Texas Instruments TLV73325PQDRVRQ1
- Part No.:
- TLV73325PQDRVRQ1
- Manufacturer:
- Texas Instruments
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
TLV73325PQDRVRQ1.pdf
- Description:
- IC REG LINEAR 2.5V 300MA 6WSON
- Quantity:
- Payment:

- Shipping:

Inventory:1,777
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLV73325PQDRVRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive-qualified, capacitor-free 300-mA low-dropout linear regulator delivering 2.5 V output with 125 mV dropout at 300 mA, ±1.4% output accuracy, and 34 µA quiescent current in a 2.0-mm × 2.0-mm WSON-6 package. It serves as a primary power rail for camera module image sensors and automotive infotainment SoCs requiring stable, low-noise, fast-transient 2.5-V bias.
For engineers reviewing the TLV73325PQDRVRQ1 datasheet, TLV73325PQDRVRQ1 pinout, TLV73325PQDRVRQ1 application, or TLV73325PQDRVRQ1 equivalent, key selection criteria include its capacitor-free stability, 150°C junction temperature rating, active output discharge, foldback current limiting, and compatibility with automotive-grade thermal and ESD requirements (HBM ±2 kV, CDM ±500 V).
Technical Context
The TLV73325PQDRVRQ1 employs a PMOS pass transistor architecture enabling ultra-low dropout and inherent reverse-current blocking. Its capacitor-free control loop eliminates mandatory external output capacitance while maintaining stability across –40°C to +150°C junction temperature.
Functional modes include normal regulation, dropout operation (with degraded transient response), and disabled state with active 120-Ω pulldown. UVLO (rising threshold 1.4 V) and thermal shutdown (trip at 160°C, reset at 140°C) provide robust fault protection aligned with automotive safety requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | Fixed 2.5 V - eliminates external feedback network; supports precision analog and digital rails requiring tight DC regulation. |
| Max output current | 300 mA - sufficient for powering dual-core MCU cores, ISP processors, or multi-lane MIPI receivers in compact automotive modules. |
| Dropout voltage | 125 mV at 300 mA (VOUT = 3.3 V); 290 mV at 300 mA (VOUT = 2.5 V) - enables operation from 2.79-V input at full load, critical for battery-sourced systems near end-of-discharge. |
| Accuracy | ±1.4% over –40°C to +150°C - ensures reliable logic-level compliance and ADC reference stability across full automotive temperature range. |
| Quiescent current | 34 µA - minimizes standby power loss in always-on domains such as rear-view camera wake-up circuits. |
| PSRR | 50 dB at 1 kHz - suppresses switching noise from upstream DC/DC converters, preserving signal integrity in image sensor analog chains. |
| Enable threshold | VEN(HI) = 0.9 V, VEN(LO) = 0.35 V - compatible with 1.8-V and 3.3-V GPIOs; supports direct microcontroller control without level-shifting. |
Pinout & Package
Package: 2.0-mm × 2.0-mm WSON-6 (DRV) with exposed thermal pad electrically connected to GND - enables high-power-density layout and efficient heat dissipation on 2-layer automotive PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT | Regulated output | Delivers 2.5 V to load; supports optional 1-µF ceramic capacitor for improved transient response; active pulldown engages when disabled. |
| IN | Input supply | Accepts 1.4 V–5.5 V; internal UVLO prevents erratic startup below 1.4 V; recommended 0.1–1 µF bypass to GND for PSRR enhancement. |
| GND | Ground reference | Common return path for IN, OUT, and EN; thermal pad must be soldered to GND plane for RθJA = 92.5°C/W performance. |
| EN | Enable control | Active-high logic input; no internal pullup/pulldown; requires external drive; enables fast startup (≤800 µs to 98% of 2.5 V). |
| NC (pins 2 & 5) | No internal connection | Unbonded die pads - must be left floating or tied to GND per layout best practice; no electrical function. |
Key Features
