Texas Instruments TLV70032DDCR

Overview

TLV70032DDCR from Texas Instruments is a 3.2-V fixed-output, 200-mA low-dropout linear regulator with 31-μA quiescent current, 2% output accuracy, and 43-mV dropout at 50 mA - designed for Li-ion-powered portable devices requiring stable low-noise biasing of RF and digital circuitry.

For engineers reviewing the TLV70032DDCR datasheet, TLV70032DDCR pinout, TLV70032DDCR application, or TLV70032DDCR equivalent, key selection considerations include dropout performance under light-to-moderate load, PSRR above 68 dB at 1 kHz, thermal shutdown at 160°C, stability with ≥0.1-μF ceramic output capacitance, and enable-controlled power sequencing in space-constrained handheld designs.

Technical Context

The TLV70032DDCR employs a PMOS pass transistor architecture enabling ultra-low dropout voltage scaling with load current, while maintaining regulation down to zero load. Its precision bandgap reference and error amplifier deliver ±2% DC accuracy across –40°C to +125°C junction temperature.

Functional modes include normal regulation (VIN > VOUT + VDO), dropout operation (VIN < VOUT + VDO, unregulated output), and current-limit protection (ICL = 220–860 mA), all coordinated with integrated undervoltage lockout (UVLO = 1.9 V) and thermal shutdown (trip = 160°C, reset = 140°C).

Key Specifications

Pinout & Package

TLV70032DDCR is packaged in a 5-pin SOT-23 (DDC) package measuring 2.90 mm × 1.60 mm, with exposed pad for enhanced thermal dissipation. Pin 1 = IN, Pin 2 = GND, Pin 3 = EN, Pin 4 = NC, Pin 5 = OUT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC70032DBVR and MCP1703T-3202E/MB, TLV70032DDCR delivers the optimal balance of ultra-low dropout (43 mV), moderate IQ (31 μA), and proven stability with minimal 0.1-μF output capacitance - making it the preferred choice for modern Li-ion portable systems where runtime, size, and noise sensitivity are co-optimized.

Availability

TLV70032DDCR is available at Aetrix Electronics and suitable for wireless handsets, Bluetooth® audio modules, and ZigBee® sensor nodes requiring stable component supply with guaranteed long-term manufacturability and traceable sourcing.

Supply support for TLV70032DDCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and consumer markets.

The TLV700 series was developed specifically for portable battery-powered equipment - emphasizing ultra-low quiescent current, high PSRR, and minimal external component count to extend runtime and simplify layout in space-constrained handheld devices.

FAQ

What is the minimum input voltage required for TLV70032DDCR to regulate 3.2 V output?

The TLV70032DDCR requires VIN ≥ VOUT + VDO. With a typical dropout of 43 mV at 50 mA, the minimum functional input is 3.243 V. Under worst-case conditions (2% accuracy + 175 mV dropout at 200 mA), VIN must exceed 3.375 V to maintain regulation across temperature and load. Below this, the device enters dropout mode with unregulated output.

Does TLV70032DDCR require an input capacitor for stability?

No, TLV70032DDCR does not require an input capacitor for stability, but TI recommends a 0.1–1 μF low-ESR ceramic capacitor from IN to GND. This improves transient response, reduces input ripple coupling, and mitigates voltage excursions caused by source impedance or fast load steps - especially critical when the device is remote from its power source or shares a rail with high-di/dt circuits.

Can TLV70032DDCR operate with a 0.1-μF output capacitor?

Yes, TLV70032DDCR is explicitly characterized and guaranteed stable with an effective output capacitance of ≥0.1 μF - defined as the capacitance value under actual operating bias voltage and temperature. This enables use of small-footprint X5R/X7R ceramics with known derating curves, reducing PCB area and BOM cost versus legacy LDOs requiring ≥2.2 μF.

What happens to TLV70032DDCR during thermal overload?

When junction temperature reaches ~160°C, TLV70032DDCR activates thermal shutdown, disabling the output and reducing ground current to ~1–2 μA. Once the die cools to ~140°C, regulation resumes automatically. This hysteresis protects against permanent damage but indicates excessive power dissipation - designers should verify layout, ambient temperature, and load conditions to keep TJ ≤125°C for reliable operation.

Is TLV70032DDCR pin-compatible with other TLV700xx variants in the same package?

Yes, all TLV700xx devices in the DDC (SOT-23-5) package share identical pinout: Pin 1 = IN, Pin 2 = GND, Pin 3 = EN, Pin 4 = NC, Pin 5 = OUT. This allows direct substitution between fixed-output versions (e.g., TLV70012DDCR, TLV70018DDCR, TLV70033DDCR) without PCB changes - provided input voltage, load current, and thermal constraints remain within specification for the selected variant.