Texas Instruments TLV75730PDYDR

Overview

TLV75730PDYDR from Texas Instruments is a 1A, low-quiescent-current (25μA typical), fixed 3.0V output LDO regulator in a thermally enhanced SOT-23-5 (DYD) package with exposed thermal pad. It operates from 1.45V to 5.5V input, delivers ≤1% output accuracy, supports stable operation with only 1µF ceramic output capacitance, and features active output discharge and built-in soft-start - ideal for powering MCU core rails and portable battery-powered systems.

For engineers reviewing the TLV75730PDYDR datasheet, TLV75730PDYDR pinout, TLV75730PDYDR application, or TLV75730PDYDR equivalent, key selection criteria include its 425mV max dropout at 1A (3.3VOUT), 60.3°C/W R_θJA thermal resistance in DYD package, foldback current limiting, and enable-controlled shutdown with 10nA enable pin current.

Technical Context

The TLV75730PDYDR uses a PMOS pass transistor architecture enabling ultra-low dropout and high PSRR (46dB at 100kHz). Its internal bandgap reference and error amplifier deliver ±1% output accuracy across –40°C to +125°C, while integrated UVLO (1.21–1.44V threshold) and thermal shutdown (165°C trip) ensure robust system-level protection.

Functional modes include normal regulation (VIN ≥ VOUT + V_DO, EN > V_HI), dropout (VIN < VOUT + V_DO), and disabled state (EN < V_LO), with active pulldown via 120Ω internal resistor during shutdown to rapidly discharge output capacitance.

Key Specifications

Pinout & Package

TLV75730PDYDR is housed in a 5-pin SOT-23 package with exposed thermal pad (DYD), measuring 2.9mm × 1.6mm. The thermal pad must be soldered to a large-area ground plane for optimal thermal performance (R_θJA = 60.3°C/W on EVM).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLC75730DBVR and MCP1826-3002E/DB, TLV75730PDYDR provides the lowest thermal resistance, smallest required output capacitance, and unique active discharge - making it the optimal choice for thermally demanding, battery-sensitive, or fast-sequencing applications.

Availability

TLV75730PDYDR is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, smart home hub processors, and automotive infotainment displays requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TLV75730PDYDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and consumer markets.

The TLV757P family was engineered to deliver ultra-low IQ, small-footprint LDO regulation for battery-powered and space-constrained electronics - with TLV75730PDYDR optimized for 3.0V core and I/O rail applications demanding high thermal efficiency.

FAQ

What is the maximum dropout voltage specification for TLV75730PDYDR at 1A load?

The maximum dropout voltage for TLV75730PDYDR is 450mV at 1A load and 3.3V–5.0V output range, measured across –40°C to +125°C. At 3.3VOUT specifically, the datasheet specifies 425mV maximum. This value reflects worst-case conditions including temperature, process variation, and load - ensuring reliable regulation even under marginal input voltage conditions. TLV75730PDYDR maintains this performance due to its PMOS pass element and optimized internal biasing.

Does TLV75730PDYDR require an external pull-up resistor on the EN pin?

No, TLV75730PDYDR does not require an external pull-up resistor on the EN pin. It features an internal pull-down (120Ω) but no internal pull-up. To ensure reliable startup, EN must be driven above 1V (V_HI) by an external source such as a microcontroller GPIO or power supervisor. If EN is left floating, the device remains disabled. TLV75730PDYDR's 10nA EN pin current enables direct connection to low-drive-strength logic without loading concerns.

Can TLV75730PDYDR operate with a 0.47µF output capacitor?

TLV75730PDYDR is specified to be stable with ≥1µF ceramic output capacitance. While 0.47µF meets the *minimum effective* capacitance requirement after derating (per datasheet note: "nominal derating on these capacitors is 50%"), TI recommends using ≥1µF to guarantee stability across all operating conditions, including temperature, voltage, and aging effects. Using 0.47µF risks marginal phase margin and potential oscillation - TLV75730PDYDR's design intent assumes ≥1µF for robust performance.

What is the purpose of the NC pin (Pin 4) on TLV75730PDYDR?

Pin 4 on TLV75730PDYDR is a no-connect (NC) terminal with no internal bond wire or circuit connection. It must remain unconnected in the PCB layout - neither tied to GND nor left floating in a way that creates parasitic coupling. TI's mechanical drawings confirm this pin is unused; routing traces or copper pours to it may introduce noise or thermal asymmetry. TLV75730PDYDR's functionality is fully defined by Pins 1 (IN), 2 (GND), 3 (EN), and 5 (OUT); Pin 4 serves only as a mechanical placeholder.

How does the foldback current limit behave in TLV75730PDYDR during a short-circuit event?

In TLV75730PDYDR, the foldback current limit reduces output current as V_OUT drops below 0.4×V_OUT(NOM) (i.e., below ~1.2V for 3.0V output). During a hard short, it delivers ~755mA (typical ISC), significantly lower than the 1A nominal rating - minimizing power dissipation [(VIN – 0V) × ISC] and delaying thermal shutdown. This behavior is confirmed in Figure 5-27 and Section 6.3.3. TLV75730PDYDR's foldback protects both itself and downstream circuitry more effectively than brick-wall limiting alone.