Texas Instruments TLV75715PDBVR

Overview

TLV75715PDBVR from Texas Instruments is a 1A, low-quiescent-current (25μA typical), fixed 1.5V output LDO regulator in SOT-23-5 (DBV) package. It operates from 1.45V to 5.5V input, delivers ±1% output accuracy, supports 1µF ceramic output capacitance, and features active output discharge and built-in soft-start - ideal for powering MCU core rails in portable battery-powered systems.

For engineers reviewing the TLV75715PDBVR datasheet, TLV75715PDBVR pinout, TLV75715PDBVR application, or TLV75715PDBVR equivalent, key selection criteria include dropout voltage at 1A (max 425mV @ 3.3VOUT), thermal resistance (RθJA = 100.8°C/W for DBV), EN pin logic thresholds (VHI = 1V, VLO = 0.3V), and foldback current limiting behavior under short-circuit conditions.

Technical Context

The TLV75715PDBVR uses a PMOS pass transistor architecture enabling ultra-low dropout and high PSRR (46dB @ 100kHz). Its internal bandgap reference and error amplifier deliver 1% output accuracy across –40°C to +125°C, with undervoltage lockout (UVLO) activating below 1.21V and hysteresis of 40mV.

Functional modes include normal regulation (VIN ≥ VOUT + VDO), dropout (VIN < VOUT + VDO, output tracks input), and disabled state (EN < VLO), where an internal 120Ω pulldown actively discharges the output. Thermal shutdown triggers at 165°C with 10°C hysteresis.

Key Specifications

Pinout & Package

SOT-23-5 (DBV) package: 2.9mm × 2.8mm body, no thermal pad, standard lead pitch. Designed for compact PCB layouts with minimal thermal relief requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV75715PDBVR, TPS7A0515PDBVR offers identical voltage and package but lacks 1A capability and foldback protection, while TPL7407LPGQ integrates unrelated driver functionality - neither provides drop-in replacement for 1A 1.5V core regulation.

Availability

TLV75715PDBVR is available at Aetrix Electronics and suitable for portable medical devices, USB-C accessories, industrial sensor nodes, and white goods control boards requiring stable component supply and long-term production continuity.

Supply support for TLV75715PDBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of LDO design expertise and broad automotive/industrial qualification.

The TLV757P family targets space-constrained, battery-sensitive applications needing high accuracy, low IQ, and robust fault protection - specifically engineered for next-generation MCU, sensor, and portable electronics power rails.

FAQ

What is the maximum dropout voltage specification for TLV75715PDBVR at 1A output current?

The maximum dropout voltage for TLV75715PDBVR is 425mV at 1A output current and 3.3VOUT, per datasheet Section 5.5. For its nominal 1.5V output, the max dropout is 1075mV at –40°C to +85°C (DYD package), but the DBV package used in TLV75715PDBVR has a max of 1125mV under same conditions. This defines the minimum required VIN for regulation: ≥2.625V at full load and room temperature.

Does TLV75715PDBVR require an external pull-up resistor on the EN pin?

No, TLV75715PDBVR does not require an external pull-up on EN. It features an internal pull-down (120Ω) to ensure default-disabled state. The EN pin is active-high with VHI = 1V and VLO = 0.3V, making it directly compatible with 1.8V or 3.3V GPIO without external components - unless system-level fail-safe behavior mandates forced high during power-up.

Can TLV75715PDBVR operate stably with a 0.47µF output capacitor?

TLV75715PDBVR is specified stable with ≥1µF ceramic output capacitance. While the absolute minimum effective capacitance at the pin must exceed 0.47µF (accounting for DC bias derating), using only 0.47µF violates the recommended operating condition and risks instability, especially under load transients. TI explicitly recommends ≥1µF X5R/X7R ceramics for guaranteed performance.

What thermal resistance value applies to TLV75715PDBVR in its SOT-23-5 (DBV) package?

TLV75715PDBVR in DBV package has RθJA = 100.8°C/W (JEDEC standard PCB) and 100.8°C/W (EVM layout), per Section 5.4. This value assumes standard 2-layer PCB with no thermal vias or copper pour. Real-world thermal performance improves significantly with proper GND plane connection and thermal relief - actual board-level RθJA may reach ~65°C/W with optimized layout.

How does the foldback current limit behave in TLV75715PDBVR during a short-circuit event?

In TLV75715PDBVR, foldback current limiting reduces output current as VOUT falls below 0.6V (0.4×1.5V). At full short (VOUT ≈ 0V), it delivers ~755mA typical short-circuit current (ISC), lowering power dissipation versus constant-current limiting. This mitigates thermal runaway and delays thermal shutdown activation, allowing brief fault tolerance before protection engages.