Texas Instruments TLV705285YFPR

Overview

TLV705285YFPR from Texas Instruments is a 2.85 V fixed-output, 200-mA low-dropout (LDO) linear regulator in a 0.77-mm × 0.77-mm DSBGA package. It delivers 0.5% output accuracy, 145 mV dropout at 200 mA, 35 μA quiescent current, and 70 dB PSRR at 1 kHz - optimized for Li-ion–powered wireless handsets and Bluetooth devices.

For engineers reviewing the TLV705285YFPR datasheet, TLV705285YFPR pinout, TLV705285YFPR application, or TLV705285YFPR equivalent, key selection criteria include ultra-low profile packaging (0.15-mm max height), stability with only 0.1 μF ceramic output capacitance, enable-controlled shutdown with 1 μA quiescent current in disable mode, and thermal/overcurrent protection for robust portable power management.

Technical Context

The TLV705285YFPR uses a PMOS pass transistor to achieve low dropout and maintain regulation down to (VIN – VOUT) = 145 mV at full load. Its error amplifier enables 0.5% typical DC accuracy across –40°C to +125°C and supports zero-load regulation.

It features an active-high enable pin (EN) with 0.9 V turn-on threshold and 0.4 V turn-off threshold, allowing direct interfacing with low-voltage GPIOs. The device remains stable with ≥0.1 μF effective ceramic output capacitance and includes undervoltage lockout (UVLO) at 1.9 V and thermal shutdown at 160°C.

Key Specifications

Pinout & Package

TLV705285YFPR is housed in a 4-pin, 0.77-mm × 0.77-mm DSBGA (YFF/YFP) package with 0.15-mm maximum height - optimized for space-constrained mobile PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC705285YFPR and TPS7A05285YFPR, TLV705285YFPR offers the optimal balance of ultra-compact size, low dropout, and industry-leading 35 μA quiescent current - making it the preferred choice for next-generation wearable and IoT edge devices where space, efficiency, and thermal envelope are co-constrained.

Availability

TLV705285YFPR is available at Aetrix Electronics and suitable for wireless handsets, Bluetooth audio modules, and Zigbee sensor nodes requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for TLV705285YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management IC design and high-volume manufacturing reliability.

The TLV705 series was engineered specifically for space- and power-constrained portable electronics - delivering ultra-low IQ, low noise, and miniature packaging without sacrificing protection features or thermal robustness.

FAQ

What is the minimum input voltage required for TLV705285YFPR to regulate at full 200 mA load?

The TLV705285YFPR requires VIN ≥ VOUT + VDO = 2.85 V + 0.145 V = 2.995 V to maintain regulation at 200 mA. Below this, it enters dropout mode with reduced PSRR and transient response. The device remains functional down to VIN = 2 V, but output voltage drops linearly with input below the dropout threshold.

Can TLV705285YFPR operate with a 0.1 μF ceramic output capacitor, and what are the implications?

Yes, TLV705285YFPR is explicitly characterized and guaranteed stable with ≥0.1 μF effective ceramic output capacitance. This enables use of small 0201/0402 MLCCs with high bias derating - reducing PCB area and cost versus traditional 1-μF solutions, while maintaining phase margin >45° across temperature and load.

How does the enable pin (EN) of TLV705285YFPR behave during power-up and shutdown sequences?

The EN pin of TLV705285YFPR asserts regulation when voltage exceeds 0.9 V (typical) and disables output when pulled below 0.4 V (typical). In shutdown, ground current drops to 1 μA (typical), and VOUT discharges through internal leakage paths. No active pulldown is present - that feature belongs to the TLV705P variant, not TLV705285YFPR.

What thermal protection mechanisms are integrated into TLV705285YFPR?

TLV705285YFPR includes thermal shutdown at 160°C (trip) with 20°C hysteresis (reset at 140°C), plus foldback current limiting (260–550 mA typical). During sustained overload, it cycles between current limit and thermal shutdown to prevent permanent damage - no external thermal monitoring or current sense resistors are needed.

Is TLV705285YFPR compatible with standard PCB assembly processes including reflow and cleaning?

Yes, TLV705285YFPR's YFF/YFP DSBGA package is qualified for standard lead-free reflow profiles (J-STD-020) and withstands aqueous and solvent-based cleaning processes. Its 0.15-mm max height and solder-ball pitch ensure reliable attachment on fine-pitch mobile PCBs without tombstoning or voiding concerns.