Texas Instruments TLV74312PDQNR3
- Part No.:
- TLV74312PDQNR3
- Manufacturer:
- Texas Instruments
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
TLV74312PDQNR3.pdf
- Description:
- 300MA LOW-IQ LOW-DROPOUT (LDO) V
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLV74312PDQNR3 from Texas Instruments is a 300-mA, 1.2-V fixed-output low-dropout linear regulator (LDO) in a 4-pin X2SON package (1.0 mm × 1.0 mm), featuring 125 mV dropout at 300 mA, ±1.4% output accuracy over –40°C to +125°C, and 34 µA quiescent current - optimized for space-constrained battery-powered applications such as camera modules and smartphone PMIC rails.
For engineers reviewing the TLV74312PDQNR3 datasheet, TLV74312PDQNR3 pinout, TLV74312PDQNR3 application, or TLV74312PDQNR3 equivalent, key selection criteria include ultra-low quiescent current, stable operation with only 1-µF ceramic output capacitance, active output discharge, foldback current limiting, and thermal shutdown protection - all critical for portable, low-power embedded power management.
Technical Context
The TLV74312PDQNR3 uses a PMOS pass transistor architecture enabling ultra-low dropout and inherent reverse-current blocking. Its internal undervoltage lockout (UVLO) engages below 1.25 V (falling) and releases above 1.3 V (rising), preventing erratic startup under weak input sources.
Functional modes include normal regulation, dropout operation (where VOUT = VIN – VDO), and disabled state with active 120-Ω pulldown resistor discharging the output. Thermal shutdown triggers at ~160°C and resets at ~140°C, with foldback current limiting reducing output current as VOUT collapses during overload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±1.4% over –40°C to +125°C - ensures stable core voltage for low-voltage logic and sensors. |
| Max Output Current | 300 mA continuous - supports moderate-power peripherals without external boost stages. |
| Dropout Voltage | 125 mV at 300 mA (TJ ≤85°C) - enables regulation from 1.325 V input, extending battery runtime in single-cell Li-ion/Li-poly systems. |
| Quiescent Current | 34 µA typical - minimizes no-load power loss in always-on subsystems like real-time clocks or wake-up controllers. |
| PSRR | 50 dB at 1 kHz - suppresses switching noise from upstream DC/DC converters feeding sensitive analog or RF circuitry. |
| Output Capacitor | Stable with ≥1 µF ceramic - eliminates need for bulky tantalum or electrolytic capacitors, reducing board area and cost. |
| Enable Threshold | VEN(HI) = 0.9 V, VEN(LO) = 0.35 V - compatible with 1.8-V and 3.3-V GPIOs without level-shifting. |
| Thermal Shutdown | Triggers at 160°C, resets at 140°C - provides self-protecting operation under sustained overload or poor PCB thermal design. |
Pinout & Package
TLV74312PDQNR3 is housed in a 4-pin X2SON (DQN) package measuring 1.00 mm × 1.00 mm with an exposed thermal pad electrically connected to GND - requiring solder connection to PCB ground plane for optimal thermal performance (RθJB = 164.9°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OUT) | Regulated output | Delivers stable 1.2 V; requires ≥1 µF ceramic capacitor to GND for stability and transient response. |
| 2 (GND) | Ground reference | Common return path for IN, OUT, and EN; thermal pad must be soldered to GND plane for thermal reliability. |
| 3 (EN) | Active-high enable | Drives high (>0.9 V) to activate regulator; drives low (<0.35 V) to disable with active 120-Ω pulldown. |
| 4 (IN) | Input supply | Accepts 1.4 V–5.5 V; UVLO prevents operation below 1.25 V to avoid undefined behavior. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small X2SON package | 1.0 mm × 1.0 mm footprint with thermal pad - enables placement in tight spaces like camera modules and wearable sensor nodes. |
| Active output discharge | 120-Ω internal pulldown activated during shutdown - ensures rapid, controlled VOUT decay to prevent latch-up or sequencing issues in multi-rail systems. |
| Foldback current limit | Reduces output current as VOUT drops (e.g., short-circuit), limiting power dissipation and enabling safe recovery without external current-sense circuitry. |
| Low-noise regulation | 120 µVRMS output noise (10 Hz–100 kHz) - suitable for powering ADC references, PLLs, and other noise-sensitive analog blocks. |
| Wide input range | 1.4 V–5.5 V operation - supports direct connection to single-cell Li-ion (2.7–4.2 V), USB (5 V), or boosted coin-cell supplies. |
Applications
| Smartphone Camera Module | Wearable Health Sensor Node |
|---|---|
|
Use Scenario: Powers image signal processor (ISP) core logic and analog front-end in compact mobile camera assemblies. IC Role / Device Role / Timing Role: Primary 1.2-V LDO delivering clean, low-noise bias for CMOS image sensors and ISP digital cores. Use Value: 125 mV dropout extends usable battery voltage down to 1.325 V, while 34 µA IQ preserves standby time between photo captures. |
Use Scenario: Supplies 1.2-V rail to ultra-low-power microcontroller and biometric analog front-end in hearables or fitness trackers. IC Role / Device Role / Timing Role: Always-on LDO maintaining regulated voltage during deep-sleep states with minimal leakage. Use Value: Active output discharge ensures fast reset of sensor interface upon wake-up, eliminating residual charge-induced measurement errors. |
| Industrial IoT Edge Node | Tablet SoC Core Rail |
|
Use Scenario: Provides 1.2-V supply to ARM Cortex-M4/M7 MCU cores operating in harsh ambient temperatures (–40°C to +85°C). IC Role / Device Role / Timing Role: High-accuracy, thermally robust LDO supporting deterministic real-time execution under variable load and temperature. Use Value: ±1.4% accuracy and thermal shutdown (160°C) ensure reliable operation across extended industrial temperature ranges without derating. |
