Texas Instruments TLV75719PDRVR

Overview

TLV75719PDRVR from Texas Instruments is a 1A, low-quiescent-current (25μA typical), fixed 1.9V output LDO regulator in a 2mm × 2mm WSON-6 (DRV) package with exposed thermal pad. It operates from 1.45V to 5.5V input, delivers ±1% output accuracy over –40°C to +125°C, and maintains regulation with only 1µF ceramic output capacitance - enabling compact power delivery for MCU core rails and portable electronics.

For engineers reviewing the TLV75719PDRVR datasheet, TLV75719PDRVR pinout, TLV75719PDRVR application, or TLV75719PDRVR equivalent, key selection considerations include its 425mV max dropout at 1A (3.3VOUT), active output discharge, foldback current limit, and thermal pad–enabled 64.3°C/W RθJB for high-power-density designs.

Technical Context

The TLV75719PDRVR uses a PMOS pass transistor architecture enabling ultra-low dropout and fast transient response. Its internal bandgap reference and error amplifier deliver 1% output accuracy across temperature and load, while integrated UVLO (1.21–1.44V) and thermal shutdown (165°C trip) ensure robust operation in varying supply conditions.

It features an active-high enable pin with 1V VHI threshold and 0.3V VLO, supporting controlled power sequencing. The built-in soft-start ensures monotonic VOUT rise and limits inrush current, and the active pulldown resistor (95Ω) discharges the output within microseconds upon shutdown - critical for multi-rail systems requiring known power-down states.

Key Specifications

Pinout & Package

TLV75719PDRVR is housed in a 2mm × 2mm WSON-6 (DRV) package with an exposed thermal pad internally connected to GND. The pad must be soldered to a large-area ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A0519PDQNR, TLV75719PDRVR delivers 5× higher output current and superior thermal performance via its exposed pad, while TPL7407LPGQ serves entirely different switching functions - neither offers drop-in compatibility, but both address adjacent low-power system needs.

Availability

TLV75719PDRVR is available at Aetrix Electronics and suitable for portable electronics, camera modules, USB peripherals, and industrial sensor nodes requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for TLV75719PDRVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of LDO design expertise and broad automotive, industrial, and consumer qualification.

The TLV757P family was engineered for space-constrained, battery-sensitive applications demanding high efficiency, low noise, and robust protection - targeting next-generation portable, imaging, and edge-sensing systems.

FAQ

What is the maximum output current capability of the TLV75719PDRVR?

The TLV75719PDRVR is rated for 1A continuous output current under recommended operating conditions (TJ ≤ 125°C, VIN ≥ VOUT + VDO). Its foldback current limit and thermal shutdown protect against overload, but sustained 1A operation requires proper PCB thermal design - including connection of the DRV package's thermal pad to a solid ground plane per TI's layout guidelines.

Does the TLV75719PDRVR require an external pull-up on the EN pin?

No, the TLV75719PDRVR does not require an external pull-up on the EN pin. It features an internal pull-down (120Ω) that ensures default disable state when EN is left floating. To enable the device, drive EN to ≥1V; to disable, drive it to ≤0.3V. For always-on operation, connect EN directly to IN - no external components needed.

Can the TLV75719PDRVR operate with a 0.47µF output capacitor?

The TLV75719PDRVR is specified stable with ≥1µF ceramic output capacitance. While 0.47µF meets the *minimum effective* capacitance requirement after derating (per datasheet note), TI guarantees stability only with ≥1µF. Using 0.47µF risks degraded transient response and potential instability - especially under fast load steps - so 1µF or greater is strongly recommended for production designs.

What is the purpose of the two NC pins on the TLV75719PDRVR DRV package?

Pins 2 and 5 on the TLV75719PDRVR's WSON-6 (DRV) package are No-Connect (NC) terminals - they have no internal bond wire or circuit connection. These pins must remain unconnected and un-routed on the PCB. Neither should be used for thermal relief, mechanical anchoring, nor grounding, as doing so may compromise package integrity or cause unintended electrical coupling.

How does the TLV75719PDRVR handle short-circuit conditions?

Under short-circuit, the TLV75719PDRVR activates its foldback current limit, reducing output current to ~755mA (ISC) as VOUT collapses. This limits power dissipation in the PMOS pass transistor. If thermal limits are exceeded, the device enters thermal shutdown at 165°C, cycles off until cooling to ~155°C, then attempts restart - providing fault containment without latch-up or damage under intermittent shorts.