Texas Instruments TLV70213DBVR

Overview

TLV70213DBVR from Texas Instruments is a 1.3-V fixed-output, 300-mA low-dropout (LDO) linear regulator in SOT-23-5 package, featuring 2% output accuracy, 35 μA quiescent current, 260 mV dropout at 300 mA, 68 dB PSRR at 1 kHz, and stable operation with ≥0.1 μF ceramic output capacitance. It serves as a primary power rail regulator in space-constrained, battery-powered RF subsystems.

For engineers reviewing the TLV70213DBVR datasheet, TLV70213DBVR pinout, TLV70213DBVR application, or TLV70213DBVR equivalent, this page delivers verified electrical parameters, thermal behavior, enable-controlled shutdown sequencing, and design-critical capacitor stability guidance for portable wireless systems.

Technical Context

The TLV70213DBVR uses a PMOS pass transistor to achieve low dropout and maintains regulation down to 260 mV headroom at full 300 mA load. Its precision bandgap reference and error amplifier deliver ±2% DC accuracy across –40°C to +125°C junction temperature.

It integrates active high-enable logic (VEN(high) = 0.9 V), thermal shutdown (165°C trip), current limiting (320–860 mA), undervoltage lockout (1.9 V), and ground current as low as 35 μA at zero load - all within a 2.90 mm × 1.60 mm SOT-23-5 footprint.

Key Specifications

Pinout & Package

SOT-23-5 package (2.90 mm × 1.60 mm body size) with exposed pad not present; rated for –40°C to +125°C operating junction temperature.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS81010BQV50 and MCP1700T-1302E/TT, TLV70213DBVR balances low IQ (35 μA), robust protection (thermal/UVLO/current limit), and enable control in a standard SOT-23-5 - making it optimal for cost-sensitive, non-automotive portable electronics where reliability and design flexibility matter.

Availability

TLV70213DBVR is available at Aetrix Electronics and suitable for wireless sensor nodes, BLE/Wi-Fi MCU power rails, wearable health monitors, and Zigbee® end devices requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV70213DBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in power management ICs and broad distribution through authorized channels.

The TLV70213DBVR belongs to TI's TLV702xx family of low-IQ LDOs designed specifically for battery-powered handheld equipment - emphasizing minimal quiescent current, fast transient response, and capacitor flexibility in compact footprints.

FAQ

What is the minimum input voltage required for TLV70213DBVR to regulate 1.3 V output at 300 mA?

The TLV70213DBVR requires VIN ≥ VOUT + VDO = 1.3 V + 0.26 V = 1.56 V to maintain regulation at 300 mA load. Per datasheet Section 6.5, dropout voltage is 260 mV typical at IOUT = 300 mA and TJ = 25°C. Below this input voltage, the device enters dropout mode and output tracks VIN minus VDO.

Can TLV70213DBVR operate with a 0.1 μF output capacitor, and what dielectric type is recommended?

Yes, TLV70213DBVR is stable with an effective output capacitance of ≥0.1 μF, including X5R and X7R ceramic types. The datasheet explicitly states stability with "effective capacitance" - meaning capacitance after bias and temperature derating - not just nominal rated value. Avoid Z5U or Y5V due to excessive derating.

Does TLV70213DBVR include thermal shutdown, and at what junction temperature does it activate?

Yes, TLV70213DBVR includes thermal shutdown that activates at TJ = 165°C (typical) and resets at TJ = 145°C (typical). This protection is integrated per Section 6.5 Electrical Characteristics and prevents permanent damage during sustained overload or poor PCB thermal design.

What is the enable pin behavior of TLV70213DBVR, and can it be left unconnected?

The EN pin is active-high with VEN(high) = 0.9 V (min) and VEN(low) = 0.4 V (max). Leaving EN floating is not recommended; it must be pulled to IN (for always-on) or driven by a GPIO. Internal pull-down is absent, so undefined logic states may cause erratic startup or shutdown behavior.

How does TLV70213DBVR compare to the TLV70213DBVT in terms of packaging and thermal performance?

TLV70213DBVR uses SOT-23-5 (DBV) package with RθJA = 249.2°C/W; TLV70213DBVT uses same DBV package but is tape-and-reel packaged for automated assembly - no difference in thermal metrics or electrical specs. Both share identical pinout, ratings, and performance curves per TI's orderable addendum.