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Texas Instruments TLV62065DSGR

Part No.:
TLV62065DSGR
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
8-WFDFN Exposed Pad
Datasheet:
AetrixTLV62065DSGR.pdf
Description:
IC REG BUCK ADJ 2A 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,133

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Product details

Overview

TLV62065DSGR from Texas Instruments is a synchronous step-down DC–DC converter delivering up to 2 A at 1.8 V output from 2.9–5.5 V input, operating at 3 MHz fixed frequency with automatic PFM/PWM mode transition, 97% peak efficiency, and integrated high- and low-side MOSFETs - used in point-of-load regulation for portable media players and notebooks.

For engineers reviewing the TLV62065DSGR datasheet, TLV62065DSGR pinout, TLV62065DSGR application, or TLV62065DSGR equivalent, key selection criteria include its 2×2 mm WSON-8 package, 18 µA quiescent current in PFM mode, 100% duty cycle capability for low-dropout operation, internal 0.6 V reference, and output capacitor discharge function during shutdown.

Technical Context

The TLV62065DSGR implements a voltage-mode control architecture with input voltage feed-forward, enabling fast line/load transient response and stable operation with small ceramic capacitors. Its dual-MOSFET synchronous rectification eliminates external diode losses, while the integrated soft-start (250 µs ramp) and undervoltage lockout (1.78 V falling threshold) ensure controlled power-up and battery protection.

It supports dynamic mode selection via the MODE pin: low enables automatic PFM/PWM transition for light-load efficiency, high forces fixed 3 MHz PWM for EMI-sensitive applications. Thermal shutdown (150°C) and fold-back short-circuit protection (1/3 ILIMF under overload) provide robust system-level fault handling without external circuitry.

Key Specifications

ParameterValue and Actual Design Meaning
VIN Range2.9 V to 5.5 V - supports direct regulation from single-cell Li-ion (3.0–4.2 V) or 3.3/5 V system rails without pre-regulation.
IOUT Max2 A - sufficient for powering core logic, DDR memory I/O, or FPGA auxiliary rails in space-constrained portable designs.
fSW2.6–3.4 MHz (typ. 3 MHz) - enables use of ≤1.2 µH inductors and 0603-size 10–22 µF ceramic output capacitors, minimizing board area.
EfficiencyUp to 97% - achieved at mid-load with 1 µH inductor and 10 µF output cap, reducing thermal load in sealed enclosures.
IQ (PFM)18 µA - extends battery runtime in standby/sleep modes of handheld devices without compromising wake-up speed.
VREF0.6 V - sets feedback divider ratio for precise adjustable output (e.g., 1.8 V using 360 kΩ/180 kΩ resistors), minimizing resistor noise sensitivity.
RDS(on) HS95–150 mΩ (at 5 VIN) - limits conduction loss and self-heating at full load, supporting continuous 2 A output with <64.6 °C/W θJA.

Pinout & Package

TLV62065DSGR uses an 8-pin 2.0 mm × 2.0 mm × 0.75 mm WSON package with exposed thermal pad (soldered to PCB GND for optimal thermal performance). Pin numbering follows top-view standard with Pin 1 at bottom-left corner.

Pin/TerminalCircuit RoleDesign Meaning
PGND (1)Power ground for output stageCarries high pulsed inductor return current; must be low-inductance connection to thermal pad and input/output caps.
SW (2)Switch nodeConnects internally to both MOSFETs; external inductor ties here - critical for EMI control and layout loop minimization.
AGND (3)Analog groundReference for error amplifier and FB comparator; separate from PGND but tied at single point near AVIN decoupling.
FB (4)Feedback inputSenses output voltage via resistor divider; high-impedance node - keep trace short and away from noisy SW/PGND.
EN (5)Enable controlActive-high logic input; pulling low disables converter and activates internal SW-to-PGND discharge resistor (~200 Ω).
MODE (6)Operation mode selectLow = auto PFM/PWM; high = forced 3 MHz PWM - enables deterministic switching for noise filtering in audio/RF sections.
AVIN (7)Analog supplyPowers control circuitry; must connect to PVIN and local 10 µF ceramic cap - not interchangeable with PVIN routing.
PVIN (8)Power inputHigh-current VIN path for MOSFETs; requires low-ESR 10 µF input cap placed adjacent to PVIN/PGND pins.