| Feature | Design Value |
|---|---|
| Capacitor-free operation | Stable without mandatory output capacitor - reduces BOM count, board area, and inrush current during cold-cranking events. |
| Foldback current limit | Reduces output current under short-circuit or overload (e.g., 170 mA typical at 3.3 V short) - limits power dissipation and prevents thermal runaway. |
| Active output discharge | 120-Ω pulldown resistor engages at shutdown - ensures rapid, controlled discharge of 2.5-V rail to meet automotive power sequencing timing requirements. |
| AEC-Q100 Grade 1 | Qualified for –40°C to +125°C ambient operation with 150°C max junction temperature - meets functional safety requirements for ADAS and infotainment ECUs. |
| High PSRR at low frequency | 50 dB at 1 kHz - effectively filters ripple from buck converter switching frequencies (e.g., 500 kHz fundamental harmonics) feeding downstream analog circuitry. |
Applications
| Camera Module Power | Automotive Infotainment SoC Core Rail |
|---|---|
Use Scenario: Powers CIS image sensor and ISP in rear-view or surround-view camera modules operating in engine bay or exterior mounting locations. IC Role / Device Role / Timing Role: Primary 2.5-V analog/digital supply with fast load transient response to pixel readout bursts and MIPI lane activation. Use Value: Capacitor-free design eliminates output cap size constraints in space-constrained camera housings; 150°C junction rating ensures reliability under hood temperatures. | Use Scenario: Supplies core voltage to application processors (e.g., TDA4VM, S32G) in head-unit or digital cluster systems with dynamic DVFS scaling. IC Role / Device Role / Timing Role: Low-noise, high-PSRR LDO decoupling rail for processor I/O and memory interfaces during burst-mode operation. Use Value: 34 µA IQ extends battery backup runtime during vehicle sleep mode; foldback current limit protects against SoC ESD latch-up faults. |
| Navigation System GNSS RF Front-End | Automotive Telematics LTE Modem Bias |
Use Scenario: Provides clean 2.5-V bias to low-noise amplifiers (LNAs) and downconverters in GPS/Galileo receiver front-ends. IC Role / Device Role / Timing Role: Ultra-low-noise, high-PSRR local regulator isolating sensitive RF circuitry from noisy digital power domains. Use Value: 120 µVRMS output noise and 50 dB PSRR at 1 kHz preserve GNSS signal SNR and acquisition sensitivity in electric vehicle EM environments. | Use Scenario: Supplies 2.5-V auxiliary rail to LTE modem baseband and RF transceiver ICs in telematics control units (TCUs). IC Role / Device Role / Timing Role: Enable-controlled power domain allowing modem deep-sleep entry/exit synchronized with cellular network handshakes. Use Value: Active discharge ensures compliant 2.5-V rail collapse within <5 ms upon network-initiated shutdown, meeting 3GPP power management timing specs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV73325PDBVRQ1 | SOT-23-5 package (2.9 mm × 1.6 mm); 5-pin; no NC pins; slightly higher RθJA (198.3°C/W) | Better suited for manual assembly or legacy footprints; lower thermal performance limits continuous 300-mA operation in sealed enclosures | Select when board space allows larger footprint and thermal margin is less constrained than in WSON-6 layouts. |
| TPS7B8125QDGNRQ1 | Higher IQ (65 µA); lower dropout (110 mV at 300 mA); integrated thermal foldback; 3.5-V min VIN | Requires ≥3.5-V input; better for 5-V bus-fed systems; not suitable for 2.7-V battery brownout conditions where TLV73325PQDRVRQ1 remains functional | Choose when input voltage stays above 3.5 V and enhanced thermal protection is prioritized over ultra-low IQ. |
Compared with TLV73325PDBVRQ1, the TLV73325PQDRVRQ1 offers superior thermal performance and smaller footprint; compared with TPS7B8125QDGNRQ1, it supports wider input range (1.4 V–5.5 V) and lower quiescent current but lacks integrated thermal foldback hysteresis.
