Texas Instruments TLV705165YFPR

Overview

TLV705165YFPR from Texas Instruments is a 1.65-V fixed-output, 200-mA low-dropout (LDO) linear regulator in a 0.77-mm × 0.77-mm DSBGA package. It delivers 0.5% output accuracy, 35-μA quiescent current, and 145-mV dropout at 200 mA, enabling stable power for RF-sensitive circuits in space-constrained portable devices.

For engineers reviewing the TLV705165YFPR datasheet, TLV705165YFPR pinout, TLV705165YFPR application, or TLV705165YFPR equivalent, key selection criteria include ultra-low profile packaging, sub-1-μF ceramic capacitor stability, high PSRR (70 dB @ 1 kHz), and enable-controlled shutdown with 1-μA quiescent draw.

Technical Context

The TLV705165YFPR uses a PMOS pass transistor architecture to achieve low dropout and maintain regulation down to 2 V input. Its internal bandgap reference and error amplifier deliver ±0.5% DC accuracy across –40°C to +125°C and full load range (0–200 mA).

It features active enable control with 0.9-V turn-on threshold and 0.4-V turn-off threshold, thermal shutdown at 160°C, and overcurrent protection with 400-mA typical current limit. Stability is guaranteed with ≥0.1-μF effective ceramic output capacitance.

Key Specifications

Pinout & Package

TLV705165YFPR is housed in a 4-pin, 0.77-mm × 0.77-mm, 0.15-mm max height DSBGA (YFP) package optimized for ultra-thin mobile designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC705165YFPR and MCP1703T-16502E/MB, TLV705165YFPR uniquely balances 200-mA capability, 35-μA IQ, 145-mV dropout, and 0.77-mm DSBGA size-making it the sole option meeting all four constraints simultaneously in compact RF systems.

Availability

TLV705165YFPR is available at Aetrix Electronics and suitable for wireless sensor nodes, Bluetooth audio earbuds, wearable health monitors, and smartphone camera modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV705165YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-reliability, low-power, and miniaturized ICs.

The TLV705 series was designed specifically for battery-powered handheld and IoT edge devices demanding ultra-low IQ, small footprint, and RF-clean power delivery-targeting smartphones, wearables, and wireless sensor networks.

FAQ

What is the minimum input voltage required for TLV705165YFPR to regulate at 1.65 V?

The TLV705165YFPR requires VIN ≥ VOUT + VDO. With a maximum dropout of 145 mV at 200 mA, the minimum input is 1.65 V + 0.145 V = 1.795 V. However, the recommended operating condition specifies a minimum VIN of 2 V to ensure reliable startup, UVLO margin, and full-load regulation across temperature. TLV705165YFPR meets its 0.5% accuracy spec only above 2 V input.

Can TLV705165YFPR operate with a 0.22-μF ceramic output capacitor?

Yes. TLV705165YFPR is stable with an effective output capacitance as low as 0.1 μF, so a 0.22-μF X7R ceramic capacitor fully satisfies the stability requirement. TI recommends using 1-μF for optimal transient response, but 0.22 μF is valid for space-constrained designs where load transients are mild. TLV705165YFPR does not require ESR damping, unlike older LDO architectures.

Does TLV705165YFPR include reverse-voltage protection?

No. TLV705165YFPR contains a body diode between VOUT and VIN that conducts uncontrolled current if VOUT exceeds VIN. This can discharge backup batteries or damage upstream sources. For reverse-voltage scenarios, TI recommends adding an external Schottky diode in series with VIN or a dedicated reverse-protection MOSFET. TLV705165YFPR relies on proper system-level design to avoid reverse bias conditions.

What is the thermal performance of TLV705165YFPR in its YFP package?

In the 4-pin DSBGA (YFP) package, TLV705165YFPR has a junction-to-ambient thermal resistance (RθJA) of 160°C/W. At 200 mA output and 3.3-V input, power dissipation is (3.3 − 1.65) × 0.2 = 0.33 W, resulting in ~53°C junction rise above ambient. With 25°C ambient, TJ ≈ 78°C - well below the 125°C max operating limit. Layout with thermal vias under the exposed pad further improves performance. TLV705165YFPR includes thermal shutdown at 160°C for fault protection.

Is TLV705165YFPR pin-compatible with other TLV705 fixed-voltage variants?

Yes. All TLV705 fixed-output variants in the YFP (DSBGA) and YFM (PicoStar) packages share identical 4-pin topologies: VIN (B2), GND (A1), EN (A2), VOUT (B1). Pinout, footprint, and solder mask are identical across the family - allowing one PCB layout to support multiple output voltages (0.7 V to 4.8 V) via BOM change only. TLV705165YFPR is fully interchangeable at the board level with TLV70518YFPR, TLV70525YFPR, etc., provided input/output capacitor values meet each variant's stability requirements.