Key Features

FeatureDesign Value
100% Duty Cycle OperationEnables dropout as low as VOUT + IOUT × (RDS(on) + RL) - extends usable battery range down to ~2.0 V for 1.8 V output.
Output Capacitor DischargeInternal ~200 Ω switch from SW to PGND during shutdown - prevents floating output and ensures monotonic startup from 0 V.
Voltage-Mode Control with Feed-ForwardEliminates need for external compensation; achieves stable regulation with 1 µH/10 µF LC filter and <500 µs start-up time.
Integrated Soft-StartRamps output from 5% to 95% of target in 250 µs - limits inrush current and avoids input rail collapse on weak sources like coin cells.
Fold-Back Short-Circuit ProtectionReduces switch current limit to 1/3 of nominal (≈900 mA) when VOUT drops below 1/3 VNOM - prevents thermal runaway during sustained overload.

Applications

Portable Media PlayersNotebook Subsystem Rails

Use Scenario: Powering ARM-based application processors and LPDDR memory interfaces in sub-10 mm-thick music/video players.

IC Role / Device Role / Timing Role: Primary POL regulator converting 3.7 V battery to 1.8 V core I/O supply with tight transient response and minimal footprint.

Use Value: 97% efficiency at 1.5 A and 3 MHz switching enable >10-hour playback on 800 mAh battery; 2×2 mm WSON fits beneath display bezel.

Use Scenario: Generating 1.8 V for USB 3.0 PHY, PCIe clock buffers, or eMMC controllers in ultrabook daughterboards.

IC Role / Device Role / Timing Role: Secondary buck converter downstream of main 5 V rail, providing clean, low-noise 1.8 V with forced PWM mode during data transfer bursts.

Use Value: MODE pin control allows EMI-sensitive periods to lock to 3 MHz, avoiding interference with 2.4 GHz Wi-Fi; 18 µA IQ cuts standby drain.

Point-of-Load for FPGA I/O BanksSet-Top Box SoC Auxiliary Supplies

Use Scenario: Delivering 1.8 V to Spartan-7 or Intel MAX 10 FPGA I/O banks requiring fast load-step response and low output impedance.

IC Role / Device Role / Timing Role: Local regulator placed adjacent to FPGA BGA, minimizing trace inductance and improving PSRR above 100 kHz.

Use Value: Voltage-mode control with feed-forward achieves <10 µs load transient recovery; 100% duty cycle maintains regulation during brownout events.

Use Scenario: Supplying 1.8 V to video decoder ASICs and HDMI transmitter logic in cost-sensitive consumer STBs with 5 V input bus.

IC Role / Device Role / Timing Role: High-efficiency buck replacing linear regulators to reduce heat in enclosed plastic enclosures without heatsinks.

Use Value: 97% efficiency reduces thermal dissipation by >1.2 W vs. LDO at 1.5 A; WSON thermal pad lowers junction temp by 25°C vs. SOIC-8.

Equivalent & Alternatives

The following parts are listed as comparable options for similar step-down converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS62067DSGRSame 3 MHz, 2 A, 2×2 mm WSON package; higher 0.8 V reference (vs. 0.6 V); 25 µA IQ in PFM mode.Requires different feedback resistor values; slightly lower light-load efficiency due to higher quiescent current.Preferred when tighter output voltage tolerance (±1%) or higher VREF-based noise immunity is required.
MP2143GJ-Z2.5–6 V input, 3 A output, 1.5 MHz fSW, 10-pin QFN; no MODE pin; 28 µA IQ.Larger package (3×3 mm); lower switching frequency demands larger inductor/capacitor; lacks output discharge.Chosen when higher output current headroom or extended input range (up to 6 V) is needed, accepting trade-offs in size and feature set.