Use Scenario: Delivers 1.2-V core voltage to application processors in thin-and-light tablets with strict board-area constraints. IC Role / Device Role / Timing Role: Compact, high-PSRR LDO filtering ripple from intermediate DC/DC converter outputs. Use Value: 50 dB PSRR at 1 kHz suppresses switching noise from buck converters, preventing digital noise coupling into processor clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLS850F0TESK | 500-mA output, 200-mV dropout at 500 mA, integrated watchdog timer, automotive AEC-Q100 qualified | Targeted for automotive body electronics; larger SOT-23-6 package (2.9 mm × 2.8 mm) | Select when functional safety monitoring or higher current is required; not drop-in due to pin count and package size. |
| TPS7A0512PDQNR | 200-mA output, 170-mV dropout at 200 mA, 25 µA IQ, same X2SON-4 package | Lower current capability and slightly higher dropout; optimized for ultra-low-power sub-100 µA systems | Choose for lower-quiescent applications where 200 mA suffices; pin-compatible but requires validation of load transient response. |
Compared with TLS850F0TESK and TPS7A0512PDQNR, TLV74312PDQNR3 delivers the best balance of 300-mA capability, 125-mV dropout, and 1.0-mm² footprint - making it ideal for consumer portable designs where space, efficiency, and cost are tightly coupled.
Availability
TLV74312PDQNR3 is available at Aetrix Electronics and suitable for smartphone camera modules, wearable health sensors, industrial IoT edge nodes, and tablet SoC core rails requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TLV74312PDQNR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and consumer markets.
The TLV743P family was engineered for ultra-low-power, space-constrained portable electronics - delivering high accuracy, low dropout, and active discharge in sub-1-mm² packages to extend battery life and simplify power architecture.
FAQ
What is the maximum input voltage rating for TLV74312PDQNR3?
The absolute maximum input voltage for TLV74312PDQNR3 is 6 V, but recommended operating range is 1.4 V to 5.5 V. Exceeding 6 V risks permanent damage per Absolute Maximum Ratings. Operation above 5.5 V may cause excessive power dissipation or violate thermal limits, especially in the compact X2SON package.
Does TLV74312PDQNR3 require an input capacitor?
Yes, TLV74312PDQNR3 requires a small ceramic input capacitor (typically 1 µF) from IN to GND to suppress high-frequency noise and stabilize the input source impedance. While not strictly mandatory for basic regulation, omission increases susceptibility to line transients and may degrade PSRR performance in noisy environments.
Can TLV74312PDQNR3 be used without connecting the thermal pad?
No - the exposed thermal pad on TLV74312PDQNR3 is electrically connected to GND and must be soldered to a PCB ground plane. Omitting this connection degrades thermal resistance by >100°C/W, significantly increasing junction temperature and risking premature thermal shutdown or reduced reliability under 300-mA load.
What happens to the output when TLV74312PDQNR3 is disabled via EN?
When TLV74312PDQNR3 is disabled (EN < 0.35 V), its internal 120-Ω pulldown resistor actively discharges the output node to GND. Discharge time depends on output capacitance and parallel load resistance; for example, with 1 µF COUT and no external load, VOUT falls to <10% in ~1.2 ms.
Is TLV74312PDQNR3 compatible with ceramic capacitors smaller than 1 µF?
No - TI specifies stable operation only with ≥1 µF ceramic output capacitance (X5R/X7R). Using smaller values (e.g., 0.47 µF) risks instability, oscillation, or degraded load transient response, as confirmed in the "Stability Requirements" section of the SBVS310C datasheet.
TLV74312PDQNR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.45V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 68dB ~ 28dB (100Hz ~ 100kHz)
- Control Features:
- Current Limit, Enable
- Protection Features:
- Over Current, Over Temperature, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-X2SON (1x1)
TLV74312PDQNR3 FAQ
1.How can I place an order for TLV74312PDQNR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV74312PDQNR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV74312PDQNR3 reliable?
The price and inventory of TLV74312PDQNR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV74312PDQNR3 is usually 5 days.
3.What payment methods are accepted for TLV74312PDQNR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV74312PDQNR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV74312PDQNR3?
TLV74312PDQNR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV74312PDQNR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV74312PDQNR3?
For technical support, including TLV74312PDQNR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV74312PDQNR3 requirements.
6.How does Aetrix verify that TLV74312PDQNR3 is sourced from the original manufacturer or authorized distributors?
All TLV74312PDQNR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV74312PDQNR3 meets industry standards.
7.What is the process for return or replacement of TLV74312PDQNR3?
All TLV74312PDQNR3 units undergo pre-shipment inspection (PSI). If there is an issue with TLV74312PDQNR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV74312PDQNR3 part is unused and in its original packaging.
Return procedure for TLV74312PDQNR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLV74312PDQNR3 Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

