Texas Instruments TLV74328PDQNR1

Overview

TLV74328PDQNR1 from Texas Instruments is a 2.8-V fixed-output, 300-mA low-dropout linear regulator (LDO) in a 4-pin X2SON package (1.0 mm × 1.0 mm), featuring 125 mV dropout at 300 mA, ±1.4% output accuracy over –40°C to +125°C, 34 µA quiescent current, and active output discharge via 120-Ω pulldown. It powers core logic rails in space-constrained portable electronics requiring stable low-noise bias.

For engineers reviewing the TLV74328PDQNR1 datasheet, TLV74328PDQNR1 pinout, TLV74328PDQNR1 application, or TLV74328PDQNR1 equivalent, key selection criteria include dropout performance at full load, thermal behavior in ultra-small packages, EN pin threshold stability across temperature, foldback current limit response during short-circuit events, and compatibility with 1-µF ceramic output capacitors without external compensation.

Technical Context

The TLV74328PDQNR1 uses a PMOS pass transistor architecture enabling ultra-low dropout and inherent reverse-current blocking. Its internal bandgap reference and error amplifier deliver tight DC regulation while supporting fast line/load transient response-critical for powering digital cores during burst-mode operation.

Functional modes include normal regulation, dropout (triode-region pass device), and disabled state with active pulldown. UVLO (1.25 V falling / 1.3 V rising) prevents erratic startup; thermal shutdown (160°C trip / 140°C reset) provides cyclic protection under sustained overload, and foldback current limiting reduces power dissipation during output shorts.

Key Specifications

Pinout & Package

The TLV74328PDQNR1 is housed in a 4-pin X2SON package (DQN) with 1.0 mm × 1.0 mm body size and exposed thermal pad electrically connected to GND. The thermal pad must be soldered to a PCB ground plane for optimal thermal performance (R_θJB = 164.9°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS850F2BTTA1 and MCP1703T-2802E/MB, the TLV74328PDQNR1 uniquely balances ultra-small size, active discharge, foldback protection, and 300-mA capability-making it optimal for space-limited, battery-operated portable designs requiring robust fault handling without safety overhead.

Availability

TLV74328PDQNR1 is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor hubs, industrial IoT edge nodes, and USB-C peripheral interfaces requiring stable component supply across high-volume production and prototyping phases.

Supply support for TLV74328PDQNR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs for portable, industrial, and automotive markets.

The TLV743P family-including TLV74328PDQNR1-is designed for ultra-compact, low-quiescent-current LDO applications in battery-powered consumer electronics where minimal footprint, fast transient response, and robust fault protection are essential.

FAQ

What is the maximum input voltage rating for the TLV74328PDQNR1?

The TLV74328PDQNR1 has an absolute maximum input voltage of 6 V, but its recommended operating range is 1.4 V to 5.5 V. Operation above 5.5 V risks permanent damage, and input voltages below 1.4 V may trigger undervoltage lockout (UVLO), preventing regulation. For reliable 2.8-V output, VIN must exceed 2.925 V (2.8 V + 125 mV dropout) under full 300-mA load at TJ ≤ 85°C. Always refer to the thermal derating curves in the TLV74328PDQNR1 datasheet when operating near voltage or current limits.

Does the TLV74328PDQNR1 require an external pull-up resistor on the EN pin?

No, the TLV74328PDQNR1 does not include an internal pull-up or pull-down on the EN pin. If enable functionality is unused, TI recommends connecting EN directly to IN to ensure reliable turn-on. Adding an external pull-up is unnecessary and may interfere with controlled sequencing. The EN pin draws only 0.01 µA at 5.5 V, so drive strength requirements are minimal-standard CMOS GPIOs fully satisfy the 0.9 V high / 0.35 V low thresholds across temperature.

Can the TLV74328PDQNR1 safely drive a 1-µF ceramic output capacitor?

Yes-the TLV74328PDQNR1 is explicitly designed and characterized for stable operation with a minimum 1-µF ceramic output capacitor, eliminating the need for larger electrolytic or tantalum types. This is enabled by its internal compensation and PMOS pass structure. Using a 1-µF X7R/X5R ceramic placed within 2 mm of the OUT and GND pins ensures optimal transient response and meets all stability criteria across –40°C to +125°C. Larger values improve ripple suppression but are not required for stability.

How does the foldback current limit behave in the TLV74328PDQNR1 during a short circuit?

During a short circuit, the TLV74328PDQNR1 reduces output current as V_OUT collapses-e.g., delivering ~150 mA at 0 V (shorted) instead of sustaining 300 mA. This foldback action lowers power dissipation in the PMOS pass device, delaying thermal shutdown. Once junction temperature reaches ~160°C, the device shuts down; it auto-restarts at ~140°C if the fault persists. This protects the TLV74328PDQNR1 from destructive overheating while maintaining visibility of the fault condition.

Is the thermal pad of the TLV74328PDQNR1 electrically connected, and how should it be handled on the PCB?

Yes-the exposed thermal pad on the TLV74328PDQNR1's X2SON package is electrically connected to GND. It must be soldered to a dedicated PCB ground plane using at least 4 thermal vias (0.3-mm diameter, spaced evenly) beneath the pad. Failure to connect the pad degrades thermal resistance by >100°C/W, risking premature thermal shutdown under 300-mA load. TI's layout guidelines specify a minimum 1.0 mm × 1.0 mm copper pour tied directly to the main ground plane for reliable operation at full rated current.