Texas Instruments TLV75530PDQNR

Overview

TLV75530PDQNR from Texas Instruments is a 3.0V fixed-output, 500mA low-dropout linear regulator in X2SON-4 (DQN) package. It operates from 1.45V to 5.5V input, delivers ±1.2% output accuracy over −40°C to +85°C, features 25μA typical quiescent current, and maintains stability with only 1µF ceramic output capacitor - ideal for space-constrained battery-powered microcontroller core supplies.

For engineers reviewing the TLV75530PDQNR datasheet, TLV75530PDQNR pinout, TLV75530PDQNR application, or TLV75530PDQNR equivalent, key selection criteria include dropout voltage at full load (≤238mV @ 500mA), active output discharge behavior, foldback current limiting, thermal shutdown (165°C), and compatibility with low-ESR ceramic capacitors without external compensation.

Technical Context

The TLV75530PDQNR uses a PMOS pass transistor architecture enabling ultra-low dropout and high PSRR (46dB @ 100kHz). Its internal bandgap reference and error amplifier deliver tight regulation across temperature and line/load variations, while integrated UVLO (1.21–1.44V) prevents erratic startup under marginal input conditions.

Functional modes include normal regulation, dropout tracking, and active-shutdown with 120Ω pulldown resistor. The device implements foldback current limiting that reduces output current as VOUT collapses during short-circuit events, minimizing thermal stress and enabling safe recovery after fault clearance.

Key Specifications

Pinout & Package

TLV75530PDQNR is housed in a 1mm × 1mm X2SON-4 (DQN) package with wettable flank leads for automated optical inspection. Thermal pad is internally connected to GND and must be soldered to a PCB ground plane for optimal thermal performance (R_θJA = 168.4°C/W per JEDEC).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC75530PDQNR and MCP1755-3002E/DB, TLV75530PDQNR provides superior integration of soft-start, active discharge, and foldback limiting in a 1mm² package - reducing external component count and improving reliability in space- and safety-critical designs.

Availability

TLV75530PDQNR is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, smart home hub processors, and automotive body control units requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance.

Supply support for TLV75530PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of LDO design expertise and broad automotive, industrial, and consumer qualification.

The TLV755P series was engineered for ultra-small, low-I_Q power management in battery-operated and space-constrained systems - targeting modern MCUs, wearables, and edge-sensing devices demanding high accuracy and minimal standby loss.

FAQ

What is the maximum dropout voltage specification for TLV75530PDQNR at full 500mA load?

The maximum dropout voltage for TLV75530PDQNR is 238mV at 500mA output current, measured at T_J = −40°C to +85°C and V_OUT = 3.0V. This value applies specifically to the DYD (thermally enhanced SOT-23-5) variant per datasheet Table 5.5; however, the DQN package (TLV75530PDQNR) shares identical electrical characterization for dropout under the same test conditions, confirmed in the "Electrical Characteristics" section of SBVS320D Rev. September 2024.

Does TLV75530PDQNR require an external pull-up resistor on the EN pin?

No, TLV75530PDQNR does not require an external pull-up resistor on the EN pin. It features an internal pulldown resistor (120Ω) that ensures defined shutdown state when EN is left floating or driven low. The EN pin draws only ≤10nA leakage current when pulled high, making it compatible with direct connection to 1.8V or 3.3V GPIOs without additional biasing components.

Can TLV75530PDQNR operate with a 0.47µF output capacitor?

TLV75530PDQNR is specified to be stable with ≥1µF ceramic output capacitance. While the absolute minimum recommended value is 0.47µF (per footnote in Section 4), TI's characterization and layout guidance require ≥1µF for guaranteed phase margin and transient performance across temperature and process variation. Using 0.47µF risks instability and is not supported for production use.

What thermal resistance values apply to TLV75530PDQNR in its X2SON-4 (DQN) package?

For TLV75530PDQNR in the DQN package, JEDEC-standard R_θJA is 168.4°C/W, ψ_JB is 101.4°C/W, and ψ_JT is 5.6°C/W. These values assume a 2-layer JEDEC PCB (2s2p, no thermal vias). On a typical production board with a 200mm² GND pour under the thermal pad, actual R_θJA improves to approximately 100–120°C/W depending on copper weight and via count.

Is TLV75530PDQNR qualified for automotive applications?

TLV75530PDQNR is not AEC-Q100 qualified. It is rated for industrial temperature range (−40°C to +125°C junction), but lacks automotive-specific stress testing, failure analysis reporting, and PPAP documentation. For automotive body control units, TI recommends the pin-compatible AEC-Q100–qualified TLV75730PDQNR variant instead of TLV75530PDQNR.