Texas Instruments TLV705185YFPR

Overview

TLV705185YFPR from Texas Instruments is a 1.85-V fixed-output, 200-mA low-dropout (LDO) linear regulator in a 0.77-mm × 0.77-mm DSBGA package. It delivers 0.5% output accuracy, 145-mV dropout at 200 mA, 35-μA quiescent current, and 70-dB PSRR at 1 kHz-designed for powering RF-sensitive blocks in compact battery-powered devices such as Bluetooth transceivers.

For engineers reviewing the TLV705185YFPR datasheet, TLV705185YFPR pinout, TLV705185YFPR application, or TLV705185YFPR equivalent, key selection criteria include ultra-low profile packaging (0.15-mm max height), stability with only 0.1-μF ceramic output capacitance, enable-controlled shutdown with 1-μA quiescent current in disable mode, and thermal/overcurrent protection for robust operation in space-constrained portable systems.

Technical Context

The TLV705185YFPR employs a PMOS pass transistor architecture enabling low dropout voltage that scales with load current-145 mV at 200 mA-and maintains regulation down to 2 V input. Its error amplifier achieves ±0.5% DC accuracy across –40°C to +125°C and zero-load conditions.

It integrates undervoltage lockout (1.9 V rising threshold), active-high enable logic (0.9 V turn-on, 0.4 V turn-off), and internal thermal shutdown (160°C trip, 140°C reset). The device operates stably with 0.1 μF effective output capacitance, supporting high-bias-voltage ceramic capacitors without requiring ESR tuning.

Key Specifications

Pinout & Package

TLV705185YFPR uses a 4-pin, 0.77-mm × 0.77-mm DSBGA (YFF/YFP) package with 0.15-mm maximum height-optimized for ultra-thin mobile and wearable PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS850F2BHTSA1 and AP7361D-18SAG-7, TLV705185YFPR uniquely balances ultra-miniaturization (0.77-mm footprint), precision 1.85-V output, and RF-grade noise/PSRR-making it optimal for space-constrained, battery-powered wireless endpoints where every micron and microamp matters.

Availability

TLV705185YFPR is available at Aetrix Electronics and suitable for Bluetooth audio earbuds, Zigbee sensor nodes, WLAN PCIe add-in cards, and industrial handheld scanners requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV705185YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of LDO design heritage and broad automotive, industrial, and personal electronics reach.

The TLV705 series was engineered specifically for ultra-low-power, RF-sensitive portable applications-emphasizing miniature packaging, low noise, high PSRR at minimal headroom, and robust protection features for battery-operated edge devices.

FAQ

What is the exact output voltage tolerance of TLV705185YFPR across temperature and load?

The TLV705185YFPR guarantees ±0.5% DC output accuracy over –40°C to +125°C junction temperature and 0–200 mA load range for VOUT ≥ 1 V. At 25°C and 10 mA load, typical deviation is ±0.1%; worst-case drift remains within ±0.5% due to precision bandgap and error amplifier design-verified per Electrical Characteristics Table 6.5 in the SBVS151F datasheet.

Can TLV705185YFPR operate with a 0.1-μF ceramic output capacitor, and why is this significant?

Yes, TLV705185YFPR is stable with a minimum effective output capacitance of 0.1 μF ceramic-confirmed in Section 6.5 and Figure 15 of the SBVS151F datasheet. This enables use of small, low-cost, high-bias-voltage MLCCs (e.g., 0402/0603 X5R/X7R) without ESR requirements, reducing PCB area and BOM cost versus legacy LDOs needing ≥2.2 μF tantalum.

Does TLV705185YFPR include thermal protection, and how does it behave during fault conditions?

Yes, TLV705185YFPR incorporates thermal shutdown with a 160°C trip point and 140°C hysteresis-based reset. During sustained overload, it cycles between current limit (400 mA typical) and thermal shutdown-dissipating heat until junction temperature falls below 140°C, then automatically resuming regulation. This behavior is documented in Sections 7.3.1 and 6.5 of SBVS151F.

What is the enable pin behavior of TLV705185YFPR, and can it be tied directly to VIN?

TLV705185YFPR has an active-high EN pin with V_HI = 0.9 V (min) and V_LO = 0.4 V (max). When unused, EN may be permanently tied to VIN (2–5.5 V) to ensure always-on operation. In shutdown, ground pin current drops to 1 μA (typical), minimizing system standby power-details are in Pin Functions (Section 5) and Electrical Characteristics (Section 6.5).

How does TLV705185YFPR compare to the TLV705P variant, and is TLV705185YFPR part of the P-series?

No-TLV705185YFPR belongs to the standard TLV705 series, not the TLV705P family. The "P" suffix denotes inclusion of an active pulldown circuit for rapid VOUT discharge during disable; TLV705185YFPR lacks this feature. Both share identical electrical specs (dropout, accuracy, PSRR, noise), but TLV705P adds pulldown resistance (~120 Ω) per Section 7.3.5 and Figure 27 of SBVS151F.