Texas Instruments TLV73310PDQNR

Overview

TLV73310PDQNR from Texas Instruments is a capacitor-free, 300-mA, low-dropout linear regulator (LDO) with 1.0-V fixed output, 125-mV dropout at 300 mA (3.3-V variant), ±1.4% output accuracy, and 34-µA quiescent current. It operates from 1.4 V to 5.5 V input and delivers stable regulation in space-constrained portable power rails for PMIC sub-regulation and battery-powered SoC core supplies.

For engineers reviewing the TLV73310PDQNR datasheet, TLV73310PDQNR pinout, TLV73310PDQNR application, or TLV73310PDQNR equivalent, key selection criteria include capacitor-free stability, active output discharge, foldback current limiting, thermal shutdown behavior, and X2SON package thermal performance under transient load conditions.

Technical Context

The TLV73310PDQNR uses a PMOS pass transistor architecture enabling ultra-low dropout and inherent reverse-current blocking. Its capacitor-free design eliminates mandatory external COUT while maintaining stability across –40°C to +125°C junction temperature, relying on internal compensation rather than external phase-margin tuning.

Functional modes include normal regulation, dropout operation (where VOUT = VIN – VDO), and disabled state with active 120-Ω pull-down on OUT. Enable threshold is VEN(HI) = 0.9 V (min), VEN(LO) = 0.35 V (max), with no internal EN pull-down-requiring external bias if EN is not driven.

Key Specifications

Pinout & Package

TLV73310PDQNR is housed in a 4-pin, 1.0-mm × 1.0-mm X2SON (DQN) package with exposed thermal pad electrically tied to GND. The package supports high-density PCB layouts and achieves R_θJA = 218.6°C/W for thermally constrained applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV73310PDBVR and MCP1700T-1002E/MB, TLV73310PDQNR uniquely combines capacitor-free stability, 300-mA capability, active discharge, and 1.0-mm² footprint-making it the sole option for miniaturized, high-transient, battery-critical designs.

Availability

TLV73310PDQNR is available at Aetrix Electronics and suitable for mobile baseband power, wearable sensor hubs, Bluetooth LE audio SoC cores, and industrial edge node PMIC sub-rails requiring stable component supply across production lifecycles.

Supply support for TLV73310PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs for portable and industrial applications.

The TLV733 series was designed specifically for space-constrained, battery-operated devices requiring capacitor-free LDOs with fast transient response, low IQ, and robust fault protection-targeting smartphones, wearables, and IoT edge nodes.

FAQ

What is the minimum input voltage required for TLV73310PDQNR to regulate 1.0 V?

The TLV73310PDQNR requires VIN ≥ 1.4 V per recommended operating conditions. However, due to undervoltage lockout (UVLO), regulation begins only when VIN exceeds ~1.3 V (rising threshold). Below that, the device remains disabled with active 120-Ω pull-down on OUT. For reliable 1.0-V output, maintain VIN ≥ 1.4 V.

Does TLV73310PDQNR require external capacitors to operate stably?

No-TLV73310PDQNR is explicitly designed for capacitor-free operation and remains stable with zero external input or output capacitors. A 1-µF ceramic capacitor on OUT is optional and improves load transient response but is not required for stability or basic regulation.

How does the foldback current limit behave in TLV73310PDQNR during a short circuit?

During output short, TLV73310PDQNR reduces current to ~150 mA (typical) as VOUT collapses-limiting power dissipation in the PMOS pass element. This foldback action prevents thermal runaway and works in tandem with thermal shutdown (160°C trip) to protect the device during sustained faults.

What is the purpose of the thermal pad on the TLV73310PDQNR X2SON package?

The exposed thermal pad on TLV73310PDQNR is electrically connected to GND and serves as the primary heat conduction path. Soldering it to a dedicated GND plane reduces R_θJB to 164.9°C/W, enabling reliable 300-mA operation at elevated ambient temperatures without exceeding 125°C max junction rating.

Can TLV73310PDQNR be used with an enable signal from a 1.8-V GPIO?

Yes-TLV73310PDQNR's EN pin has VEN(HI) = 0.9 V (min) and VEN(LO) = 0.35 V (max), making it fully compatible with 1.8-V CMOS logic. With only 0.01 µA input leakage, the EN pin imposes negligible load on the driving GPIO, eliminating need for external pull-up or level shifters.