Compared with TPS62067DSGR and MP2143GJ-Z, the TLV62065DSGR offers the lowest quiescent current (18 µA), smallest footprint (2×2 mm), and unique output discharge function - making it optimal for battery-powered devices where standby power and board area are critical constraints.

Availability

TLV62065DSGR is available at Aetrix Electronics and suitable for point-of-load regulation, portable media player power management, and notebook subsystem rails requiring stable component supply across production lifecycles.

Supply support for TLV62065DSGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-efficiency DC–DC conversion and automotive-grade reliability.

The TLV62065DSGR belongs to TI's TLV620xx family of ultra-small, high-frequency synchronous buck converters designed specifically for space-constrained portable electronics requiring high efficiency across wide load ranges.

FAQ

What is the recommended inductor value for TLV62065DSGR in a 1.8 V output design?

The TLV62065DSGR is optimized for a 1.0 µH inductor (e.g., Murata LQM32PN or Taiyo Yuden NRG4026T), supporting 2 A output with <300 mVpp ripple. Inductor DCR must be ≤80 mΩ and saturation current ≥2.8 A to handle peak currents during transients. Using 1.2 µH improves ripple but slightly reduces light-load efficiency in PFM mode.

Does TLV62065DSGR support adjustable output voltages, and how is it configured?

Yes, TLV62065DSGR supports adjustable outputs from 0.8 V to VIN using an external resistor divider on the FB pin. With its 0.6 V internal reference, a 1.8 V output requires R1 = 360 kΩ and R2 = 180 kΩ. An external feed-forward capacitor (22 pF) across R2 is mandatory for loop stability per TI SLVSAC4B Section 8.2.2.1.

How does the MODE pin affect TLV62065DSGR efficiency and noise performance?

When MODE = low, TLV62065DSGR enters automatic PFM/PWM mode - achieving 97% peak efficiency and 18 µA IQ at light loads but with variable switching frequency. When MODE = high, it locks to 3 MHz PWM, improving EMI filtering predictability at the cost of ~5% lower efficiency at 10 mA load due to fixed switching losses.

What thermal performance can be expected from TLV62065DSGR at 2 A continuous load?

With proper PCB layout (250 mm² 2-oz copper thermal pad connected to internal GND planes), TLV62065DSGR achieves θJA = 64.6 °C/W. At 2 A, 3.6 VIN, and 1.8 VOUT, power dissipation is ~240 mW, resulting in ~15.5°C junction rise above ambient - well within the 125°C max rating and eliminating need for airflow or heatsinks.

Is TLV62065DSGR compatible with ceramic output capacitors, and what type is recommended?

Yes, TLV62065DSGR is fully compatible with X5R and X7R ceramic capacitors. TI recommends 10–22 µF, 0603-size, 6.3 V rated parts (e.g., Murata GRM188R60J106M) due to their low ESR (<10 mΩ) and stable capacitance over temperature/voltage. Y5V/Z5U types are prohibited - their high DC-bias loss and rising ESR at 3 MHz cause instability and excessive ripple.

TLV62065DSGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
2.9V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
0.8V
Voltage - Output (Max):
5.5V
Current - Output:
2A
Frequency - Switching:
3MHz
Synchronous Rectifier:
Yes
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (2x2)

TLV62065DSGR FAQ

1.How can I place an order for TLV62065DSGR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV62065DSGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV62065DSGR reliable?

The price and inventory of TLV62065DSGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV62065DSGR is usually 5 days.

3.What payment methods are accepted for TLV62065DSGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV62065DSGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV62065DSGR?

TLV62065DSGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV62065DSGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV62065DSGR?

For technical support, including TLV62065DSGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV62065DSGR requirements.

6.How does Aetrix verify that TLV62065DSGR is sourced from the original manufacturer or authorized distributors?

All TLV62065DSGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV62065DSGR meets industry standards.

7.What is the process for return or replacement of TLV62065DSGR?

All TLV62065DSGR units undergo pre-shipment inspection (PSI). If there is an issue with TLV62065DSGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV62065DSGR part is unused and in its original packaging.

Return procedure for TLV62065DSGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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