Texas Instruments TLV70013DDCR

Overview

TLV70013DDCR from Texas Instruments is a 200-mA, low-quiescent-current, low-dropout linear regulator with fixed 1.3-V output, designed for power-sensitive portable applications. It delivers 2% output accuracy, 31-μA quiescent current, 43-mV dropout at 50 mA, and operates from 2-V to 5.5-V input across –40°C to +125°C junction temperature - used in Bluetooth headsets and Li-ion–powered wearables.

For engineers reviewing the TLV70013DDCR datasheet, TLV70013DDCR pinout, TLV70013DDCR application, or TLV70013DDCR equivalent, key selection considerations include dropout performance under light-to-moderate load, thermal shutdown behavior at 160°C, PSRR of 68 dB at 1 kHz, stability with ≥0.1-μF ceramic output capacitance, and enable-pin logic thresholds (0.9 V high / 0.4 V low).

Technical Context

The TLV70013DDCR uses a PMOS pass transistor architecture enabling ultra-low dropout voltage that scales with load current - 43 mV at 50 mA, 85 mV at 100 mA, and 175 mV at 200 mA for VOUT = 2.35 V. Its precision bandgap reference and error amplifier ensure ±2% DC accuracy over full temperature and line/load conditions.

Integrated protection includes thermal shutdown (trip at ~160°C, reset at ~140°C), current limiting (~220–860 mA), and undervoltage lockout (UVLO active below 1.9 V). The device enters shutdown mode drawing only 1 μA when EN < 0.4 V, and supports stable operation with effective output capacitance as low as 0.1 μF.

Key Specifications

Pinout & Package

TLV70013DDCR is packaged in a 5-pin SOT-23 (DDC) package measuring 2.90 mm × 1.60 mm, with exposed pad for thermal enhancement. Pin 1 = IN, Pin 2 = GND, Pin 3 = EN, Pin 4 = NC, Pin 5 = OUT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC70013DBVR and MCP1700T-1302E/TT, TLV70013DDCR provides the optimal balance of ultra-low IQ (31 μA), low dropout (43 mV), integrated EN and thermal protection, and 200-mA capability - making it the preferred choice for battery-powered portable systems requiring both efficiency and robustness.

Availability

TLV70013DDCR is available at Aetrix Electronics and suitable for wireless handsets, wearable sensor nodes, Zigbee® end devices, and Li-ion–powered PC add-on cards requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV70013DDCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs and precision analog solutions.

The TLV700 series was developed specifically for portable, battery-powered equipment - emphasizing low IQ, low dropout, small footprint, and robust protection to extend runtime and simplify system design.

FAQ

What is the minimum input voltage required for TLV70013DDCR to regulate 1.3 V output?

The TLV70013DDCR requires VIN ≥ VOUT + VDO. At 50 mA load, VDO = 43 mV, so minimum VIN = 1.343 V. However, per recommended operating conditions, VIN must be ≥2 V to ensure reliable startup, UVLO release, and full specification compliance across temperature and process variation.

Does TLV70013DDCR require an input capacitor for stability?

No, TLV70013DDCR does not require an input capacitor for stability, but TI recommends a 0.1–1 μF low-ESR ceramic capacitor from IN to GND to improve transient response, noise rejection, and ripple suppression - especially when source impedance exceeds 2 Ω or layout introduces inductance.

Can TLV70013DDCR operate with a 0.1-μF output capacitor?

Yes - TLV70013DDCR is stable with an effective output capacitance of ≥0.1 μF. This refers to the capacitance value *under operating bias voltage and temperature*, not the rated value. A 0.1-μF X5R/X7R ceramic typically meets this requirement, enabling compact, cost-effective designs.

What happens to TLV70013DDCR during thermal shutdown?

When junction temperature reaches ~160°C, TLV70013DDCR disables its output and draws only ~1 μA. Once the die cools to ~140°C, regulation resumes automatically. This cycling protects the device during sustained overload but indicates insufficient thermal design if triggered in normal operation.

Is the NC pin on TLV70013DDCR required to be grounded?

No - Pin 4 (NC) is internally unconnected. However, TI states it *may be tied to GND* to improve thermal dissipation in high-power-density layouts. Doing so does not affect regulation but enhances heat transfer from the die to the PCB ground plane.