Texas Instruments TLV70717DQNR

Overview

TLV70717DQNR from Texas Instruments is a 200-mA, low-quiescent-current (25 µA), low-noise LDO regulator with 1.7 V fixed output voltage, 0.5% DC accuracy, and 70 dB PSRR at 100 Hz - designed for power-sensitive portable electronics including smartphone baseband processors and wearable sensor rails.

For engineers reviewing the TLV70717DQNR datasheet, TLV70717DQNR pinout, TLV70717DQNR application, or TLV70717DQNR equivalent, key selection criteria include dropout voltage (≤325 mV at 150 mA), stability with 0.1 µF output capacitance, thermal/overcurrent protection, and compatibility with low-voltage GPIO enable signals (VIH = 0.9 V).

Technical Context

The TLV70717DQNR employs a PMOS pass transistor architecture enabling ultra-low dropout and reverse-voltage tolerance via its intrinsic body diode. Its internal bandgap reference and error amplifier deliver 0.5% output accuracy across –40°C to +125°C junction temperature.

It features active-high enable logic with 0.9 V VIH threshold, 1 µA shutdown current, and - unlike the TLV707P variant - no internal pulldown circuit. Transient response is optimized for fast load steps (e.g., 1 mA → 150 mA) with <50 mV undershoot and rapid recovery.

Key Specifications

Pinout & Package

TLV70717DQNR is housed in a 1.0 mm × 1.0 mm DQN (X2SON-4) package with wettable flank leads for automated optical inspection. Thermal pad on underside enhances power dissipation in space-constrained layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPL720F17 and MCP1700T-1702E/MB, TLV70717DQNR uniquely combines 0.1 µF stability, 70 dB PSRR, and 0.9 V VIH enable in a 1-mm² package - making it optimal for miniaturized, battery-powered RF systems demanding both ultra-low IQ and high noise immunity.

Availability

TLV70717DQNR is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hubs, and wireless gaming peripherals requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for TLV70717DQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs for portable and industrial applications.

The TLV707 series was engineered specifically for battery-powered RF and portable devices - prioritizing ultra-low quiescent current, minimal footprint, and robust transient performance under dynamic load conditions.

FAQ

What is the minimum input voltage required for TLV70717DQNR to regulate 1.7 V output at 150 mA?

The TLV70717DQNR requires a minimum input voltage of 2.025 V to maintain regulation at 150 mA, based on its maximum dropout voltage of 325 mV (1.7 V + 0.325 V). This allows operation from partially discharged single-cell Li-ion batteries down to ~2.0 V while sustaining full load capability - a key advantage for portable designs.

Does TLV70717DQNR include an internal pulldown resistor on the OUT pin during shutdown?

No, TLV70717DQNR does not include an internal pulldown resistor. That feature is exclusive to the TLV707P variant (e.g., TLV70717PDQNR). When TLV70717DQNR enters shutdown (EN < 0.4 V), the output floats - external pulldown may be needed if rapid discharge is required for system-level sequencing or safety compliance.

Can TLV70717DQNR operate stably with a 0.1 µF X5R ceramic capacitor rated at 6.3 V?

Yes, TLV70717DQNR is explicitly characterized for stability with ≥0.1 µF effective output capacitance. A 0.1 µF, 6.3 V X5R capacitor maintains sufficient effective capacitance (>0.1 µF) at 1.7 V bias and room temperature, satisfying the stability requirement while enabling ultra-compact 0201 footprints - confirmed in TI's SBVS153G datasheet Section 6.5 and 8.2.2.1.

What is the thermal resistance (RθJA) of TLV70717DQNR in its DQN package?

The junction-to-ambient thermal resistance (RθJA) for TLV70717DQNR in the 1-mm × 1-mm DQN (X2SON-4) package is 208.1°C/W, as specified in the Thermal Information table (Section 6.4) of the official datasheet. This value assumes standard JEDEC 2-layer board layout; actual performance improves with thermal pad soldering to inner ground planes.

Is TLV70717DQNR pin-compatible with other variants in the TLV707 family, such as TLV70733DQNR?

Yes, all TLV707x DQNR variants - including TLV70717DQNR and TLV70733DQNR - share identical DQN (X2SON-4) pinout and package dimensions (1.0 mm × 1.0 mm). Pin functions (IN, GND, OUT, EN) are fully consistent across the family, enabling drop-in voltage option changes without PCB revision - provided input voltage headroom and load requirements remain compatible.