Texas Instruments TLV71211DSER
- Part No.:
- TLV71211DSER
- Manufacturer:
- Texas Instruments
- Package:
- 6-WFDFN
- Datasheet:
-
TLV71211DSER.pdf
- Description:
- IC REG LINEAR 1.1V 300MA 6WSON
- Quantity:
- Payment:

- Shipping:

Inventory:2,819
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Product details
Overview
TLV71211DSER from Texas Instruments is a 300-mA, sub-bandgap low-dropout linear regulator (LDO) with fixed 1.1 V output voltage, 2% DC accuracy, 35 µA quiescent current, and stability with ≥0.1 µF ceramic output capacitance. It delivers high PSRR (68 dB at 1 kHz) and operates across –40°C to +125°C for powering ultra-low-voltage processor cores in battery-constrained wireless handsets.
For engineers reviewing the TLV71211DSER datasheet, TLV71211DSER pinout, TLV71211DSER application, or TLV71211DSER equivalent, key selection criteria include its 1.1 V fixed output, SON-6 package thermal performance (RθJA = 180°C/W), active-high enable threshold (0.9 V), and guaranteed operation down to 2.0 V input - critical for Li-ion–powered portable RF systems.
Technical Context
The TLV71211DSER uses a PMOS pass transistor to achieve sub-bandgap regulation at 1.1 V while maintaining low dropout under load. Its precision bandgap reference and error amplifier deliver ±2% output accuracy over temperature and line/load variation.
It integrates thermal shutdown (+165°C trip, +145°C reset) and current limiting (320–860 mA), and features undervoltage lockout (UVLO) that holds output disabled until VIN exceeds 1.9 V. The device is stable with effective output capacitance as low as 0.1 µF, enabling use of small-footprint, bias-voltage–derated ceramics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.1 V ±2% (±22 mV) - ensures reliable core supply for sub-1.2 V processors without external feedback. |
| Quiescent Current | 35 µA typical - enables multi-week standby in always-on Bluetooth/ZigBee nodes. |
| PSRR | 68 dB at 1 kHz - suppresses switching noise from adjacent DC/DC converters in compact PCB layouts. |
| Input Voltage Range | 2.0 V to 5.5 V - supports single-cell Li-ion (2.7–4.2 V) and regulated 3.3 V rails with margin. |
| Output Capacitance | Stable with ≥0.1 µF ceramic - allows use of 0402/0603 X5R/X7R caps, reducing board area and BOM cost. |
| Enable Threshold | VEN(HI) = 0.9 V - compatible with low-voltage GPIOs (e.g., 1.2 V I/O domains) without level-shifting. |
| Thermal Shutdown | +165°C trip / +145°C reset - protects against sustained overload in sealed enclosures without external thermal monitoring. |
Pinout & Package
TLV71211DSER is housed in a 1.5-mm × 1.5-mm, 6-pin WSON (SON-6) package with exposed thermal pad. This leadless, surface-mount package provides low thermal resistance (RθJA = 180°C/W) and supports automated assembly on dense PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - EN | Enable control input | Active-high logic input; >0.9 V enables regulation, <0.4 V disables with 1 mA shutdown current. |
| 2 - NC | No connection | Internally unconnected; may be tied to GND to improve thermal dissipation via PCB copper. |
| 3 - NC | No connection | Internally unconnected; same thermal role as Pin 2 - optional GND tie for heatsinking. |
| 4 - IN | Input power supply | Accepts 2.0–5.5 V; requires local 0.1–1.0 µF ceramic decoupling to GND for transient stability. |
| 5 - GND | Ground reference | Common return for input/output paths and internal circuitry; must connect directly to low-impedance ground plane. |
| 6 - OUT | Regulated output | Delivers 1.1 V ±2% at up to 300 mA; requires ≥0.1 µF ceramic capacitor to GND for loop stability. |
Key Features
| Feature | Design Value |
|---|---|
| Sub-bandgap output voltage | 1.1 V fixed - powers next-gen SoCs and RF transceivers requiring voltages below 1.2 V without external resistive dividers. |
| Ultra-low quiescent current | 35 µA - extends battery life in always-on sensor nodes and wearable devices with intermittent wake cycles. |
| High PSRR at 1 kHz | 68 dB - maintains clean supply rail when co-located with noisy switching regulators or digital ICs. |
| Minimal output capacitance requirement | 0.1 µF ceramic - eliminates need for large tantalum or aluminum electrolytics, saving space and cost. |
| Integrated protection | Thermal shutdown + current limit - prevents damage during short-circuit or overtemperature events without external components. |
Applications
| Wireless Handsets | Smartphones & PDAs |
|---|---|
Use Scenario: Powering baseband processor I/O or memory interface rails in dual-SIM LTE handsets with tight thermal envelopes. IC Role / Device Role / Timing Role: Primary LDO supplying 1.1 V to DDR I/O buffers with fast load transient response. Use Value: 35 µA IQ minimizes idle drain; 68 dB PSRR isolates memory bus from RF front-end switching noise. |
Use Scenario: Regulating camera sensor analog supply in smartphones where space limits capacitor size. IC Role / Device Role / Timing Role: Low-noise, fixed-output LDO delivering 1.1 V to CIS analog blocks. Use Value: Stability with 0.1 µF ceramic enables 0402 footprint, reducing PCB area by >50% vs. traditional 10 µF solutions. |
| ZigBee® Networks | Bluetooth® Devices |
Use Scenario: Supplying 1.1 V to ZigBee SoC radio cores in battery-powered smart home sensors (e.g., door/window, motion). IC Role / Device Role / Timing Role: Always-on LDO maintaining regulated rail during deep-sleep and burst-transmit cycles. Use Value: 2% accuracy ensures consistent RF output power across temperature; 35 µA IQ enables >2-year coin-cell operation. |
