Texas Instruments TLV77118PDQNR

Overview

TLV77118PDQNR from Texas Instruments is a 150mA, fixed 1.8V output low-dropout linear regulator in a 1mm × 1mm X2SON-4 package. It delivers high PSRR (55dB at 1MHz), operates from 1.4V to 5.5V input, maintains ±2% output accuracy over temperature, and achieves 113mV dropout at 150mA - enabling compact, noise-sensitive power rails in portable electronics.

For engineers reviewing the TLV77118PDQNR datasheet, TLV77118PDQNR pinout, TLV77118PDQNR application, or TLV77118PDQNR equivalent, key selection criteria include its active output pulldown (135Ω), foldback current limiting, −40°C to +125°C junction operation, and stability with 0.47µF–40µF ceramic output capacitors.

Technical Context

The TLV77118PDQNR uses a CMOS pass transistor architecture with internal soft-start and an active discharge MOSFET tied between OUT and GND during disable. Its error amplifier and bandgap reference enable tight regulation under fast load transients while maintaining high PSRR across 100kHz–1MHz.

Functional modes are controlled via the EN pin (VEN(HI) ≥ 0.9V, VEN(LOW) ≤ 0.3V), supporting precise system-level power sequencing. Thermal shutdown (160°C trip, 140°C reset) and foldback current limit (ICL = 200–460mA, ISC = 42mA typical) provide robust fault protection without external components.

Key Specifications

Pinout & Package

TLV77118PDQNR is housed in a 1mm × 1mm, 4-pin X2SON (DQN) package with exposed thermal pad. The package supports high-density PCB layouts and efficient heat dissipation when the thermal pad is soldered to a ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV77118PDQNR, MCP1703T-1802E/MB trades higher dropout and no active discharge for lower quiescent current, while TPL7407LPWPR serves entirely different load-driving functions - neither matches TLV77118PDQNR's combination of miniature X2SON size, 113mV dropout, 55dB PSRR, and guaranteed 135Ω output pulldown.

Availability

TLV77118PDQNR is available at Aetrix Electronics and suitable for smartphone camera modules, gaming console audio subsystems, and industrial IoT sensor nodes requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV77118PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and consumer markets.

The TLV771 series targets space-constrained, noise-sensitive portable electronics - delivering high PSRR, low dropout, and active discharge in sub-1mm² packages for next-generation mobile and edge devices.

FAQ

What is the maximum input voltage rating for TLV77118PDQNR?

The absolute maximum input voltage for TLV77118PDQNR is 6.5V, but recommended operating conditions specify VIN ≤ 5.5V. Exceeding 5.5V risks violating thermal limits and may trigger internal protection circuits. For reliable operation in production, maintain VIN between 1.4V and 5.5V as defined in the Recommended Operating Conditions table of the official datasheet.

Does TLV77118PDQNR require an input capacitor for stability?

No, TLV77118PDQNR does not require an input capacitor for stability, but a minimum 1µF ceramic capacitor is recommended between IN and GND to counteract source impedance and improve transient response. This capacitor must be placed as close as possible to the IN and GND pins to minimize inductance and ensure optimal PSRR and line regulation performance.

What is the purpose of the thermal pad on the TLV77118PDQNR DQN package?

The thermal pad on TLV77118PDQNR serves as the primary thermal conduction path from the die to the PCB. It must be connected to a large-area GND plane using multiple thermal vias to achieve the specified RθJB of 180.8°C/W. Leaving it unconnected or connecting it to any potential other than GND compromises thermal performance and risks exceeding the 125°C maximum junction temperature.

How does the foldback current limit behave during a short-circuit event on TLV77118PDQNR?

During a short-circuit event, TLV77118PDQNR transitions from brick-wall current limiting (200–460mA) to foldback mode when VOUT drops below VFOLDBACK. Output current scales downward as VOUT approaches GND, limiting power dissipation and preventing thermal runaway. Typical short-circuit current is 42mA, significantly lower than the initial limit - this behavior is documented in the Electrical Characteristics table and Figure 6-1 of the datasheet.

Can TLV77118PDQNR be used with output capacitors larger than 1µF?

Yes, TLV77118PDQNR is stable with output capacitance up to 40µF, as confirmed in the Recommended Operating Conditions table. Larger capacitors improve load transient response but increase inrush current during startup - which may trigger current limiting if COUT exceeds 10µF without careful sequencing. Always verify effective capacitance (derated for voltage/temperature) remains ≥0.47µF for guaranteed stability.