDD−1.5 V, meaning the inputs cannot swing within 1.5 V of the positive rail. However, it does provide true rail-to-rail output swing - delivering voltages within 100 mV of both GND and VDD under 100 mA load - which is essential for maximizing dynamic range in single-supply systems.
How does the shutdown feature work on TLV4113IDGQ, and what is the logic polarity?
The TLV4113IDGQ features two independent active-low shutdown inputs: 1SHDN (Pin 5) and 2SHDN (Pin 10). When either pin is pulled below 0.9 V (at VDD = 3 V) or 1.65 V (at VDD = 5 V), the corresponding amplifier channel disables, reducing its supply current to ≤15 µA and placing its output in high-impedance state. An external pullup resistor is required to ensure reliable enablement; floating shutdown pins may cause unintended disable due to leakage currents.
Can TLV4113IDGQ drive capacitive loads, and what is the recommended compensation method?
Yes, TLV4113IDGQ can drive capacitive loads up to 10 pF stably without compensation. For loads exceeding 1 nF, Texas Instruments recommends adding a series resistor (RNULL) between the output and the load - typically ≤20 Ω - to restore phase margin and prevent oscillation. This configuration is validated in the datasheet's Figure 27 and maintains stability while preserving bandwidth for applications like piezo driver interfaces and filter outputs.
What is the thermal pad on the TLV4113IDGQ package, and how must it be connected?
The TLV4113IDGQ's MSOP PowerPAD™ package includes an exposed copper thermal pad on the underside, electrically isolated from all pins. Per TI's SLMA002 application report, this pad must be soldered directly to a PCB copper area tied to the GND net - using five 13-mil vias - to achieve the rated θJA = 52.3°C/W. Failure to connect the pad degrades thermal performance by >3× and risks junction overheating during sustained high-current operation.
TLV4113IDGQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1.57V/µs
- Gain Bandwidth Product:
- 2.7 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 0.3 pA
- Voltage - Input Offset:
- 175 µV
- Current - Supply:
- 700µA (x2 Channels)
- Current - Output / Channel:
- 320 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 6 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-HVSSOP
TLV4113IDGQ FAQ
1.How can I place an order for TLV4113IDGQ through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV4113IDGQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV4113IDGQ reliable?
The price and inventory of TLV4113IDGQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV4113IDGQ is usually 5 days.
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TLV4113IDGQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV4113IDGQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV4113IDGQ?
For technical support, including TLV4113IDGQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV4113IDGQ requirements.
6.How does Aetrix verify that TLV4113IDGQ is sourced from the original manufacturer or authorized distributors?
All TLV4113IDGQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV4113IDGQ meets industry standards.
7.What is the process for return or replacement of TLV4113IDGQ?
All TLV4113IDGQ units undergo pre-shipment inspection (PSI). If there is an issue with TLV4113IDGQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV4113IDGQ part is unused and in its original packaging.
Return procedure for TLV4113IDGQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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