Use Scenario: Powering Bluetooth LE audio SoC subsystems (e.g., codec, DSP) in true wireless stereo earbuds. IC Role / Device Role / Timing Role: Secondary LDO generating clean 1.1 V for low-power audio processing blocks. Use Value: 1.5-mm × 1.5-mm SON-6 package fits within 3.5 mm earbud stem; 0.1 µF stability simplifies layout in constrained volume. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-IQ, sub-1.2 V LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPL71211DRVR | Same 1.1 V output, 35 µA IQ, but SOT-23-5 package (RθJA = 200°C/W); no NC pins. | Larger footprint and higher thermal resistance - suitable only where board space permits and power dissipation <200 mW. | Select if legacy SOT-23 placement is required; avoid for >200 mW continuous loads due to thermal derating. |
| TPS7A0211PDQNR | 1.1 V, 25 µA IQ, 2% accuracy, but requires ≥0.22 µF output cap and has VEN(HI) = 1.2 V. | Higher enable threshold limits compatibility with 1.2 V GPIOs; tighter cap requirement increases minimum BOM cost. | Choose only if lower IQ justifies added capacitor cost and GPIO voltage headroom exists; not drop-in for TLV71211DSER. |
Compared with TPL71211DRVR and TPS7A0211PDQNR, TLV71211DSER offers superior thermal performance in space-constrained designs, guaranteed stability with 0.1 µF ceramics, and direct compatibility with sub-1.2 V enable signals - making it optimal for miniaturized, thermally sensitive RF modules.
Availability
TLV71211DSER is available at Aetrix Electronics and suitable for wireless handsets, Bluetooth® devices, ZigBee® networks, and Li-ion–operated handheld products requiring stable component supply with full lifecycle support.
Supply support for TLV71211DSER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of LDO design expertise and broad automotive, industrial, and consumer qualification.
The TLV712xx series was developed specifically for ultra-low-voltage, battery-sensitive applications - delivering sub-bandgap regulation, microamp quiescent current, and minimal external component count for portable RF and IoT endpoints.
FAQ
What is the output voltage tolerance of TLV71211DSER over temperature and load?
The TLV71211DSER guarantees ±2% DC output accuracy (±22 mV at 1.1 V) across –40°C to +125°C junction temperature, 2.0 V to 5.5 V input, and 0–300 mA load. This is achieved via an integrated precision bandgap reference and error amplifier, ensuring stable core voltage for sub-1.2 V processors regardless of ambient or operating conditions. TLV71211DSER maintains this accuracy without external trimming or feedback components.
Does TLV71211DSER require an input capacitor for stability?
An input capacitor is not required for TLV71211DSER stability, but Texas Instruments recommends a 0.1–1.0 µF low-ESR ceramic capacitor between IN and GND to improve transient response, noise rejection, and ripple suppression - especially when the device is located far from the power source or driven by a high-impedance supply. TLV71211DSER itself remains stable without it, unlike many older LDO architectures.
Can TLV71211DSER operate with a 1.8 V input supply?
No - TLV71211DSER has an absolute minimum input voltage of 2.0 V, enforced by its undervoltage lockout (UVLO) circuit which disables regulation until VIN rises above 1.9 V. At 1.8 V input, the device remains in shutdown with no output. For 1.8 V input compatibility, consider the TLV70211 (1.2 V+ family) or evaluate if system-level rail sequencing can ensure VIN ≥2.0 V before TLV71211DSER enable assertion.
What is the maximum continuous output current for TLV71211DSER at +85°C ambient?
At +85°C ambient temperature and using the recommended PCB layout (2-layer, 2 oz copper), TLV71211DSER in SON-6 package supports up to 222 mW power dissipation. With a 1.1 V output and 3.3 V typical input, this translates to ~100 mA continuous load. Derating is necessary above +85°C; full 300 mA is rated only at TA < +25°C per TI's EVM test data. TLV71211DSER thermal shutdown activates at +165°C junction temperature.
Is TLV71211DSER pin-compatible with other members of the TLV712xx family?
Yes - all TLV712xx devices in the SON-6 (DSE) package share identical pinout: EN, NC, NC, IN, GND, OUT. TLV71211DSER is functionally and physically interchangeable with TLV71209DSER, TLV71210DSER, etc., differing only in fixed output voltage (0.9 V, 1.0 V, 1.1 V). No PCB changes are needed when swapping within the DSE package variants, provided the output voltage meets system requirements.
TLV71211DSER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 6-WFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 55 µA
- Current - Supply (Max):
- 370 µA
- PSRR:
- 68dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WSON (1.5x1.5)
TLV71211DSER FAQ
1.How can I place an order for TLV71211DSER through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV71211DSER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV71211DSER reliable?
The price and inventory of TLV71211DSER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV71211DSER is usually 5 days.
3.What payment methods are accepted for TLV71211DSER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV71211DSER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV71211DSER?
TLV71211DSER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV71211DSER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV71211DSER?
For technical support, including TLV71211DSER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV71211DSER requirements.
6.How does Aetrix verify that TLV71211DSER is sourced from the original manufacturer or authorized distributors?
All TLV71211DSER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV71211DSER meets industry standards.
7.What is the process for return or replacement of TLV71211DSER?
All TLV71211DSER units undergo pre-shipment inspection (PSI). If there is an issue with TLV71211DSER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV71211DSER part is unused and in its original packaging.
Return procedure for TLV71211DSER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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