Availability
TLV73325PQDRVRQ1 is available at Aetrix Electronics and suitable for automotive camera modules, infotainment head-units, and navigation systems requiring stable component supply with AEC-Q100 qualification and long-term production continuity.
Supply support for TLV73325PQDRVRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for automotive, industrial, and consumer markets.
The TLV733P-Q1 product line delivers ultra-small, capacitor-free LDOs optimized for space-constrained, battery-sensitive automotive subsystems including ADAS cameras, infotainment SoCs, and telematics modems.
FAQ
What is the minimum input voltage required for TLV73325PQDRVRQ1 to regulate 2.5 V at 300 mA?
The TLV73325PQDRVRQ1 requires a minimum input voltage of 2.79 V to maintain regulation at 300 mA load, calculated as VOUT + VDO = 2.5 V + 290 mV. Below this, the device enters dropout mode. Its UVLO rising threshold is 1.4 V, but regulation only begins once VIN exceeds the dropout-adjusted minimum.
Does TLV73325PQDRVRQ1 require an output capacitor to operate stably?
No, TLV73325PQDRVRQ1 is designed for capacitor-free operation and remains stable without any output capacitor. An optional 1-µF ceramic capacitor improves load transient response, especially for slew rates >0.1 A/µs, but is not required for basic regulation or startup.
How does the active output discharge function work in TLV73325PQDRVRQ1?
When TLV73325PQDRVRQ1 is disabled via the EN pin, an internal 120-Ω pulldown resistor connects the OUT pin to GND. Discharge time depends on output capacitance and parallel load resistance, following t = 120·RL/(120+RL)·COUT. This ensures rapid, controlled rail collapse for automotive power sequencing compliance.
What is the thermal shutdown behavior of TLV73325PQDRVRQ1?
TLV73325PQDRVRQ1 triggers thermal shutdown at ~160°C junction temperature and resets at ~140°C. During shutdown, the output is disabled and the 120-Ω pulldown engages. Cycling indicates excessive power dissipation; for reliable operation, keep TJ ≤ 150°C using the DRV package's 92.5°C/W RθJA with proper GND pad layout.
Is TLV73325PQDRVRQ1 compatible with 1.8-V microcontroller GPIOs driving the EN pin?
Yes. TLV73325PQDRVRQ1 has VEN(HI) = 0.9 V and VEN(LO) = 0.35 V, making it fully compatible with 1.8-V logic outputs. A 1.8-V GPIO high (≥1.8 V) exceeds VEN(HI) by >0.9 V margin, ensuring robust enable; no level shifter is needed.
TLV73325PQDRVRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 6-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.5V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.29V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 62 µA
- Current - Supply (Max):
- -
- PSRR:
- 68dB ~ 28dB (100Hz ~ 100kHz)
- Control Features:
- Enable
- Protection Features:
- Current Limit, Thermal Shutdown, UVLO
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WSON (2x2)
TLV73325PQDRVRQ1 FAQ
1.How can I place an order for TLV73325PQDRVRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV73325PQDRVRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV73325PQDRVRQ1 reliable?
The price and inventory of TLV73325PQDRVRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV73325PQDRVRQ1 is usually 5 days.
3.What payment methods are accepted for TLV73325PQDRVRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV73325PQDRVRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV73325PQDRVRQ1?
TLV73325PQDRVRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV73325PQDRVRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV73325PQDRVRQ1?
For technical support, including TLV73325PQDRVRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV73325PQDRVRQ1 requirements.
6.How does Aetrix verify that TLV73325PQDRVRQ1 is sourced from the original manufacturer or authorized distributors?
All TLV73325PQDRVRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV73325PQDRVRQ1 meets industry standards.
7.What is the process for return or replacement of TLV73325PQDRVRQ1?
All TLV73325PQDRVRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TLV73325PQDRVRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV73325PQDRVRQ1 part is unused and in its original packaging.
Return procedure for TLV73325PQDRVRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV73325PQDRVRQ1 Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
