Texas Instruments TLV74130PDQNR

Overview

TLV74130PDQNR from Texas Instruments is a 3.0-V fixed-output, 150-mA low-dropout linear regulator (LDO) with foldback current limit, active output discharge, and 1% output accuracy over –40°C to +125°C. It operates from 1.4 V to 5.5 V input, delivers 230 mV dropout at 150 mA, consumes only 50 µA quiescent current, and supports stable regulation with a 1-µF ceramic output capacitor - ideal for space-constrained battery-powered microcontroller power rails.

For engineers reviewing the TLV74130PDQNR datasheet, TLV74130PDQNR pinout, TLV74130PDQNR application, or TLV74130PDQNR equivalent, key selection criteria include its X2SON-4 package footprint, 120-Ω active pulldown on shutdown, foldback current limiting (40 mA short-circuit current), thermal shutdown at 158°C, and high PSRR of 65 dB at 1 kHz - all critical for portable RF and ultra-low-power embedded systems.

Technical Context

The TLV74130PDQNR uses a PMOS pass transistor enabling very low dropout and inherent reverse-voltage protection via its body diode. Its internal UVLO circuit disables output until VIN exceeds minimum operating voltage, while an active-high EN pin (0.9 V threshold) controls enable/disable with integrated 120-Ω pulldown for rapid output discharge.

It implements foldback current limiting: output current decreases as VOUT drops during overload, reducing power dissipation and delaying thermal shutdown. Thermal protection triggers at ~158°C and resets at ~140°C, enabling fault cycling only under sustained overload - not intended for continuous operation in thermal limit.

Key Specifications

Pinout & Package

TLV74130PDQNR is packaged in a 4-pin X2SON (DQN) with 1.0 mm × 1.0 mm body and exposed thermal pad electrically tied to GND - optimized for minimal PCB area and enhanced thermal performance in dense layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS82033DKE33 and TPS70630DBVR, TLV74130PDQNR uniquely combines 3.0 V accuracy, foldback current limiting, active discharge, and X2SON-4 footprint - making it the only option among the three that satisfies simultaneous requirements for compact size, fault resilience, and fast power-state transitions.

Availability

TLV74130PDQNR is available at Aetrix Electronics and suitable for wearable electronics, BLE peripherals, industrial sensor nodes, and low-power MSP430 subsystems requiring stable component supply with guaranteed long-term manufacturability.

Supply support for TLV74130PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with decades of expertise in power management IC design and manufacturing excellence.

The TLV741P family was engineered specifically for ultra-low-power, space-constrained portable applications - emphasizing low IQ, small-footprint packaging, and robust fault protection without sacrificing regulation accuracy or transient response.

FAQ

What is the output voltage tolerance of the TLV74130PDQNR over temperature?

The TLV74130PDQNR maintains ±1% output voltage accuracy across the full operating junction temperature range of –40°C to +125°C. This specification applies to the 3.0 V nominal output and is verified under recommended conditions (VIN = VOUT + 0.5 V, IOUT = 1 mA). At 25°C, typical deviation is tighter - within ±0.5% - supporting precision analog and RF subsystems without external trimming.

Does the TLV74130PDQNR require an input capacitor for stability?

No, the TLV74130PDQNR does not require an input capacitor for loop stability - its internal compensation works reliably with only the recommended 1-µF ceramic output capacitor. However, TI strongly recommends adding a 0.1–1 µF ceramic capacitor from IN to GND to improve PSRR, suppress input ripple, and mitigate source impedance effects - especially when powered from high-impedance sources like batteries or long PCB traces.

How does the foldback current limit function in the TLV74130PDQNR during a short circuit?

During output short-circuit, the TLV74130PDQNR reduces output current progressively as VOUT collapses - limiting peak current to ~40 mA (typical). This foldback behavior lowers power dissipation in the PMOS pass element compared to constant-current limiting, delaying thermal shutdown activation and enabling safer fault recovery. The device remains functional and resumes normal regulation once the fault is removed.

Can the TLV74130PDQNR be used with a 1.8-V enable signal?

Yes, the TLV74130PDQNR's EN pin has a guaranteed high-enable threshold of 0.9 V (min) and low-disable threshold of 0.4 V (max), making it fully compatible with 1.8-V GPIOs. With a 1.8-V logic high, EN sees >2× the minimum required voltage margin, ensuring robust noise immunity and reliable turn-on - no level-shifting circuitry is needed.

What is the purpose of the thermal pad on the TLV74130PDQNR X2SON package?

The exposed thermal pad on the TLV74130PDQNR's DQN package is electrically connected to GND and must be soldered to the PCB ground plane. Doing so achieves R_θJB = 174.7°C/W - significantly lowering junction-to-board thermal resistance versus using only the four perimeter pins. This thermal path is essential to maintain safe junction temperatures under 150 mA load at elevated ambient conditions and prevents premature thermal shutdown.