Texas Instruments TLV77033PDQNR

Overview

TLV77033PDQNR from Texas Instruments is a 50mA, fixed 3.3V output low-dropout linear regulator in a 1mm × 1mm X2SON-4 package, featuring 55dB PSRR at 1MHz, 45mV dropout at 50mA, and ±2% output voltage accuracy over –40°C to +125°C. It delivers high power-supply rejection for noise-sensitive analog and RF circuitry in space-constrained portable electronics.

For engineers reviewing the TLV77033PDQNR datasheet, TLV77033PDQNR pinout, TLV77033PDQNR application, or TLV77033PDQNR equivalent, key selection criteria include its active output pulldown (135Ω), 320µs startup time, thermal shutdown at 160°C, and compatibility with 0.47–40µF ceramic output capacitors without external compensation.

Technical Context

The TLV77033PDQNR employs a CMOS pass transistor architecture with internal soft-start and brick-wall current limiting (80–210mA). Its error amplifier and bandgap reference enable stable regulation across 1.4V–5.5V input while maintaining 90µV_RMS output noise (10Hz–100kHz) and <0.1%/V line regulation.

Functional modes are controlled via the EN pin (VEN(HI) = 0.9V, VEN(LOW) = 0.3V), enabling precise sequencing. The integrated active discharge circuit pulls OUT to GND during disable, ensuring known power-down states-critical for multi-rail systems requiring controlled voltage collapse.

Key Specifications

Pinout & Package

TLV77033PDQNR uses the DQN package: 1mm × 1mm, 4-pin X2SON with exposed thermal pad (pin 5). The package enables ultra-compact PCB layouts and enhanced thermal performance when the thermal pad is soldered to a ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPL71033PDQNR and MCP1700T-3302E/MB, TLV77033PDQNR uniquely balances ultra-small size, precise 50mA capability, active discharge, and high-frequency PSRR-making it optimal for noise-sensitive, space-constrained, and sequenced power domains.

Availability

TLV77033PDQNR is available at Aetrix Electronics and suitable for smartphone camera modules, gaming console audio subsystems, industrial IoT sensor nodes, automotive infotainment displays, and streaming media player power management requiring stable component supply and long-term lifecycle support.

Supply support for TLV77033PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management, signal chain, and high-reliability components.

The TLV770 series was designed specifically for portable and space-constrained applications demanding high PSRR, low dropout, and ultra-small packaging-targeting camera modules, wearables, and multi-rail consumer electronics.

FAQ

What is the maximum output current supported by TLV77033PDQNR?

TLV77033PDQNR delivers up to 50mA of continuous output current under recommended operating conditions (TJ ≤ 125°C, VIN ≥ VOUT + VDO). Its brick-wall current limit activates between 80mA and 210mA, protecting against short-circuit faults. For sustained 50mA operation in the 1mm × 1mm X2SON package, proper PCB thermal design-including soldering the thermal pad to a ground plane-is essential to maintain junction temperature within limits.

Does TLV77033PDQNR require an input capacitor for stability?

No, TLV77033PDQNR does not require an input capacitor for stability, but a minimum 1µF ceramic capacitor is strongly recommended between IN and GND. This capacitor reduces source impedance effects, improves transient response to input voltage changes, and enhances PSRR-especially critical when powered from noisy switchers or high-impedance sources. Placement within 2mm of the IN and GND pins is mandatory for optimal performance.

How does the active pulldown feature function in TLV77033PDQNR?

When the EN pin voltage falls below 0.3V, TLV77033PDQNR disables regulation and activates an internal 135Ω MOSFET pulldown between OUT and GND. This rapidly discharges output capacitance-ensuring the output reaches near-zero volts within microseconds. This behavior eliminates floating states during power-down, prevents unintended device wake-up, and satisfies strict sequencing requirements in multi-voltage systems.

Can TLV77033PDQNR operate with a 1.8V input supply?

Yes, TLV77033PDQNR supports input voltages from 1.4V to 5.5V, so a 1.8V supply is valid. However, at 1.8V input and 3.3V output, the device cannot regulate-since VIN < VOUT-and enters dropout mode. In this state, output voltage tracks input minus dropout loss, resulting in ~1.755V output (1.8V − 45mV). Regulation only occurs when VIN ≥ 3.345V (3.3V + 45mV).

What thermal considerations apply to TLV77033PDQNR in the DQN package?

TLV77033PDQNR in the DQN package has a junction-to-board thermal resistance (R_θJB) of 180.8°C/W. To sustain 50mA at +125°C ambient, the thermal pad must be soldered to a ≥100mm² copper ground plane with ≥4 thermal vias (0.3mm diameter). Without this, junction temperature rise could exceed safe limits, triggering thermal shutdown at 160°C and causing intermittent operation.