Texas Instruments TLV74325PDQNR

Overview

TLV74325PDQNR from Texas Instruments is a 300-mA, low-dropout linear regulator (LDO) with fixed 2.5 V output, 125 mV dropout at 300 mA, ±1.4% output accuracy over –40°C to +125°C, and 34 µA quiescent current. It operates from 1.4 V to 5.5 V input and supports stable regulation with only a 1-µF ceramic output capacitor-enabling compact power delivery in battery-powered portable electronics.

For engineers reviewing the TLV74325PDQNR datasheet, TLV74325PDQNR pinout, TLV74325PDQNR application, or TLV74325PDQNR equivalent, key selection criteria include ultra-low IQ for extended battery life, active output discharge for fast rail shutdown, foldback current limiting for short-circuit robustness, and X2SON-4 package compatibility with high-density PCB layouts.

Technical Context

The TLV74325PDQNR uses a PMOS pass transistor architecture enabling low dropout and inherent reverse-current blocking. Its undervoltage lockout (UVLO) engages below 1.25 V (falling) and releases above 1.3 V (rising), preventing erratic startup behavior during brownout conditions.

Functional modes include normal regulation, dropout operation (where VOUT = VIN – VDO), and disabled state with active 120-Ω pulldown resistor discharging the output. Thermal shutdown activates at ~160°C and resets at ~140°C, providing cyclic protection against sustained overload.

Key Specifications

Pinout & Package

X2SON-4 (DQN) package: 1.00 mm × 1.00 mm body, 0.5 mm pitch, exposed thermal pad electrically connected to GND. Optimized for space-constrained portable designs with high thermal performance via PCB copper pour under thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS850F25T and MCP1700T-2502E/MB, TLV74325PDQNR delivers optimal balance of low dropout (125 mV), ultra-low IQ (34 µA), active discharge, and miniature X2SON-4 footprint-making it ideal for space- and battery-constrained consumer portable designs where all three features are simultaneously required.

Availability

TLV74325PDQNR is available at Aetrix Electronics and suitable for smartphone camera modules, wearable sensor hubs, USB-C peripheral interfaces, and industrial handheld terminals requiring stable component supply with consistent parametric performance across temperature and load.

Supply support for TLV74325PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs for portable, industrial, and automotive markets.

The TLV743P family was designed specifically for ultra-low-power, space-constrained portable electronics-emphasizing minimal quiescent current, small-footprint packaging, and robust protection features without sacrificing regulation accuracy or transient response.

FAQ

What is the minimum input voltage required for TLV74325PDQNR to regulate 2.5 V at 300 mA?

The TLV74325PDQNR requires an input voltage ≥2.625 V to maintain regulation at 300 mA, based on its 125 mV dropout specification. Below this, the device enters dropout mode where VOUT = VIN – VDO, and regulation accuracy degrades. Input must also exceed the UVLO rising threshold of 1.3 V to enable operation.

Does TLV74325PDQNR support active output discharge, and how does it function?

Yes, TLV74325PDQNR includes an internal 120 Ω pulldown resistor that connects OUT to GND when the device is disabled (EN < 0.35 V). This actively discharges output capacitance, preventing floating voltages and ensuring predictable power-down sequencing in systems like camera modules or wearables.

Can TLV74325PDQNR operate with a 0.47 µF output capacitor?

No-TI specifies stable operation only with ≥1 µF ceramic output capacitance. Using 0.47 µF may cause instability, excessive ringing, or poor load transient response. The 1 µF minimum ensures adequate phase margin and meets the design requirements validated in the TLV74325PDQNR datasheet.

What is the thermal performance difference between TLV74325PDQNR in X2SON-4 versus SOT-23 packages?

In the X2SON-4 (DQN) package, TLV74325PDQNR achieves RθJB = 164.9°C/W; in SOT-23 (DBV), it is 55.8°C/W. The SOT-23 offers superior board-level thermal resistance due to larger pad area, but X2SON-4 provides 66% smaller footprint. Thermal design must account for this trade-off using appropriate PCB copper pour and layer stackup.

How does the foldback current limit behave during a short-circuit event on TLV74325PDQNR?

During output short-circuit, TLV74325PDQNR reduces current to ~150–170 mA (depending on nominal VOUT) instead of sustaining 300 mA. This foldback action lowers power dissipation, delaying thermal shutdown. If the fault persists, the device cycles between current limit and thermal shutdown (trip at 160°C, reset at 140°C) to prevent damage.