Texas Instruments TLV77112PDQNR

Overview

TLV77112PDQNR from Texas Instruments is a 150mA, fixed 1.2V output low-dropout linear regulator in a 1mm × 1mm X2SON-4 package. It delivers high PSRR (55dB at 1MHz), operates from 1.4V to 5.5V input, achieves ±2% output accuracy, and maintains regulation with only 113mV dropout at full load - ideal for powering core logic or I/O rails in space-constrained portable electronics.

For engineers reviewing the TLV77112PDQNR datasheet, TLV77112PDQNR pinout, TLV77112PDQNR application, or TLV77112PDQNR equivalent, key selection criteria include its active output pulldown, foldback current limiting, thermal shutdown behavior, and compatibility with 0.47–40µF ceramic output capacitors without external compensation.

Technical Context

The TLV77112PDQNR uses a CMOS pass transistor architecture enabling ultra-low dropout voltage and high PSRR across 100kHz–1MHz frequencies. Its internal soft-start prevents inrush current, while the enable-controlled active pulldown resistor ensures rapid, predictable output discharge during shutdown.

It operates over –40°C to +125°C junction temperature and supports stable regulation with ≥0.47µF ceramic output capacitance. The device features hybrid brick-wall/foldback current limiting (ICL = 200–460mA, ISC = 42mA typical) and thermal shutdown with 20°C hysteresis (trip at 160°C, reset at 140°C).

Key Specifications

Pinout & Package

TLV77112PDQNR is housed in a 1mm × 1mm, 4-pin X2SON (DQN) package with exposed thermal pad. This ultra-compact footprint targets high-density PCB layouts in smartphones, wearables, and camera modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV77112PDQNR, TPL720F12PDBVR offers identical current rating but sacrifices pulldown functionality and increases quiescent draw, while MCP1700T-1202E/TT trades enable control and PSRR for lower cost and higher current - neither matches the TLV77112PDQNR's combination of ultra-small X2SON footprint, active discharge, and high-frequency noise rejection.

Availability

TLV77112PDQNR is available at Aetrix Electronics and suitable for smartphone power management, camera module regulation, and IoT sensor node design requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV77112PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of LDO design expertise and broad automotive, industrial, and consumer qualification.

The TLV771 family was engineered for space-constrained, noise-sensitive portable electronics - delivering high PSRR, low dropout, and integrated discharge in sub-1mm² packages without compromising thermal robustness or accuracy.

FAQ

What is the maximum input voltage for TLV77112PDQNR?

The absolute maximum input voltage for TLV77112PDQNR is 6.5V, but the recommended operating range is 1.4V to 5.5V. Exceeding 5.5V risks violating safe operating area limits and may trigger thermal shutdown or degrade long-term reliability. Always maintain VIN ≤ 5.5V in normal operation.

Does TLV77112PDQNR require an input capacitor?

TLV77112PDQNR does not require an input capacitor for stability, but a 1µF ceramic capacitor is strongly recommended between IN and GND. This reduces source impedance, improves PSRR, and mitigates ringing caused by PCB trace inductance - especially critical during load transients in high-speed digital systems powered by TLV77112PDQNR.

What is the purpose of the thermal pad on TLV77112PDQNR?

The thermal pad on TLV77112PDQNR must be soldered to a GND-connected copper plane to achieve R_θJB = 180.8°C/W. It is not electrically functional beyond thermal conduction - connecting it to any voltage other than GND violates the datasheet and risks device failure. Thermal vias around (not under) the pad enhance heat transfer to inner layers.

Can TLV77112PDQNR be used with output capacitance below 0.47µF?

No - TLV77112PDQNR requires a minimum effective output capacitance of 0.47µF for guaranteed stability. Derating due to voltage/temperature effects means nominal capacitors must be ≥1µF (X7R/X5R) to ensure ≥0.47µF effective value. Using smaller values risks oscillation, poor transient response, or startup failure.

How does the foldback current limit behave in TLV77112PDQNR during a short circuit?

During a short circuit, TLV77112PDQNR initially delivers ~42mA (ISC) while V_OUT collapses. As voltage drops below the foldback threshold (~0.6V), current scales back further - reducing power dissipation and preventing immediate thermal shutdown. This protects both the LDO and downstream circuitry during sustained fault conditions without requiring external current-sense components.